A device including an optoelectric circuit that is configured to provide galvanic isolation between a first circuit and a second circuit is disclosed. The optoelectric circuit includes at least one non-inverting buffer and a metal semiconductor diode. The at least one non-inverting buffer is positioned between a collector of a phototransistor and an anode of a light emitting diode. The metal semiconductor diode is positioned between the collector of the phototransistor and the at least one non-inverting buffer.

A data diode provides a flexible device for collecting data from a data source and transmitting the data to a data destination using one-way data transmission across a main channel. On-board processing elements allow the data diode to identify automatically the type of connectivity provided to the data diode and configure the data diode to handle the identified type of connectivity. Either or both of the inbound and outbound side of the data diode may comprise one or both of wired and wireless communication interfaces. A secure reverse channel, separate from the main channel, allows carefully predetermined communications from the data destination to the data source.

A data diode provides a flexible device for collecting data from a data source and transmitting the data to a data destination using one-way data transmission across a main channel. On-board processing elements allow the data diode to identify automatically the type of connectivity provided to the data diode and configure the data diode to handle the identified type of connectivity. Either or both of the inbound and outbound side of the data diode may comprise one or both of wired and wireless communication interfaces. A secure reverse channel, separate from the main channel, allows carefully predetermined communications from the data destination to the data source.

An optical coupling device includes a light receiving element including a first output terminal and a second output terminal, a light emitting element provided on the light receiving element, a first switching element, a first electrode plate, and a sealing member. The first switching element includes a first main terminal connected to the first output terminal, a first control terminal connected to the second output terminal, and a second main terminal. An upper surface of the first electrode plate is connected to the second main terminal. The sealing member covers the light receiving element, the light emitting element, and the first switching element. A lower surface of the first electrode plate is exposed on a lower surface of the sealing member. The lower surface of the first electrode plate and the lower surface of the sealing member form the same plane.

A wireless sensor network gateway includes safe side circuitry, hazardous side circuitry and isolation circuitry, which are supported by a housing. The safe side circuitry includes a safe side power circuit, and a safe side data input/output (I/O) circuit. The hazardous side circuitry includes a hazardous side power circuit, and a hazardous side data I/O circuit. The isolation circuitry divides the safe side circuitry from the hazardous side circuitry. The isolation circuitry includes a power isolation circuit that couples the safe side power circuit to the hazardous side power circuit and forms an intrinsic safety barrier between the safe side power circuit and the hazardous side power circuit, and a data isolation circuit that couples the safe side data I/O circuit to the hazardous side data I/O circuit and forms an intrinsic safety barrier between the safe side data I/O circuit and the hazardous side data I/O circuit.

A wireless sensor network gateway includes safe side circuitry, hazardous side circuitry and isolation circuitry, which are supported by a housing. The safe side circuitry includes a safe side power circuit, and a safe side data input/output (I/O) circuit. The hazardous side circuitry includes a hazardous side power circuit, and a hazardous side data I/O circuit. The isolation circuitry divides the safe side circuitry from the hazardous side circuitry. The isolation circuitry includes a power isolation circuit that couples the safe side power circuit to the hazardous side power circuit and forms an intrinsic safety barrier between the safe side power circuit and the hazardous side power circuit, and a data isolation circuit that couples the safe side data I/O circuit to the hazardous side data I/O circuit and forms an intrinsic safety barrier between the safe side data I/O circuit and the hazardous side data I/O circuit.

An opto-coupler includes a housing having end walls configured to have high-voltage (HV) input and output conductors protruding therethrough. The opto-coupler also includes at least one light emitting diode (LED) mounted to the housing and configured to activate the HV diode to pass electrical current by emitting light toward the HV diode. At least one press-fit end cap is configured to provide a press-fit seal either between the HV input conductor and the input end wall or between the HV output conductor and the output end wall. The press-fit end cap is configured to protect the LED from damage by shaping an electric field between the HV input or output conductor and the LED. Embodiments enable compact opto-coupler sizes with high-voltage ratings, such as 8 kV or 15 kV. Electrical current transfer ratios may be much higher than in existing opto-couplers.

Isolators having a back-to-back configuration for providing electrical isolation between two circuits are described, in which multiple isolators formed on a single, monolithic substrate are connected in series to achieve a higher amount of electrical isolation for a single substrate than for isolators formed on separate substrates connected in series. Discrete dielectric regions positioned between isolator components forming an isolator provide electrical isolation between the isolator components as well as between the isolators formed on the substrate. The back-to-back isolator may provide one or more communication channels for transfer of information and/or power between different circuits.

A semiconductor device includes light-emitting elements, a selection circuit, a control circuit, light-receiving elements, and switch elements. The selection circuit is configured to accept one input signal and output a signal for selecting an element to emit light among the light-emitting elements. The control circuit is configured to control the light-emitting elements, based on the signal outputted from the selection circuit. The light-receiving elements are each configured to receive light of each of the light-emitting elements and generate a signal for driving a switch, based on a light-receiving state. The switch elements are each configured to be driven by application of voltage outputted from each of the light-emitting elements.

A signal isolation system includes an external device; and a signal isolation circuit, coupled to the external device, including a control circuit, configured to operate the signal isolation circuit in an input mode or an output mode according to a status of the external device; a digital input/output circuit, configured to input/output signal based on the input mode or the output mode determined by the control circuit; and an input/output port, coupled to the digital input/output circuit, configured to be an input port or an output port according to the input mode or the output mode determined by the control circuit.