An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

To provide a high-density optical interconnect device, information processing device and data transmission method which are able to suppress limitations caused by the widening of light beams and the size of lenses. An optical interconnect unit includes a plurality of first lenses and a plurality of second lenses corresponding to a plurality of light-emitting element groups, and a plurality of light beams emitted from the plurality of light-emitting element groups pass through plurality of first lenses and the plurality of second lenses. The optical interconnect unit also includes a plurality of third lenses and a plurality of fourth lenses, and light beam groups pass through any one of the plurality of third lenses and the plurality of fourth lenses, and are focused by any one of a plurality of light-receiving element groups that include a plurality of light-receiving elements.

A wireless connector includes a plurality of printed circuit boards (PCBs) (901, 902) disposed within a housing of the electronic system. Each PCB comprises a plurality of transceivers (910a, 910b, 920a, 920b) configured to wirelessly transmit and receive modulated carrier signals (910, 920). Each transceiver in the system is configured to receive signals transmitted by every other transceiver in the system.

A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits that modulate data, communicate data, and serialize/deserialize data, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and a top surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit. Furthermore, a bottom surface of the optical integrated circuit faces the top surface of the interposer, and the front surface of the optical integrated circuit is optically coupled to an optical-fiber receptacle, which in turn is optically coupled to an optical-fiber connector.

Provided is a high-speed optical transmission-reception apparatus including a digital-signal processing circuit and optical modulation and optical reception modules, in which a flexible printed circuit is used as a high-frequency interface for the optical modulation and optical reception modules, a mechanism for connecting the high-frequency line pattern to the flexible printed circuit is provided on a package substrate of the digital-signal processing circuit, and the package substrate and the optical modulation and optical reception modules are connected by the flexible printed circuit.

Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments provide photonic interposers that use photonic tiles, where each tile includes programmable photonic circuits that can be programmed based on the needs of a particular computer architecture. Some tiles are instantiations of a common template tile that are stitched together in a 1D or a 2D arrangement. Some embodiments described herein provide a programmable physical network designed to connect pairs of tiles together with photonic links.

An optical data transmission device for providing optical signals containing information data between avionics systems in an aircraft. A fixed optical transceiver array at a first side of a slip ring is in optical communication with a revolving optical transceiver array positioned at a second side of the slip ring. A set of mirrors coated with dielectric material are positioned at the central axis of the slip ring and configured to maintain optical communication between the optical transceiver arrays. The first mirror is fixed at the first side of the slip ring. The second mirror positioned at the second side of the slip ring rotates in concert with the second transceiver array. The mirrors are formed of a material allowing optical signals to be reflected by the mirrors while concurrently allowing a laser beam of an external system to pass through the mirrors and maintain travel along a linear axis.

An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links. The communication links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.

A method for connecting adjacent computing board devices. A source computing board may be provided. An optical engine attaches to the source computing board. A plurality of source optical connectors couples to the optical engine. A first optical connector may be positioned at a location on the source computing board for a first preset type of computing component on an adjacent computing board. A second optical connector may be positioned at a fixed coordinate related to the first optical connector on the source computing board.