The invention relates to a disconnectable connector portion for forming a socket or a plug of the connector, said connector allowing relative rotation between the socket and the plug once they are connected, said portion comprising at least optical means for contactless optical transmission in the connector, said optical means being insensitive to the relative rotation.

The invention relates to a contacting module (1) by means of which the individual electrical and optical inputs and outputs (A.sub.oC) of optoelectronic chips (2) are connected to the device-specific electrical and optical inputs and outputs of a test apparatus. It is characterized by a comparatively high adjustment insensitivity of the optical contacts between the chips (2) and the contacting module (1), which is achieved, for example, by technical measures which result in the optical inputs (E.sub.oK) of the chip (2) or on the contacting module (1) being irradiated in every possible adjustment position by the optical signal (S.sub.o) to be coupled in.

Provided is a high-speed optical transmission-reception apparatus including a digital-signal processing circuit and optical modulation and optical reception modules, in which a flexible printed circuit is used as a high-frequency interface for the optical modulation and optical reception modules, a mechanism for connecting the high-frequency line pattern to the flexible printed circuit is provided on a package substrate of the digital-signal processing circuit, and the package substrate and the optical modulation and optical reception modules are connected by the flexible printed circuit.

MicroLEDs may be used in providing intra-chip optical communications and/or inter-chip optical communications, for example within a multi-chip module or semiconductor package containing multiple integrated circuit semiconductor chips. In some embodiments the integrated circuit semiconductor chips may be distributed across different shelves in a rack. The optical interconnections may make use of optical couplings, for example in the form of lens(es) and/or mirrors. In some embodiments arrays of microLEDs and arrays of photodetectors are used in providing parallel links, which in some embodiments are duplex links.

A lighting system comprises an excitor which drives at least one reactor. The reactor is an under-damped resonant circuit that includes a network of lighting elements in a reactive string and reactive components distributed among the lighting elements. These reactive components can regulate individual lighting elements. The lighting elements emit an AC luminous waveform which comprises a first phase and a second phase. Selected lighting elements can be modulated by a datastream. The modulated light moves through free-space to a receiving device.

For optical communications between semiconductor ICs, optical transceiver assembly subsystems may be integrated with a processor. The optical transceiver assembly subsystems may be monolithically integrated with processor ICs or they may be provided in separate optical transceiver ICs coupled to or attached to the processor ICs.

A control system includes a plurality of subscriber devices of a communications network, these subscriber devices communicating with one another by optical signals. A subscriber device includes two opposing faces, an optical shutter controllable between an at least partially transparent state and an opaque state, the optical shutter traversing a part of the subscriber device between the two opposing faces; a control circuit configured for controlling the controllable optical shutter; an optical signal emitter on a first of the two opposing faces, disposed in such a manner as to allow the emission of optical signals toward a first neighboring subscriber device; and an optical signal receiver on a second of the two opposing faces, disposed in such a manner as to allow optical signals to be received that originate from a second neighboring subscriber device.

In described examples, an integrated circuit includes a leadframe structure, which includes electrical conductors. A first coil structure is electrically connected to a first pair of the electrical conductors of the leadframe structure. The first coil structure is partially formed on a semiconductor die structure. A second coil structure is electrically connected to a second pair of the electrical conductors of the leadframe structure. The second coil structure is partially formed on the semiconductor die structure. A molded package structure encloses portions of the leadframe structure. The molded package structure exposes portions of the first and second pairs of the electrical conductors to allow external connection to the first and second coil structures. The molded package structure includes a cavity to magnetically couple portions of the first and second coil structures.

An apparatus and method for computer network security based on Free-Space Optical Interconnections (FSOI) for board-to-board information transmission. The addition of a controllable, interlocked shutter system creates air-gapped isolation of the boards, allowing for increased obfuscation, and enhanced security.

A ferrule-less optical interconnect includes electrical communications assembly having a receptacle disposed in a housing, the receptacle adapted to mate with an electrical connector to produce a free space gap, and active optical communications components disposed in the housing and adapted to process a free space optical beam traveling along a first optical beam path through the free space gap. The free space optical beam has a substantially parallel shape and Gaussian power density distribution. Active optical components may include a light source and a collimator adapted to produce the free space optical beam. Active optical components may include a condenser adapted to receive the free space optical beam and produce a focused optical beam signal for reception by a sensor. A hole is disposed in the housing along the first optical beam path providing free space passageway between the active optical communications components and the free space gap.