Patent classifications
H04L25/0266
Communication Barrier Arrangement and Method for its Operation
A communication barrier arrangement includes a first driver having a first interface for receiving signals from a first device destined for a second device, an isolation barrier including a first transformer for signal transfer and having a primary winding connected to the first driver and a secondary winding, a second driver connected to the secondary winding and having a first connection terminal for output of the signals towards the second device, a first signal conditioner having a second connection terminal for receiving the signals from the second driver and a second interface for delivering them to the second device and a protection circuit including a resistor in parallel with a first capacitor, the protection circuit being connected between the first and second connection terminals.
Driver of ethernet transmitter and control method therefor
Disclosed is a driver of an ethernet transmitter and a control method therefor. The driver has a first output port and a second output port connected to an ethernet receiver through a transmission line, and comprises: a signal conversion module for converting differential current signals into a first voltage signal and a second voltage signal; a first driving module adjusting a swing of the first voltage signal, to obtain a first output signal having a voltage equal to the first voltage signal; a second driving module adjusting a swing of the second voltage signal, to obtain a second output signal having a voltage equal to the second voltage signal. An architecture having a relatively small area is realized, and the ethernet transmitter meets the requirement on a large output swing in 10BASE-T mode.
TRANSFORMER DESIGN WITH BALANCED INTERWINDING CAPACITANCE FOR IMPROVED EMI PERFORMANCE
An electronic device includes a multilevel lamination structure having a core layer, dielectric layers and conductive features formed in metal layers on or between respective ones or pairs of the dielectric layers. The core layer and the dielectric layers extend in respective planes of orthogonal first and second directions and are stacked along an orthogonal third direction. The conductive features include a first patterned conductive feature having multiple conductive turns in each of a first pair of the metal layers to form a first winding having a first turn and a final turn adjacent to one another in the same metal layer of the first pair, and a second patterned conductive feature having multiple conductive turns in a second pair of the metal layers to form a second winding having a first turn and a final turn.
DEVICES, SYSTEMS, AND METHODS FOR SERIAL COMMUNICATION OVER A GALVANICALLY ISOLATED CHANNEL
Devices, systems, and methods for serial communication over a galvanically isolated channel are disclosed. A device includes a first IC device interface, first TO components connected to the first IC device interface, a second IC device interface, second IO components connected to the second IC device interface, an insulator layer having a first major surface and a second major surface, at least one pair of capacitor plates and corresponding interconnection paths on the first major surface, and at least one pair of capacitor plates and corresponding interconnection paths on the second major surface, wherein the at least one pair of capacitor plates on the first major surface of the insulator layer are aligned with the at least one pair of capacitor plates on the second major surface of the insulator layer to form at least one pair of capacitors.
Low power receiver circuit for isolated data communications
Data isolators are described. The data isolators include a differential receiver having cross-coupled single-ended amplifiers. The single-ended amplifiers may be referenced to a time-varying reference potential. The cross-coupling of the single-ended amplifiers may provide high speed, low power consumption operation of the data isolator.
Isolation amplifier with reference signal transfer
Isolated circuit systems are provided. The systems include a primary side circuit and a secondary circuit, electrically isolated from each other. The primary side and secondary side circuits each utilize a direct current (DC) reference signal. The primary side circuit may use the DC reference signal in a modulation operation. The secondary side circuit may use the DC reference signal in a demodulation operation. The DC reference signal may be sent from the primary side circuit to the secondary side circuit, or from the secondary side circuit to the primary side circuit.
SYSTEM AND METHOD FOR SHARING CIRCUITRY BETWEEN TRANSMIT AND RECEIVE PATH
A transceiver circuit includes transmit circuitry comprising a transmit baseband filter and a driver amplifier having an output coupled to a power amplifier, receive circuitry comprising a low noise amplifier and a receive baseband filter, mixer circuitry and a magnetic circuit, wherein the mixer circuitry and the magnetic circuit are coupled between the transmit baseband filter and the driver amplifier, and are further coupled between the low noise amplifier and the receive baseband filter, wherein the mixer circuitry and the magnetic circuit are shared between the transmit circuitry and the receive circuitry in a time division duplexing (TDD) communication system.
Wire bonding between isolation capacitors for multichip modules
A packaged multichip device includes a first IC die with an isolation capacitor utilizing a top metal layer as its top plate and a lower metal layer as its bottom plate. A second IC die has a second isolation capacitor utilizing its top metal layer as its top plate and a lower metal layer as its bottom plate. A first bondwire end is coupled to one top plate and a second bondwire end is coupled to the other top plate. The second bondwire end includes a stitch bond including a wire approach angle not normal to the top plate it is bonded to and is placed so that the stitch bond's center is positioned at least 5% further from an edge of this top plate on a bondwire crossover side compared to a distance of the stitch bond's center from the side opposite the bondwire crossover side.
Transmission device, interface, and transmission method
In a transmission device connected by AC coupling, time taken before the start of transmission of valid data is shortened. The transmission device includes an internal resistor, an internal circuit, and a transmission-side control unit. One end of the internal resistor is connected to an output terminal connected to a capacitor. The internal circuit supplies one of a plurality of potentials different from each other to another end of the internal resistor. The transmission-side control unit performs control to supply one of the plurality of potentials to the internal circuit over a period from time when a potential of the output terminal is initialized to a predetermined initial value to timing when the potential of the output terminal reaches a predetermined specified value.
Communication method, corresponding system and device
A communication system has a galvanic isolation link coupling a first circuit to a second circuit. The first circuit transmits first data signals to the second circuit and receives second data signals from the second circuit in response to the first data signals. The data signals are transmitted in consecutive time slots of a determined time duration via the galvanic isolation link. The first data signals include polling signals transmitted from the first circuit to the second circuit during consecutive time slots, and on-demand access requests transmitted from the first circuit to the second circuit. The second data signals include status response signals transmitted from the second circuit to the first circuit in response to polling signals received from the first circuit, and access response signals transmitted from the second circuit to the first circuit in response to access requests received from the first circuit.