Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.

An electronic device according to an embodiment may include a housing comprising: an outer portion defining at least a portion of an exterior of the electronic device and comprising a first conductive material, an inner portion comprising a second conductive material having a first melting point different from that of the first conductive material and at least partially defining a space for receiving multiple electronic components arranged inside the electronic device, and a middle portion comprising a third conductive material having a second melting point and an injection molded insulator, wherein the third conductive material of the middle portion and the first conductive material of the outer portion are coupled to form a concave-convex structure, a difference between the first melting point and the second melting point is in a first range, and the third conductive material of the middle portion is electrically connected to the second conductive material of the inner portion.

A method of manufacturing a window member includes performing a first reinforcement operation including performing a first ion-exchange treatment on an initial window member. The first ion-exchange treatment includes applying ion salts at a temperature equal to or greater than a first temperature of about 500° C. A stress relief operation includes performing a heat treatment and/or a salt treatment on the initial window member to which the first reinforcement operation is performed. A second reinforcement operation includes performing a second ion-exchange treatment on the initial window member to which the stress relief operation is performed.

According to an embodiment, an electronic device may include a side member including a conductive part and a first non-conductive part, a frame member disposed on at least a portion of the side member to be at least partially visible from an exterior, a second non-conductive part disposed between the frame member and the first non-conductive part, at least one conductive member disposed between the second non-conductive part and the first non-conductive part, at least one conductive structure disposed near the conductive member in an internal space of the electronic device, and a wireless communication circuit disposed in the internal space and configured to transmit or receive via the at least one conductive member. The conductive member may include a stepped portion so that at least a portion of the conductive member may be disposed in a direction away from the conductive structure.

A component for an electronic device can include a part including a first metal and a second metal diffusion bonded to the first metal. The first metal can be aluminum and the second metal can be different from the first metal. A porous aluminum oxide layer can overlie a portion of the first metal and can be disposed adjacent to an interface between the first metal and the second metal. The component can further include a non-metallic material bonded to the part and extending into pores defined by the porous aluminum oxide layer.

A display device includes a display unit having a display surface to display an image, a cover panel stacked on the display surface of the display unit, and a holding frame stacked on a back surface of the display unit. The display surface of the display unit and the cover panel are bonded to each other with an optical adhesive material. The holding frame and the display unit are bonded to each other with a variable thickness adhesive material a thickness of which is variable at least at a time of bonding the holding frame and the display unit.

This application relates to the field of display technologies, and in particular, to a curved screen assembly and a terminal. The curved screen assembly includes a curved display screen, a first supporting component and a middle frame. The curved display screen has a first arc-shaped face and a second arc-shaped face; the first supporting component is located between the middle frame and the first arc-shaped face, and provided with a first supporting face, where the first supporting face matches the first arc-shaped face in outline; and the middle frame is provided with a second supporting face, where the second supporting face matches the second arc-shaped face in outline. In this application, the curved screen assembly and the terminal have a reasonable structural design and a more reliable overall structure.

An electronic device with a heat-dissipation structure is provided. The electronic device includes a housing, a heat-dissipation member, and a restriction member. The housing includes a first sidewall and a second sidewall. The first sidewall includes a first sidewall connection portion. The second sidewall includes a second sidewall connection portion. The heat-dissipation member includes a heat-dissipation member connection portion that is detachably connected to the first sidewall connection portion. The first sidewall connection portion restricts the freedom of movement of the heat-dissipation member connection portion in a first direction. The restriction member is disposed on the heat-dissipation member. The restriction member is wedged into the second sidewall connection portion. The second sidewall connection portion restricts the freedom of movement of the restriction member in the first direction.

This application provides an electronic device, including a first cover, a first shell, and a second shell. The first cover includes a first side portion, a middle portion, and a second side portion. The middle portion is connected between the first side portion and the second side portion. The first side portion and the second side portion are spaced apart from and opposite to each other to form an opening. The first side portion, the middle portion, and the second side portion are enclosed to form an accommodating cavity. The first shell and the second shell are both mounted in the accommodating cavity. The first shell and the second shell are matched to support the first cover. The solution of this application can resolve the problem of difficulty in assembling the shells with an exterior part.