Embodiments include systems and methods for heating materials, including heating materials for cooking and soldering. A representative system and method for cooking food includes passing electric current through the food, sensing a characteristic of the food, and modulating the electric current in response to the characteristic of the food to achieve a selected internal temperature of the food. The system and method can include searing the food with hot oil or photons directed at the surface of the food. A representative system and method for heating a material includes modulating a plurality of semiconductor light sources to emit photons toward the material, measuring a temperature of the material, and modulating the plurality of semiconductor light sources in response to the temperature of the material. The material can include solder and the method can include heating solder in a reflow soldering process.

An apparatus for storing a mask includes a main body comprising a first region and a second region, the first region having a plurality of mask containers, a gas supply pipe having an outer portion outside of the main body, a fan in the first region to propel the gas from the second region to the first region, a filter disposed at a front end and/or a rear end of the fan, a heat exchanger in the second region and configured to exchange heat with the flowing gas, a Peltier element at the outer portion of the gas supply pipe, a first sensor installed in the gas supply pipe upstream of the Peltier element, a second sensor installed in the second region in a lower position to the heat exchanger, and a controller connected to the first and second sensors and the Peltier element.

A heating system for use in mechanical testing at scales of microns or less includes a stage heater. The stage heater having a stage plane, and a stage heating element distributed across the stage plane. Two or more support mounts are on opposed sides of the stage plane. A first bridge extends from the stage plane to a first mount of the two or more support mounts, and a second bridge extends from the stage plane to a second mount of the two or more support mounts. The first and second bridges provide a plurality of supports between the stage plane and two or more support mounts to accordingly support the stage plane. In another example, the heating system includes a probe heater configured to heat a probe as part of mechanical testing.

A heating device for heating a component in a turbo molecular pump for exhausting a gas includes a heat transfer member, a heater, a first seal member and a second seal member. The heat transfer member is provided in an opening of a housing of the turbo molecular pump and has one end fixed to the component and the other end exposed to an outside. The heater in the heat transfer member heats the component through the heat transfer member. The first seal member is provided between the heat transfer member and the opening along an outer peripheral surface of the heat transfer member. The second seal member between the heat transfer member and the opening is located close to the component compared to the first seal member. The second seal member suppresses movement of radicals in a gas into a space between the heat transfer member and the opening.

Discussed is an apparatus for manufacturing a cell, the apparatus including: a center electrode reel from which a center electrode is to be unwound; a first heater configured to apply radiant heat to the unwound center electrode; an upper separator reel from which an upper separator to be laminated on a top surface of the center electrode is to be unwound; a lower separator reel from which a lower separator to be laminated on a bottom surface of the center electrode is to be unwound; an upper electrode reel from which an upper electrode to be laminated on a top surface of the upper separator is to be unwound; and a second heater configured to apply radiant heat to the unwound upper electrode.

Embodiments include systems and methods for heating materials, including heating materials for cooking and soldering. A representative system and method for cooking food includes passing electric current through the food, sensing a characteristic of the food, and modulating the electric current in response to the characteristic of the food to achieve a selected internal temperature of the food. The system and method can include searing the food with hot oil or photons directed at the surface of the food. A representative system and method for heating a material includes modulating a plurality of semiconductor light sources to emit photons toward the material, measuring a temperature of the material, and modulating the plurality of semiconductor light sources in response to the temperature of the material. The material can include solder and the method can include heating solder in a reflow soldering process.

A monitoring system for monitoring the temperature and vibration of equipment, comprising a central digital computer, a MESH communication network, wherein the network feeds signals to the central digital computer, a plurality of heating elements for heating the equipment, temperature/vibration sensors adapted to measure the temperature of the equipment, wherein each sensor is adapted to provide a signal representing the temperature/vibration of the piece of equipment to which the sensor is associated, to the network, wherein each temperature/vibration sensor can also be used to control the electric heaters, a temperature sensor that monitors the ambient temperature of the facility, and current transducers associated with the heaters, to monitor the energy use and current loss of the heaters, wherein the central computer uses the data it receives from the other elements of the monitoring system to determine when the equipment is not at the correct temperature/vibration and diagnoses the reason why.

A sensor (10) is provided that has at least one sensor functional group (12), a heating device (14, 22), and a heating control (14, 20) to control a heating power (P.sub.heating) of the heating device (14, 22). In this respect, the heating control (20) is configured to adapt the heating power (P.sub.heating) to a power consumption (P.sub.sensor) of the sensor functional group (12).

A method for operating an electric arc furnace having at least one electrode, the method including the following steps: introducing material that is to be melted in the form of an actual mass flow into the electric arc furnace and feeding electrical energy via at least one electrode into the electric arc furnace in order to melt the introduced material depending on a previously determined, necessary electrical energy input. The necessary electrical energy input into the arc furnace is determined depending on the mass flow input into the furnace.

A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application. A fluid passageway in the body connects the inlet and the outlet. The fluid passageway includes a thin slit section in the form of an elongated ring shape, having a length along a fluid flow direction between the inlet and the outlet, the thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction. The first dimension and the length are substantially greater than the second dimension. The heat exchange device further includes a heating element for heating the liquid adhesive material flowing through the thin slit section.