A heating wire of an electronic atomizing device includes a central end, a distal end, and a plurality of spiral heating coils extending between the central end and the distal end. The plurality of spiral heating coils is coplanar and surrounds the central end. A mounting gap is formed between any two adjacent spiral heating coils in an extending direction of a reference line connecting the center end and the distal end. The widths of the mounting gaps gradually decrease along the extending direction of the reference line away from the central end. An electronic atomizing device including the aforementioned heating wire is further provided.

An aerosol generating system includes, a body defining a cavity having a cavity opening, an aerosol-forming substrate disposed in the cavity, a heating element disposed proximate to the cavity opening, and a controller configured to detect contact of the aerosol-forming substrate with the heating element.

An aerosol generating system includes, a body defining a cavity having a cavity opening, an aerosol-forming substrate disposed in the cavity, a heating element disposed proximate to the cavity opening, and a controller configured to detect contact of the aerosol-forming substrate with the heating element.

The aerosol-generating device includes a housing, and a power supply configured to supply electrical power to a heating element by way of a transformer assembly within the housing. The transformer assembly includes a magnetic flux guide, a primary circuit including a primary winding extending around a first portion of the magnetic flux guide and electrically connected to the power supply, and a secondary circuit including a secondary winding inductively coupled to the primary winding and extending around a second portion of the magnetic flux guide. The number of turns in the primary winding is greater than the number of turns in the secondary winding. The secondary circuit includes at least two electrical contacts configured to form an electrical connection with the heating element.

The aerosol-generating device includes a housing, and a power supply configured to supply electrical power to a heating element by way of a transformer assembly within the housing. The transformer assembly includes a magnetic flux guide, a primary circuit including a primary winding extending around a first portion of the magnetic flux guide and electrically connected to the power supply, and a secondary circuit including a secondary winding inductively coupled to the primary winding and extending around a second portion of the magnetic flux guide. The number of turns in the primary winding is greater than the number of turns in the secondary winding. The secondary circuit includes at least two electrical contacts configured to form an electrical connection with the heating element.

A method is provided for manufacturing a PTC heating cell with at least one PTC element and contact elements which are made of an electrically conductive material, which are electrically conductively abutted against the PTC element, and which are connected to the PTC element and a corresponding heating cell. In order to improve heat extraction and the connection between the contact element and the PTC element, the contact elements are connected to the PTC element by induction soldering. Also disclosed is a PTC cell in which there is only solder of the solder connection between the thermistor material of the PTC element and the contact element.

A PTC heating assembly includes a heating cell comprising a PTC element and conductor elements electrically abutting the PTC element. The heating cell is accommodated in a heater housing. The heater housing is manufactured with undersize relative to the heating cell so that the heating cell, after insertion into the heater housing, is held under pretension between mutually opposing walls of the heater housing. Accordingly, in the method according to the invention, the heater housing is elastically widened when the heating cell is inserted into the heater housing.

A heating cell includes a frame made of electrically insulating material. A PTC element, which is received in a frame opening of the frame. Insulating layers accommodate the PTC element between themselves, are connected to the frame, and at least partially cover a respective main side surface of the PTC element exposed in the frame opening and a frame surface defining the frame opening. Abutment projections project beyond the frame surface and at least partially enclose a circumferentially encircling edge of the insulating layer between themselves.

A test wafer is placed inside a baking module and is baked. Via one or more temperature sensors, a cumulative heat amount delivered to the test wafer during the baking is measured. The measured cumulative heat amount is compared with a predefined cumulative heat amount threshold. In response to the comparing indicating that the measured cumulative heat amount is within the predefined cumulative heat amount threshold, it is determined that the baking module is qualified for actual semiconductor fabrication. In response to the comparing indicating that the measured cumulative heat amount is outside of the predefined cumulative heat amount threshold, it is determined that the baking module is not qualified for actual semiconductor fabrication.

A test wafer is placed inside a baking module and is baked. Via one or more temperature sensors, a cumulative heat amount delivered to the test wafer during the baking is measured. The measured cumulative heat amount is compared with a predefined cumulative heat amount threshold. In response to the comparing indicating that the measured cumulative heat amount is within the predefined cumulative heat amount threshold, it is determined that the baking module is qualified for actual semiconductor fabrication. In response to the comparing indicating that the measured cumulative heat amount is outside of the predefined cumulative heat amount threshold, it is determined that the baking module is not qualified for actual semiconductor fabrication.