A heat treatment device includes: a heating plate configured to support and heat a substrate on which a resist film is formed; a chamber configured to cover a processing space above the heating plate; a gas supply configured to supply a gas into the chamber along a gas flow path connected to an inside of the chamber, the gas flow path beginning from an outer periphery of the heating plate and extending along an upper surface of the heating toward an end portion on an outer periphery of the substrate; and an exhaust port configured to evacuate inside of the chamber through exhaust holes that are formed above the processing space and open downwards.

A heating element including a dense substrate and a heating film is disclosed. The dense substrate includes a first surface and a second surface opposite to the first surface. A plurality of micro-pores are arranged in the dense substrate. The micro-pores are through holes, and each of the micro-pores is configured to guide an aerosol-forming medium to the first surface. The heating film is formed on the first surface. A ratio of a thickness of the dense substrate to a pore size of the micro-pore is in a range of 20:1-3:1.

A device for thermally loading an enclosure and/or a heat sink includes: at least one circuit board arranged or arrangeable in the enclosure or on the heat sink, each at least one circuit board having at least one conductor track and at least two fields within each of which a continuous electrically conductive track section of the at least one conductor track runs, a path length of the at least one conductor track section within each of the at least two fields being greater than one or each edge length of a respective field or one or each diagonal of the respective field or a perimeter of the respective field. The fields include tiles of a tiling of a first side of the circuit board The conductor track sections each thermally load the enclosure and/or the heat sink depending on a current feed to the respective conductor track.

A device for thermally loading an enclosure and/or a heat sink includes: at least one circuit board arranged or arrangeable in the enclosure or on the heat sink, each at least one circuit board having at least one conductor track and at least two fields within each of which a continuous electrically conductive track section of the at least one conductor track runs, a path length of the at least one conductor track section within each of the at least two fields being greater than one or each edge length of a respective field or one or each diagonal of the respective field or a perimeter of the respective field. The fields include tiles of a tiling of a first side of the circuit board The conductor track sections each thermally load the enclosure and/or the heat sink depending on a current feed to the respective conductor track.

A heating element and conductive element system may include a heater conductive element and a heating element. The heater conductive element and the heating element may be integral components. The heater conductive element and the heating element may be discrete components. The heater conductive element may be configured for enhanced mechanical fatigue compared to typical conductive element.

A heating element and conductive element system may include a heater conductive element and a heating element. The heater conductive element and the heating element may be integral components. The heater conductive element and the heating element may be discrete components. The heater conductive element may be configured for enhanced mechanical fatigue compared to typical conductive element.

Systems and methods are provided for controlling infrared radiation (IR) sources of a sauna including tuning IR wavelength-ranges and radiated power-levels of IR sources, and directing IR to locations on a user's body. In one illustrative embodiment, a sauna may be provided having adjustable IR emitters to emit IR at any wavelength resulting in a desirable radiation treatment for the sauna user. In another illustrative embodiment, a method is provided for tuning IR emitters in a sauna.

The invention relates to a method for manufacture of a product or in completion of a product. A flexible mat (20) is manufactured from an incompletely cured thermo-setting plastic, wherein the mat comprises an article (10) of electrically conductive material. The incompletely cured mat (20) including the article (10) is then formed as a function of a forming tool or to lie against or for contact with a product, whereafter final curing of the mat (20) is executed by supplying electric power to the article (10) or by external heat application or ultraviolet light. The invention also relates to an arrangement and uses.

A thermal radiation element includes a substrate; and a plasmonic perfect absorber in which a first conductor layer covering one main surface of the substrate, an insulator layer, and a second conductor layer are laminated in this order, in which the first conductor layer is provided with electrodes through which a current flows in an in-plane direction of a main surface of the first conductor layer.

A novel solid-state heating element is disclosed. The heating element comprises a plurality of heating layers comprised of a mixture of carbon and a polymer or plastic. The heating layers are disposed on or infused into a substrate. Each heating layer can be disposed on, or infused into, its own substrate, or the heating layers can be disposed on or infused into opposites sides of the same substrate. A radiating element can be disposed in proximity to one or both of the heating layers. The radiating element absorbs the radiation put out by the heating layer(s) and reradiates heat. A heat transfer fluid such as air or a liquid can be directed across the radiating element and/or other areas of the heating element to transfer heat from the heating element to another location.