H05K1/0203

COMPONENT MOUNTING DEVICE HEAD UNIT
20180006543 · 2018-01-04 · ·

A component mounting device head unit includes a head main body, a nozzle being provided on the head main body, a drive source, a cover, and a heat transfer member. The nozzle is configured to pick up a component. The drive source is configured to transfer moving power to at least one of the head main body and the nozzle. The cover covers the drive source. The heat transfer member connects the cover to the drive source or a frame of the drive source, and the heat transfer member is configured to allow heat generated by the drive source to escape to the cover.

ONBOARD CONTROL APPARATUS

Provided is an onboard control apparatus (ECU) having a thermal radiating coating film capable of efficiently radiating heat generated from an electronic component to the outside of the casing. An onboard control apparatus includes: a circuit board stored in a housing; an electronic component mounted on the circuit board; and a thermal radiating coating film which is disposed on the electronic component to radiate heat generated from the electronic components, wherein the thermal radiating coating includes a resin and thermal radiating particles which radiate heat, and the thermal radiating particles and the resin have substantially same specific gravity.

POWER MODULE AND METHOD OF MANUFACTURING THE SAME
20180007777 · 2018-01-04 ·

A power module is provided. The power module includes a substrate, a power conversion chip that is disposed on the substrate and an insulating film that is formed on a structure in which the power conversion chip is disposed on the substrate. Additionally, the power module includes a metal mold that encases the structure that is coated with the insulating film. Additionally, the power module provides a simplified structure and improved heat dissipation performance compared to conventional power modules.

BOARD LEVEL SHIELDS WITH ADJUSTABLE COVERS
20180007783 · 2018-01-04 ·

According to various aspects, exemplary embodiments are disclosed of board level shields. In an exemplary embodiment, a board level shield generally includes a cover (or lid) and a fence (or frame or base). The cover is attachable to the fence in a plurality of different positions.

Electronic device and method for producing an electronic device
20180007779 · 2018-01-04 ·

The invention relates to an electronic device comprising a printed circuit board (14) and comprising an electronic component (16) arranged on a first surface (15) of the printed circuit board (14). The printed circuit board (14) has a cutout (23) extending from a second surface (24) of the printed circuit board (14), said second surface being situated opposite the first surface (15), in the direction of the electronic component (16). The electronic device comprises a coolant container (25), which has an opening closed by the second surface (24) of the printed circuit board (14). The invention additionally relates to a method for producing such an electronic device.

Photovoltaic Junction Box
20180013383 · 2018-01-11 ·

A photovoltaic junction box comprising a diode module and a circuit board disposed in a box body, and a heat sink mounted on the outer surface of the box body. The diode module is attached to the back side of the heat sink and is electrically connected to cooper conductor. The heat sink is made of aluminum material and a heat-absorbing layer is provided inside the heat sink. The heat-absorbing layer is close to the diode module. The aluminum heat sink provides great thermal conductivity, therefore, can greatly increase the cooling capacity of the junction box. In addition, because metal material for higher temperature resistance is used instead of lower temperature resistance plastic material, the box body would not deform as easy, greatly increase the safety and reliability of the junction box.

PRINTED CIRCUIT BOARD FOR INTEGRATED LED DRIVER
20180014373 · 2018-01-11 · ·

A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.

ELECTRICAL DEVICE HEAT DISSIPATION STRUCTURE
20180014430 · 2018-01-11 ·

An electrical device heat dissipation structure includes an air blowing device, a casing, and a mating connector. The casing is disposed with at least one air outlet, an electrical connector and a power supply. The power supply provides power to the air blowing device. The mating connector has a chip. The mating connector is electrically connected with the electrical connector. The air blowing device is configured to blow air to the mating connector through the at least one air outlet, so as to improve dissipation of heat generated by the chip at work, and to reduce a temperature of the mating connector.

Vehicular camera module with focus athermalization

A vehicular camera module includes a front camera housing portion having an imager, a lens having a plurality of optical elements, and an imager printed circuit board. The imager is disposed at a front side of the imager printed circuit board and the lens is optically aligned with the imager. A rear camera housing portion is mated with the front camera housing portion to form a camera housing. A thermal element is disposed between the imager printed circuit board and the camera housing. The thermal element has a coefficient of thermal expansion (CTE) of 13 ppm/° C. or less. With the vehicular camera module disposed at a vehicle, circuitry of the vehicular camera module is in electrical connection with a wire harness of the vehicle.

ROLLABLE DISPLAY DEVICE
20180014417 · 2018-01-11 ·

A rollable display device includes: a rollable display including a first end and a second end spaced apart from the first end; a first slider including a roller that supports the first end of the rollable display, the first slider being configured to roll the rollable display about the roller; and a second slider including a support that supports the second end of the rollable display while bending the second end of the rollable display, the second slider being slideable relative to the first slider.