The invention relates to a method for producing a radome, a flexible printed circuit board having a metallic structure being used. Said flexible printed circuit board is embossed and is back-molded with a thermoplastic material and electric contact elements are connected to the flexible printed circuit board. A connector skirt is placed on the contact elements prior to back-molding.

A circuit-including film comprising: a resin film (1); and a conductive fine wire circuit (A) and a conductive circuit (B) independent of the conductive fine wire circuit (A), which are arranged on one surface of the resin film (1), wherein the resin film (1) contains at least one resin selected from the group consisting of a polyvinyl acetal resin, an ionomer resin and an ethylene-(vinyl acetate) copolymer resin.

The present invention provides a conductive fabric comprising base cloth and a conductive metallic circuit structure formed on the surface of the base cloth. The conductive metallic circuit structure comprises at least one metallic seed layer and at least one chemical-plating layer. The metallic seed layer is an evaporation-deposition layer or a sputter-deposition layer and has a circuit pattern. The chemical-plating layer is applied over the surface of the metallic seed layer. The conductive fabric has improved conductivity and heat generation efficiency.

A lens assembly includes a lens, a lens barrel, and a heater element. The lens has an inner surface and an outer surface. The lens barrel supports the lens and defines an optical axis, the lens arranged along the optical axis such that the inner surface of the lens is within the lens barrel and the outer surface of the lens is outside the lens barrel. The heater element is in intimate mechanical communication with the inner surface of the lens and has a heater element electrical lead extending radially therefrom to provide power to the heater element. Lens heating methods are also described.

An interposer board having heating function and an electronic device using the same are provided. The interposer board includes an insulating body, a plurality of top conductive contacts, a plurality of bottom conductive contacts, a plurality of conductive connection structures and a plurality of micro heaters. The top conductive contacts are disposed on the insulating body. The bottom conductive contacts are disposed on the insulating body. The conductive connection structures are disposed on the insulating body, and the conductive connection structures respectively electrically connected to the top conductive contacts and respectively electrically connected to the bottom conductive contacts. The micro heaters are disposed on or in the insulating body, and the micro heaters are respectively adjacent to the top conductive contacts and the bottom conductive contacts. Each of the top conductive contacts or each of the bottom conductive contacts can be heated by the corresponding micro heater.

An apparatus is described. The apparatus includes a printed circuit board (PCB), a heating element and a layer of material that is physically integrated with a surface of the PCB. The layer of material is to apply an expansive or contractive force to a surface of the PCB in response to being warmed by heat generated by the heating element. The expansive or contractive force is to cause the first surface to expand with a first coefficient of thermal expansion that is closer to a second coefficient of thermal expansion of an opposite surface of the PCB than the surface's coefficient of thermal expansion without the expansive or contractive force.

An article comprising a heater that comprises a high-resistance magnification (HRM) PTC ink deposited on a flexible substrate to form one or more resistors. The HRM PTC ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature T and a resistance of the double-resin ink at 25 degrees Celsius.

Magnetometers, atomic sensors and related systems, methods and devices are disclosed. The magnetometer includes an alkali vapor cell and illumination source configured to emit light and a detector that receives the light and a heating element. The magnetometer also includes a folded baseplate such that light emitted from the illumination source is directed to the alkali vapor cell, and light emerging from the alkali vapor cell is directed to the light detector.

A device may include a temperature controlled chamber. The temperature controlled chamber may be coupled to a plurality of strengthening coated capillary tubes. The strengthening coated capillary tubes may support the temperature controlled chamber and provide thermal insulation to the temperature controlled chamber.

A device may include a temperature controlled chamber. The temperature controlled chamber may be coupled to a plurality of strengthening coated capillary tubes. The strengthening coated capillary tubes may support the temperature controlled chamber and provide thermal insulation to the temperature controlled chamber.