An optical device comprises a printed circuit board comprising a rigid main portion and comprising at least one flexible portion arranged at the periphery of the rigid main portion, the rigid main portion including an electronic image-capture circuit; a lens holder comprising at least one optical lens, the lens holder comprising a wall forming a cavity extending along the optical axis of the device from its top end to its bottom end, the bottom end being mounted on the rigid main portion of the printed circuit board so as to align, along the optical axis of the device, the electronic image-capture circuit and the optical lens; at least one heating element arranged on the flexible portion of the printed circuit board, the flexible portion of the printed circuit board being arranged by bearing directly against the wall of the lens holder.

An electric device includes an electric component mounted on a circuit board, a cabinet, a heat conducting member, and an elastic portion. The cabinet faces the circuit board. The heat conducting member has heat conductivity, a first contact portion that is in contact with the electric component, and at least one second contact portion that is in contact with the cabinet. The elastic portion has elasticity in a direction in which the circuit board and the cabinet face each other. The first contact portion and the second contact portion are separated from each other in the direction in which the circuit board and the cabinet face each other. The elastic portion applies an elastic force to at least one of the first contact portion and the second contact portion in a direction in which the first contact portion and the second contact portion are separated from each other.

A system for detecting contamination in a two-phase immersion cooling system based on current leakage between two combs on a printed circuit board. A first comb is opposite a second comb, wherein each finger of the first comb is positioned between two adjacent fingers on the second comb. The combs are positioned near a heat source in the liquid portion of the fluid. As the fluid boils, contaminants are distilled out of the fluid. Acidic contaminants deposited on either comb may cause metal migration to occur, resulting in bridging between two combs. A current sensor may detect the current leakage and send a signal to allow the information handling system, the fluid, or the cooling system to be serviced before damage occurs to the information handling system.

A printed circuit board (PCB) including: a negative thermal coefficient (NTC) thermistor which provides an electrical signal received from outside the PCB, wherein an electrical resistance of the NTC thermistor varies according to a negative thermal coefficient; and a heating pattern which receives the electrical signal from the NTC thermistor, wherein the heating pattern includes a positive thermal coefficient (PTC) thermistor with an electrical resistance that varies according to a positive thermal coefficient, wherein the PTC thermistor has a first thermal coefficient of resistance at a first critical temperature or below and changes to a second thermal coefficient of resistance above the first critical temperature, and the NTC thermistor has a third thermal coefficient of resistance at a second critical temperature or below and changes to a fourth thermal coefficient of resistance above the second critical temperature.

A system for detecting contamination in a two-phase immersion cooling system based on current leakage between two combs on a printed circuit board. A first comb is opposite a second comb, wherein each finger of the first comb is positioned between two adjacent fingers on the second comb. The combs are positioned near a heat source in the liquid portion of the fluid. As the fluid boils, contaminants are distilled out of the fluid. Acidic contaminants deposited on either comb may cause metal migration to occur, resulting in bridging between two combs. A current sensor may detect the current leakage and send a signal to allow the information handling system, the fluid, or the cooling system to be serviced before damage occurs to the information handling system.

Provided is an electric wiring member supported by a support member that supports a recording element substrate configured to eject a liquid. The electric wiring member has a signal line for transmitting a drive signal used for driving the recording element substrate, a power line for supplying drive power to the recording element substrate, and a heat generating resistive line for heating the support member. The power line is arranged between the signal line and the heat generating resistive line.

A board, including a pad layer, a micro heater layer, and an insulating layer which are laminated, is provided. The pad layer includes a pad. The micro heater layer includes a micro heater. The micro heater is disposed corresponding to the pad. The insulating layer is located between the pad layer and the micro heater layer. A resistance value of the micro heater ranges from 10 Ω to 500 Ω. A circuit board is also provided.

A vehicular antenna device includes an antenna portion having an antenna element, and a frame accommodating a heat generation member. The vehicular antenna device is configured to be attached to an attachment portion of a vehicle. The frame includes a first space portion having a cylindrical shape and defining a first space, the first space portion being exposed to an outside air in a condition where the vehicular antenna device is attached to the vehicle. The heat generation member is located along a second surface of the frame that is a reverse side of a first surface defining the first space. The antenna portion is detachable from the frame.

High-current circuit having a printed circuit board comprising a non-conductive substrate 2, a conductor layer 4 applied to the substrate 2 and an insulation layer 6 applied to the conductor layer, contact pads 8, 10, 12, 20, 22, 24 in each case interrupting the insulation layer 6 being arranged on both sides of the conductor plate, and the contact pads 8, 10, 12, 20, 22, 24 making contact with one another via vias 14 through the substrate 2, and the vias 14 being arranged in the area of the contact pads 8, 10, 12, 20, 22, 24, 10, 12, 20, 22, 24, characterized in that at least a first one of the contact pads 8 is arranged on a first side of the printed circuit board and a first semiconductor switch 28 is connected directly to at least a second one of the contact pads 20 on a second side of the printed circuit board, and in that the semiconductor switch 28 is connected to the first contact pad 8 directly via the vias 14 and the second contact pad 20, without further conductor tracks.

A chip may be secured to a first printed circuit board (PCB) via a first solder joint. The first PCB may be secured to a second PCB via a second solder joint. The melting temperature of the first solder joint may be higher than the melting temperature of the second solder joint.