A reinforcement board for a flexible printed circuit, a flexible printed circuit assembly, and a display device. The reinforcement board for a flexible printed circuit comprises a substrate; the substrate comprises a first surface and a second surface which are opposite to each other; a through hole passing through the first surface and the second surface is provided on the substrate; the first surface, the second surface, and the wall of the through hole are all provided with a conductive layer; and the conductive layers on the first surface and the second surface are connected by means of the conductive layer on the wall of the through hole.

In a high-frequency module provided with a shield member between components, improvement in the degree of freedom in design such as arrangement of components or the like is achieved while preventing damage to a wiring board. A high-frequency module (1a) includes a multilayer wiring board (2), a plurality of components (3a) and (3b) mounted on an upper surface (20a) of the multilayer wiring board (2), and a shield member (5) for shielding between the component (3a) and the component (3b), in which the shield member (5) is formed in a flat plate shape, with a plurality of metal pins (5a) each stacked in a thickness direction of the sealing resin layer (4) such that a length direction is made to be substantially parallel to the upper surface (20a) of the multilayer wiring board (2), and a resin molded portion (5b) for fixing the metal pins (5a).

A circuit board, comprising a connector, screw holes and first ground, wherein first ground terminals of the connector and the screw holes are respectively connected to the first ground, so as to carry out electrostatic discharge by means of the first ground; and the first ground is isolated from ground wires on the circuit board.

There is provided a conductive adhesive with which the connection stability between objects that are conductive members is excellent, the connection stability is maintained even when the conductive adhesive is subjected to high temperature, and rising towards the back side of an object is less likely to occur. A conductive adhesive 1 includes a binder component 12, and metal particles (A) 11 having a 20% compressive strength of 25 MPa or less in a 170° C. environment. The metal particles 11 preferably include a metal having a melting point of 280° C. or less. The content of the metal having a melting point of 280° C. or less in the metal particles (A) 11 is preferably 80% by mass or more.

An automation field device comprises a housing that surrounds an inner space; a sensor- and/or actuator element arranged at the housing; an electronic circuit arranged in the housing and having a round, outer contour and a plurality of spring contacts in an edge region. The inner contour of the housing and the edge contour of the first circuit board are adapted to one another so that the first circuit board is introducible into the housing with a main plane orthogonal to a longitudinal axis of the housing. The spring contacts are so arranged on the first circuit board and embodied to hold the first circuit board in the inner space and to produce an electrical connection between the first circuit board and the housing to drain away disturbance currents from the first circuit board.

An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

This application provides an electronic module and an electronic device. The electronic module includes a first component, a second component, and a plurality of terminals. The first component includes a package substrate and a chip mounted on the package substrate. The second component includes a circuit board and a mount base mounted on the circuit board. Each terminal includes a body part, and a first bent part and a solder ball that are respectively connected to two opposite ends of the body part. In each terminal, the body part passes through and is fastened to the mount base, the first bent part presses against a corresponding first solder pad on the package substrate, and the solder ball is connected to a corresponding second solder pad on the circuit board.

An electronic module is provided, including a circuit board, at least one electronic component, a covering layer, and an adhesive. The at least one electronic component is disposed on the circuit board. The covering layer has multiple holes, and the covering layer is disposed on the circuit board and covers the at least one electronic component. The adhesive is combined to the covering layer, and the adhesive fills the holes and encapsulates the at least one electronic component.

An automatized mechanical opening/closing device is mounted to an oven mouth of an oven device and includes an outer door frame assembly, an inner door frame assembly, a door panel, a first driving device, and a plurality of second driving devices. The first driving device and the second driving devices are set in electric connection with a control platform is, so that the first driving device is operable to drive the inner door frame assembly to move inside the outer door frame assembly in an X-axis direction and the second driving devices is operable to drive the door panel to move inside the inner door frame assembly in a Y-axis direction. The control platform can be used to set automatized opening and closing operations of the oven mouth of the oven device to thereby save human labor and to reduce material damage due to manual operation.

A screw boss assembly, including: a plastic substrate, including: a bottom surface including a first channel; an indented surface; a sidewall surface connecting the bottom surface and the indented surface, the sidewall surface including second channels, each of the second channels connected to the first channel; a metal insert, including: a first contacting member; second contacting member; connecting members connecting the first contacting member to the second contacting member; wherein the metal insert is coupled with the plastic substrate such that the first contacting member is positioned within the first channel and the connecting members are positioned within respective second channels.