Patent classifications
H05K1/0215
Multilayer board
A multilayer board includes a laminated insulating body, signal conductors inside the laminated insulating body and extending in a transmission direction, and ground conductors sandwiching each of the signal conductors in a lamination direction via the insulating base material layers. The multilayer board includes a parallel extending portion in which the signal conductors extend parallel and that includes signal conductors arranged separately from each other in a direction orthogonal to the transmission direction in a planar view in the lamination direction, and a signal conductor overlapping with the signal conductor in a planar view in the lamination direction and arranged separately from the signal conductor in the lamination direction. The parallel extending portion includes first and second regions arranged separately in a direction orthogonal to the transmission direction in a planar view in the lamination direction.
Display device
A display device includes: a display panel including a display area including pixels and a non-display area adjacent to the display area; a first driving integrated circuit including a first ground terminal, where the first driving integrated circuit is electrically connected to the display panel; a first printed circuit board electrically connected to the first driving integrated circuit; a first plate disposed on a bottom surface of the display panel and overlapping with the first driving integrated circuit; and a second plate disposed on the bottom surface of the display panel and spaced apart from the first plate, where the second plate is electrically connected to a system ground.
Electronic device comprising ground reinforcement structure
An electronic device according to various embodiments of the disclosure may include: a housing which includes a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a lateral member covering at least part of the space between the first and second plates; a display disposed to be visible in at least part of the first plate; a first circuit board which includes a first face facing the first direction and a second face facing the second direction, and which is disposed in the second direction of the display; a second circuit board which is disposed not to overlap at least in part with the first printed circuit board, and which is electrically coupled with the first circuit board; a socket mounted to the second circuit board; at least one or more metal structures disposed on the first circuit board to transfer, to another component, heat of at least one or more exothermic elements mounted on the first circuit board; and a ground path constructed in at least part of the second circuit board so as to be electrically coupled to the first circuit board or the metal member or the first circuit board and the metal structure.
VEHICLE, A MAIN FRAME, A MODULE POCKET, AN ELECTRONIC MODULE, AND A PRINTED CIRCUIT BOARD
A central compute unit, configured as a vehicle central compute unit, to a pocket module, to an electronic module, and to a printed circuit board, to a cooling blade, and to a main frame. The printed circuit board for an electronic vehicular component includes a thermal distribution layer in the printed circuit board and one or more thermal coupling areas on the surface of the printed circuit board. The one or more thermal coupling areas are configured for heat dissipation away from the printed circuit board, and the one or more thermal coupling areas are thermally coupled to the thermal distribution layer in the printed circuit board.
Ground member and shielded printed wiring board
Provided is a ground member that can prevent damage to interlayer adhesion between a conductive layer and an adhesive layer of the ground member due to heating in producing a shielded printed wiring board or in mounting an electronic component on a shielded printed wiring board. The ground member of the present invention includes: a conductive layer; and an adhesive layer stacked on the conductive layer, the adhesive layer containing a binder component and hard particles, the adhesive layer having a thickness of 5 to 30 μm.
Display assembly and display device
The display assembly includes a display module, a flexible printed board, an integrated circuit chip, and a composite tape. The integrated circuit chip and a binding portion of the flexible printed board are respectively in binding connection with the display module. The composite tape includes: a conductive fabric layer comprising a first part and a second part, the first part covering the integrated circuit chip and the binding portion, and the second part covering at least part of a grounding portion of the flexible printed board; and an insulating film layer on a side of the conductive fabric layer facing the integrated circuit chip and the flexible printed board, and including a third part, which is at the first part of the conductive fabric layer and covering the integrated circuit chip and the binding portion, and the insulating film layer avoiding the at least part of the grounding portion.
Lightweight electronic device for automotive applications and method
A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.
DISPLAY APPARATUS
Provided is a display apparatus including: a display panel including a display area and a peripheral area; a printed circuit board attached to the peripheral area and including a ground portion and a test electrode spaced apart from the ground portion; a connector including a plurality of connector terminals connected to an external control apparatus and electrically connecting the printed circuit board and the external control apparatus to each other; and a cover layer arranged on the printed circuit board and covering at least a part of the printed circuit board. Accordingly, not only the display quality and reliability of the electric characteristics of the display apparatus are improved, but also a loss is reduced and a yield is improved during manufacturing processes.
Solder void reduction between electronic packages and printed circuit boards
An apparatus includes a printed circuit board. The printed circuit board includes at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The printed circuit board includes a second dielectric layer on top of the at least one conductive layer. The printed circuit board includes a thermal pad on top of the second dielectric layer. The printed circuit board is fabricated by forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The printed circuit board is fabricated by backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.
System of package (SoP) module and mobile computing device having the SoP
A system on package SoP module includes a printed circuit board (PCB) having a first side and an opposing second side, a first IC attached to the first side, a second IC attached to the second side. The PCB also provides electrical paths for connecting the first IC and the second IC. Conductors by which the second IC is attached to the PCB also allow for electrical testing of the first IC when the SoP is in a system level state.