Apparatuses and associated methods for mounting PCBs and other electronics boards in portable medical equipment and/or other portable and non-portable electronic devices are disclosed herein. In some embodiments, the technology disclosed herein can provide PCB mounting systems that isolate the PCB from detrimental shock, vibration, and/or strain, while also providing electrical ground paths that greatly reduce EMI and other electrical disturbances. Some embodiments of the mounting systems described herein include both elastomeric (e.g., rubber) components and resilient metallic grounding members that, when assembled together, provide favorable shock mounting as well as robust electrical grounding without the inconvenience of using separate shock mounts, grounding straps, etc.

A power converter includes: a circuit board having an insulating substrate and a plurality of wirings in the insulating substrate; and first and second switching elements on a first surface of the circuit board that are connected in series. The first switching element has first and second electrodes. The second switching element has a third electrode and a fourth electrode. The circuit board has a first wiring connected to the first electrode, a second wiring connected to the second and third electrodes, a third wiring connected to the fourth electrode, a fourth wiring as an output wiring connected to the third electrode, and a fifth wiring connected to the third wiring. The first, second, third and fourth wirings are arranged in order on the first surface, and the fifth wiring on a second surface opposite to the first surface is opposed to the first, second, and third wirings.

A circuit board has a flexible board with a principal surface, and a ground conductor provided in the flexible board. The flexible board is cut in at least one portion. The flexible board is bent using the cut portion, so that the flexible board has a first portion and a second portion at a different height from the first portion, and the ground conductor has a gap made by the cutting. At least one ground terminal is provided on the ground conductor near at least one end of the gap to electrically connect the circuit board to a ground provided in an external circuit.

A printed wiring board includes a power supply conductor pattern arranged on one conductor layer, one ground conductor pattern arranged on the one conductor layer, and another ground conductor pattern arranged on the another conductor layer so as to be opposed to the power supply conductor pattern. The power supply conductor pattern includes a power supply pad on which a terminal of a capacitor is to be bonded. The one ground conductor pattern includes a ground pad on which another terminal of the capacitor is to be bonded. A slit is formed in the another ground conductor pattern so as to pass through a projection portion defined by projecting the power supply pad onto the another ground conductor pattern and divide a projection portion defined by projecting the power supply conductor pattern onto the another ground conductor pattern.

The invention proposes a luminous module comprising a flexible printed circuit board. The connection to ground of the electronic circuit accommodated by the printed circuit board is produced without adding fastening parts dedicated to this role. Compared to known prior-art techniques, the invention allows a luminous module to be produced comprising fewer constituent parts and occupying a smaller volume.

An electronic device is provided. The electronic device includes a printed circuit board having a terminal formed thereon, an image sensor electrically connected to the terminal, and a metal casing enclosing a surface of the image sensor, wherein the metal casing comprises a first portion spaced apart from the printed circuit board by a first distance and a second portion spaced apart from the printed circuit board by a second distance.

An electronic device module, includes a substrate including a grounding electrode disposed on a surface of the substrate, an insulating portion encapsulating a portion of the surface of the substrate, an electronic component disposed on the surface of the substrate, wherein the electronic component is at least partially encapsulated by the insulating portion, and a sealing portion, having electrical conductivity, disposed on the substrate and the insulating portion. The sealing portion is electrically connected to the grounding electrode.

According to one embodiment, FPC has a flexible board body, a reinforcing plate, an opening portion, and a bent structure. The opening portion is formed to penetrate through the board body. The bent structure is bent to pass through the inside of the opening portion.

One example printed circuit board transmission line includes a substrate layer, a metal line, at least one first welding point, at least one first transmission medium, and a metal component that is configured to implement a grounding function. The metal line is plated on a surface of the substrate layer. The at least one first welding point is a welding point at which the metal line is connected to the at least one first transmission medium. The at least one first welding point is welded to the metal line and welded to the at least one first transmission medium. The metal component is welded to the at least one first transmission medium. At least one groove is provided on one side of the at least one first welding point.

A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of a base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 μm thick.