An example balun includes a center conductor that passes through a printed wiring board having multiple dielectric layers and cage vias arranged relative to the center conductor. The cage vias include a first set of cage vias that extend between an unbalanced connection to the balun and a balanced connection to the balun. The first set of cage vias are part of a first circular arc and are connected to electrical ground through a first ground ring. The cage vias include a second set of cage vias that extend from the unbalanced connection part-way through the printed wiring board. The second set of cage vias are part of a second circular arc and are connected to the electrical ground through a second ground ring. The second circular arc is longer than the first circular arc.

Monolithic power stage (Pstage) packages and methods for using same are provided that may be implemented to provide lower thermal resistance/enhanced thermal performance, reduced noise, and/or smaller package footprint than conventional monolithic Pstage packages. The conductive pads of the disclosed Pstage packages may be provided with a larger surface area for contacting respective conductive layers of a mated PCB to provide a more effective and increased heat transfer away from a monolithic Pstage package. In one example, the increased heat transfer away from the monolithic Pstage package results in lower monolithic Pstage package operating temperature and increased power output. In another example, a monolithic Pstage package may be provided with an adaptive application-oriented interface and a multi-function pin that allows the same monolithic Pstage package to automatically detect and select between a relatively higher power information handling system application, and a relatively lower power information handling system VR application.

A method comprises mounting a grounding clip to a planar flexible printed circuit transmission line; clamping the grounding clip to an inner wall of a chassis of an electronic device; and operating a laser beam to weld the grounding clip to the chassis to route the flexible printed circuit transmission line along the inner wall. Welding the grounding clip to the chassis causes the grounding clip to remain in contact with the planar flexible printed circuit transmission line to ground the planar flexible printed circuit transmission line to the chassis.

In accordance with embodiments of the present disclosure, an information handling system may include a chassis and a circuit board. The chassis may have one or more structural posts. The circuit board may mechanically couple to the chassis, and the circuit board may comprise a substrate having formed therein one or more through-holes and one or more hooks each configured to mechanically couple the circuit board to the chassis via a corresponding structural post of the one or more structural posts, each of the one or more hooks comprising one or more mounting features, wherein each of the one or more mounting features is sized and shaped to engage with a corresponding one of the one or more through-holes in order to mechanically couple such hook to the substrate.

A flexible display apparatus can include a flexible substrate including a display portion, a bending portion and a pad portion; a first back plate configured to support the display portion of the flexible substrate; a second back plate configured to support the pad portion of the flexible substrate; a bending maintenance member disposed between the first back plate and the second back plate and configured to support the bending portion of the flexible substrate; and a conductive heat dissipating portion disposed to a rear surface of the first back plate.

Systems and techniques are described for a sensor designed to connect to and monitor devices in an ecosystem. In some implementations, a system monitors a property that includes the sensor configured to generate sensor data reflecting an attribute of the property. The sensor includes a host board that generates the sensor data and a core board connected to the host board. The core board identifies a type of the host board and communicates with a monitor control unit. The monitor control unit receives a request for firmware associated with the type of the host board from the sensor. In response, the monitor control unit accesses the firmware and transmits the firmware to the sensor. The core board of the sensor receives the firmware and stores the firmware. The core board receives the sensor data from the host board and transmits the sensor data to the monitor control unit.

Provided is a shielded printed wiring board that exhibits excellent connection stability even when having a through-hole with a small opening area, and enables a high degree of freedom in circuit design. The shielded printed wiring board 1 according to the present invention includes a printed wiring board 10, an insulating layer 22, and a conductive adhesive layer 21 disposed between the printed wiring board 10 and the insulating layer 22. The printed wiring board 10 includes a base 11, a circuit pattern 13 disposed on the base, and an insulating protective layer 14 covering the circuit pattern 13. The shielded printed wiring board has a through-hole 23 for external grounding that vertically penetrates the insulating layer 22 and the conductive adhesive layer 21. The conductive adhesive layer 21 has an extension 21a extending toward the inside of the through-hole 23 as compared with the insulating layer 22.

An electronic device is provided. The electronic device includes an electronic device including a housing including a front plate, a rear plate, and a member surrounding at least part of a space between the front plate and the rear plate and operating as an antenna radiator by being formed of a metal material at least in part, a support member including a first face and a second face, disposed between a display and the rear plate, supporting the display on the first face, and bonded to part of the side member, a printed circuit board, a housing groove formed on a first portion of the member, a conductive body bonded to the housing groove through a press-fit process, and a connection terminal disposed on the printed circuit board and electrically coupling the press-fitted conductive body to the printed circuit board.

A heat radiation shielding device comprising a heat sink is disclosed, comprising a substrate with a conductive base and cooling fins configured on the substrate; a conductive frame, fixed on periphery of the base of the substrate of the heat sink, forming a hood structure closed on three sides and open on one side with the substrate of the heat sink; and a ground element, configured around the electronic components on the circuit board, where the conductive frame is conductive frame on the open side of the hood structure, and engaged to the ground element, forming an electric connection with the circuit board.

An electronic device is provided. The electronic device includes a housing, an antenna radiating body including a conductive metal, a first member disposed within the housing and electrically connected to the antenna radiating body, a printed circuit board (PCB) disposed within the housing, a flexible connecting member disposed between at least a portion of the first member and at least a portion of a second member and including a conductive material, and a capacitor including a first conductive plate that contacts the second member or formed by a portion of the second member, a second conductive plate, separated from the first conductive plate and electrically connected to the PCB, and a dielectric layer inserted between the first conductive plate and the second conductive plate.