A personal care appliance with a flexible circuit board having a first end portion, a second end portion and a flexible bridge between the first end portion and the second end portion. A first rigid circuit board is mounted to the first end portion of the flexible circuit board. A second rigid circuit board is mounted to the second end portion of the flexible circuit board and folded over the first rigid circuit board. At least one electronic component that emits electromagnetic waves is mounted to the first rigid circuit board. A flexible shield is folded over the at least one electronic component.

An electronic module is provided, including a circuit board, at least one electronic component, a covering layer, and an adhesive. The at least one electronic component is disposed on the circuit board. The covering layer has multiple holes, and the covering layer is disposed on the circuit board and covers the at least one electronic component. The adhesive is combined to the covering layer, and the adhesive fills the holes and encapsulates the at least one electronic component.

Provided are a flexible printed circuit board and a display device. The flexible printed circuit board comprises a main flexible printed circuit board and a connection flexible printed circuit board having different outlines. Both printed circuit boards are single-layer boards or double-layer boards. The main flexible printed circuit board comprises a bonding region, a device mounting region, a first connection region and signal lines. The signal lines include a first signal line positioned between the device mounting region and the first connection region, and a second signal line positioned between the device mounting region and the bonding region. The connection flexible printed circuit board comprises a second connection region, a third connection region and a third signal line positioned between the second connection region and the third connection region. The two flexible printed circuit boards are connected by means of the first connection region and the second connection region. An orthographic projection of the third signal line on the main flexible printed circuit board overlaps with the second signal line. In an overlapping region, an electromagnetic shielding structure is at least provided at one side of the main flexible printed circuit board facing the connection flexible printed circuit board or at one side of the connection flexible printed circuit board facing the main flexible printed circuit board.

Improvement in heat dissipation capability is intended. A radio-frequency module includes a mounting substrate, a first transmission filter, a second transmission filter, a resin layer, and a shield layer. The second transmission filter is higher in power class than the first transmission filter. The resin layer covers at least part of an outer peripheral surface of the first transmission filter and covers at least part of an outer peripheral surface of the second transmission filter. The shield layer overlaps at least part of the second transmission filter in plan view in a thickness direction of the mounting substrate. At least part of a major surface of the second transmission filter on an opposite side to the mounting substrate side is in contact with the shield layer.

This document describes techniques and apparatuses directed to the mitigation of physical impact-induced mechanical stress damage to printed circuit boards through the utilization of a conductive shield track having a varied width (dynamic width). In an aspect, disclosed is a device that includes a printed circuit board, an electrical component on the printed circuit board in a shielded area, a conductive shield track on the printed circuit board, a component shield having a sidewall and a sidewall base, and solder disposed between the sidewall base and the conductive shield track to couple the component shield to the ground plane of the PCB to form a shielded compartment over the shielded area.

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.

A display device includes a display panel, a bottom chassis under the display panel, and a circuit board electrically connected to the display panel and disposed under the bottom chassis. The circuit board includes a circuit base layer, at least one circuit element disposed on a lower surface of the circuit base layer, and a printed layer disposed on an upper surface of the circuit base layer and having an emissivity of about 0.3 or less. The bottom chassis includes an opening overlapping the at least one circuit element in a plan view.

A space-saving configuration for electronics is disclosed in which at least four circuit boards are arranged to form sides of a five-or-greater sided geometric prism that are perpendicular to a common plane. That is, they are stood up on their sides and connected with flex cable to approximate a cylinder. Each circuit board can include one or more sides with electrical components. The circuit boards make up at least half of the five-or-greater sided geometric prism such that the circuit boards wrap at least halfway around. A common connector on one of the circuit boards can be configured to receive power from an underlying motherboard, and flex cables connecting adjacent circuit boards in series distribute power received from the connector to each of the circuit boards in series.

An example electronic device may include a first printed circuit board including a specified area. The first printed circuit board may include at least one first pad and at least one second pad formed in the specified area, wherein, when a first radio frequency (RF) front end module is disposed in the specified area of the first printed circuit board, at least one first pad is in contact with the first RF front end module and at least one second pad is not in contact with the first RF front end module, and, when a second RF front end module is disposed in the specified area of the first printed circuit area, at least one first pad and at least one second pad are in contact with the second RF front end module.

A power module and a carrier board are disclosed. The carrier board includes a circuit board body and a prefabricated substrate. The circuit board body includes a wiring layer. The prefabricated substrate is embedded in the circuit board body and includes an insulation layer and a metal layer, the metal layer is disposed on the insulation layer. The insulation layer is formed by a ceramic material. The metal layer is connected to the insulation layer through a sintering process. A surface of the insulation layer , which has contact with the at least one metal layer, has at least a part exposed outside of the at least one metal layer, the part of the insulation layer exposed to the outside of the at least one metal layer is an outer edge portion, and the outer edge portion is extended into the circuit board body along a horizontal direction.