A device includes a printed circuit board (PCB). The device may also include a high voltage coil disposed on the PCB and a low voltage coil disposed on the PCB. Further, a conductive shield forms a three-dimensional enclosure around the high voltage coil and confines an electric field generated by the device to the PCB.

A display device can include a cover substrate; a display module disposed on a rear surface of the cover substrate and configured to display an image; a heat dissipation film disposed on a rear surface of the display module; a hole disposed in the heat dissipation film; a flexible circuit board covering the hole in the heat dissipation film and configured to block light; and a fingerprint scanner mounted on the flexible circuit board, disposed in the hole of the heat dissipation film, and separated from the heat dissipation film by a space, in which the flexible circuit board covers the space between the heat dissipation film and the fingerprint scanner.

A wiring board includes at least one insulating layer that has a front surface and a back surface, a first wiring layer that is disposed on a front surface side of the at least one insulating layer, a second wiring layer that is disposed on a back surface side of the insulating layer where the first wiring layer is disposed, and a connection conductor that electrically connects the first wiring layer and the second wiring layer to each other. Of the first wiring layer and the second wiring layer, at least the first wiring layer includes an unfixing region that is not fixed to the insulating layer.

Disclosed herein is a coil component that includes: a drum core including a winding core part, a first flange part provided at one end of the winding core part in an axial direction of the winding core part, and a second flange part provided at other end of the winding core part in the axial direction of the winding core part; first, second, third, and fourth terminal electrodes provided on the first flange part; fifth, sixth, and seventh terminal electrodes provided on the second flange part; and first, second, third, and fourth wires wound around the winding core part, wherein one ends of the first to fourth wires are each connected to any one of the first to fourth terminal electrodes, and wherein other ends of the first to fourth wires are each connected to any one of the fifth to seventh terminal electrodes.

The present invention relates to the field of electric drive devices and arrangements comprising a plurality of power semiconductor components formed in or on a common substrate, and more particularly to an arrangement for monitoring the condition of a power semiconductor module of an electric drive device and an electric drive device. The arrangement for monitoring the condition of a power semiconductor module of an electric drive device comprises at least one pair of sensor elements, each pair comprising a first PCB copper trace sensor element and a second PCB copper trace sensor element, arranged on a printed circuit board parallel next to each other as a sensor element pair, wherein said first PCB copper trace sensor element is connected to a positive DC supply voltage source (UDC+) and said second PCB copper trace sensor element is connected to a negative DC supply voltage source (UDC?) of said electric drive device so that upon applying the DC supply voltage of said electric drive device said DC supply voltage is applied to said at least one pair of sensor elements at the same time as to the circuit components of the power semiconductor module.

The present disclosure provides a circuit board arrangement comprising a main board comprising at least one longitudinal cutout, at least one reinforcing plate arranged in the at least one longitudinal cutout and mechanically coupled to the main board, wherein the plane of main extension of the main board is arranged perpendicular to the plane of main extension of the at least one reinforcing plate. Further, the present disclosure provides a differential probe circuit and a respective method.

An electronic component package according to an embodiment includes a circuit board including an insulating layer, a circuit wiring disposed inside the insulating layer, a plurality of first conductive pads disposed in a first region on the insulating layer and connected to the circuit wiring, an auxiliary pad disposed over the first conductive pad and having a diameter smaller than that of the first conductive pad, and a solder resist layer disposed over the insulating layer, having a first opening overlapping the first region, and spaced apart from the auxiliary pad; an electronic component spaced apart from the solder resist layer and disposed over the first opening; and a conductive adhesive member electrically connecting the auxiliary pad and the electronic component.

A current control module is employed to protect a conductive feature of a printed circuit board (PCB) from an overcurrent event by comparing a reference voltage output from a compensation circuit connected to a reference power supply to a voltage output from a conductive feature connected to a power supply which is different from the reference power supply. The reference output voltage is representative of an anticipated voltage output from the conductive feature. The current control module is configured to initiate regulation of power to the conductive feature when the voltage output from the conductive feature exceeds the reference voltage output.

An improved intrinsically safe mobile device is designed to reduce sparking risk and surface heating while still maintaining a form factor, processing speed, and functionality comparable to conventional mobile devices. Non-intrinsically safe electronic components are mounted on an unprotected part of a printed circuit board (PCB) contained within the mobile device and are encapsulated to reduce risk of sparking and to minimize surface heating to enable the encapsulated electronic components to be certified as intrinsically safe. The encapsulated electronic components are connected using a trace with intrinsically safe electronic components mounted on a protected part of the PCB and are connected with user interface components using FPC cabling. The trace and FPC cabling are certified as intrinsically safe using one or more protection techniques, such as through use of a resistor, a double MOSFET clamping circuit, a capacitor, a fuse, or maintaining a minimum clearance space.

A circuit board accommodates a plurality of different source voltages. On the circuit board, a printed wire which constitutes a circuit is formed, a first circuit component used for a board which meets specifications for a first voltage or a second circuit component used for a board which meets specifications for a second voltage higher than the first voltage, is mounted, and spacing between adjacent printed wires is equal to or larger than a distance which secures an insulation distance when the second voltage is input.