The disclosed technology relates to a power supply circuit that utilizes an integrated power module that has a first and second power converter disposed on opposite sides of an inductor core. The power supply circuit includes an inductor core comprising a plurality of nano-magnetic layers embedded within a printed circuit board, a first winding disposed on a first outer surface of the inductor core, a second winding disposed on a second outer surface of the inductor core, a first active layer disposed on an outer surface of the first winding, a second active layer disposed on an outer surface of the second winding, a first capacitor tile disposed on an outer surface of the first active layer, and a second capacitor tile disposed on an outer surface of the second active layer.

The present disclosure relates to a structure for electrically-connecting an external conductor. The structure comprises a wiring-substrate comprising a stack based arrangement of a plurality of layers, wherein said layers are defined as electrically conducting layers and insulating layer. A rivet is supported from the wiring substrate and comprises an embedded portion within the wiring substrate. The embedded portion comprises: an upper section extending through the stack of the plurality of layers, and, a bottom section extending laterally with reference to the upper section. A portion protruding from wiring substrate is provided for receiving an external-conductor and for thereby electrically connecting with the wiring substrate.

A semiconductor module parallel circuit includes: a plurality of power semiconductor modules; and a multilayer substrate that interconnects the plurality of power semiconductor modules, each of the power semiconductor modules includes: a power semiconductor switching element; a first signal terminal connected to a gate potential of the power semiconductor switching element; and a second signal terminal connected to a source potential of the power semiconductor switching element, the multilayer substrate includes: an external connection terminal; first signal terminal connection patterns connected to the first signal terminals of the power semiconductor modules; and second signal terminal connection patterns connected to the second signal terminals of the power semiconductor modules, and inductances of gate wiring for the plurality of power semiconductor modules, from the external connection terminal to the first signal terminal connection pattern and from the second signal terminal connection pattern to the external connection terminal are equal to one another.

A carrier board and a power module using the same are disclosed. The carrier board includes a main body, two metal-wiring layers and at least one metal block. The main body includes at least two terminals and a surface. The two terminals are disposed on the surface. The two metal-wiring layers are disposed on the main body to form two parts of metal traces connected to the two terminals, respectively. The at least one metal block is embedded in the main body and connected to one of the two terminals. A thickness of the two parts of metal traces is less than that of the metal block. The two terminals connected by the two parts of metal traces have a loop inductance less than or equal to 1.4 nH calculated at a frequency greater than 1 MHz.

An object of the present invention is to improve the component mounting efficiency. An electronic control unit of the present invention includes: a power board 23 that includes a first insertion hole portion R1A having a plurality of holes 23Aa-2U, 23Aa-2V, and 23Aa-2W through which a coil wire of a first system is inserted and a second insertion hole portion R2A having a plurality of holes 23Aa-2U, 23Aa-2V, and 23Aa-2W through which a coil wire of a second system is inserted; a control board 25 provided on an upper part of the power board 23; and a board-to-board connector 105 that electrically connects the power board 23 and the control board 25. The first insertion hole portion R1A and the second insertion hole portion R2A are collectively arranged on the same side of the power board 23.

A solder joint which is used in power devices and the like and which can withstand a high current density without developing electromigration is formed of a Sn—Ag—Bi—In based alloy. The solder joint is formed of a solder alloy consisting essentially of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn. The solder alloy may further contain at least one of Ni, Co, and Fe.

An electrical power assembly, comprising: at least one multilayer base structure, at least one power device embedded in the at least one multilayer base structure, an internal electrically conductive layer positioned on each side of the multilayer base structure, the internal electrically conductive layer being connected to a respective electrical contact of the power device through connections arranged in the multilayer base structure; at least one external electrically conductive layers positioned on each side of the base structure, each external electrically conductive layer comprising at least one pre-drilled through hole, at least one internal electrically insulating layer positioned between the internal electrically conductive layer of the base structure and a respective external electrically conductive layer, at least one hole arranged in the internal electrically insulating layer and the external electrically conductive layer, a portion of each hole being formed by the pre-drilled through hole, the at least one hole being filled with electrically conductive material to form external conductive vias to connect the internal electrically conductive layer to the respective external electrically conductive layer.

An apparatus includes a circuit board and a plurality of bus bars fixed to the circuit board. The plurality of bus bars may include a first bus bar and a second bus bar formed from adjacent portions of a bus bar wire. The first bus bar may include a first bus bar first unplated portion and the second bus bar may include a second bus bar first unplated portion. The first bus bar first unplated portion and the second bus bar first unplated portion may be formed during formation of the first bus bar.

An object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection terminals. The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.

A bus-bar system 100 includes at least one bus-bar terminal 10. Each Bus-bar terminal 10 includes a first portion 10a, a second portion 10b and an intermediate portion 10c. The first portion 10a is connected to a heating element 20 of a heating block 22. The second portion 10b is connected to a Printed Circuit Board (PCB) 30 held within a casing 32 and the intermediate portion 10c connects the first portion 10a to the second portion 10b. The first portion 10a and the second portion 10b are offset from each other and the offset is based on desired position and orientation of the Printed Circuit Board (PCB) 30 held inside the casing 32 with respect to the heating elements 20.