Provided is a method of measuring eccentricity of a blind via hole formed in a printed circuit board including an inner-layer board and an outer-layer board that are bonded by thermocompression bonding. The method includes acquiring, by a microscope camera, an image by photographing a marker which is formed on a surface of the outer-layer board and a blind via hole which is exposed upward through a marker hole formed in a center of the marker with a microscope camera, and measuring, by computing equipment connected to the microscope camera, eccentricity indicating a separation distance and a separation direction from central coordinates of the marker hole to central coordinates of the blind via hole using a distance between an end point of the marker hole and an end point of the blind via hole which are included in the image.

A method of inspecting a printed wiring board includes preparing a printed wiring board having product and inspection regions such that the board has inner-layer lands in the regions, forming vias on the inner-layer lands in the regions, forming outer peripheral part(s) in the wiring board such that the outer peripheral part(s) expose outer peripheral portion(s) of the inner-layer land in the inspection region, determining a center coordinate of the inner-layer land in the inspection region based on a position of the outer peripheral part(s), determining a center coordinate of the via(s) in the inspection region based on a shape of the via(s) in the inspection region, determining a misalignment amount based on a distance between the center coordinate of the inner-layer land and the center coordinate of the via(s) in the inspection region, and determining alignment accuracy between the via and the inner-layer land based on the misalignment amount.

A display device includes a film align pad disposed under a connection film connected to a display panel and including a base lead and an align lead. The base lead extends in a first direction and the align lead protrudes from the base lead in a second direction intersecting the first direction. A board align pad is disposed on a printed circuit board, is connected to the connection film, and includes a base land and an align land. The base land extends in the first direction and the align land protrudes from the base land in the second direction.

A circuit board includes a board including a first surface and a second surface opposing the first surface, where the board includes at least one conductive layer and at least insulating layer, a plurality of electronic elements disposed on the first surface of the board, and a plurality of resistive pads disposed on the second surface of the board and electrically connected to at least one selected from the electronic elements. The resistive pads have a resistance of zero ohm.

A printed circuit board includes an electronic component including a first land, a printed wiring board including a resist portion and a second land, and a connecting portion interconnecting the first land and the second land. An opening larger than the first land in plan view from the electronic component side is defined in the resist portion. In plan view from the electronic component side, the first land is disposed inside the opening, the second land including a body portion disposed inside the opening and a protruding portion protruding from the body portion, the body portion being disposed further on an inside than an outer edge of the first land, and at least part of the protruding portion protruding further to an outside than the first land.

An article comprises a superficial watermark located on a first surface. The article also comprises an embedded watermark that is embedded within the article. The embedded watermark may be viewed by an X-ray camera. A method comprises applying a metal-containing mixture to an inner layer of an article, resulting in an embedded watermark within the article. The method also comprises analyzing the properties of metal particles within the mixture. The method also comprises recording the first property.

A circuit board structure includes a circuit board body having an adsorption surface; an auxiliary board on which a binding mark is disposed. The auxiliary board is spliced to the circuit board body, and a surface of the auxiliary board is flush with the adsorption surface. A part of the adsorption surface and a part of the surface of the auxiliary board together form an adsorption zone.

An electronic apparatus includes: an electronic module; and a flexible substrate electrically connected to the electronic module. The flexible substrate includes: a base film; a plurality of first contact pads arranged at one end on the base film in a first direction, and electrically connected to the electronic module; a plurality of second contact pads arranged at an other end on the base film in the first direction; a plurality of first wires arranged on the base film, and each electrically connecting one of the first contact pads and one of the second contact pads together, and a plurality of third contact pads arranged on the base film, each of the third contact pads being positioned along the first direction between one of the first contact pads and one of the second contact pads, and being electrically connected to one of the first wires.

A semiconductor device is provided that includes a frontside and a backside, four sidewalls, a first solder/glue connection on the frontside and a second solder/glue connection on the backside. The semiconductor device is either connected as a chip scale package to a printed circuit board or inside a semiconductor package via one of the four sidewalls, so that the first solder/glue connection and the second solder/glue connection are visible for a visual solder/glue inspection.

A solder printing inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder on the substrate on which a thermosetting adhesive is applied, the solder printing inspection device including: an irradiator that irradiates the solder with light; an imaging device that takes an image of the irradiated solder; a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group; outputs mounting position adjustment information to the component mounting machine.