Display device and fabrication method are provided. The display device includes a first substrate and a flexible circuit board. The first substrate includes a step region, first alignment marks, and a base substrate. The step region includes a bonding region and the bonding region includes a plurality of first pads arranged in at least one row along a first direction. The flexible circuit board is bonded in the bonding region and includes second alignment marks. Orthographic projections of the first alignment marks on a plane of the base substrate do not overlap an orthographic projection of the flexible circuit board on the plane of the base substrate, and do not overlap orthographic projections of the second alignment marks on the plane of the base substrate.

The invention, which relates to the technical field of inductance embedding, specifically discloses an embedded circuit board. The embedded circuit board includes: at least layer of sub-body, where preset positions of the sub-bodies are provided with through slots; and an inductance element embedded within the slots and configured to be spaced apart from sidewalls of the slots. In the above manner, it is possible to make the embedded circuit board of the present application structurally compact, highly integrated, widely applicable, and safe and reliable.

Provided is a carrier-attached metal foil with which both exposure for rough circuits and exposure for fine circuits in wiring formation can be performed based on the same alignment marks, and as a result, rough circuits and fine circuits can be simultaneously formed in a one-stage circuit formation process. This carrier-attached metal foil is a carrier-attached metal foil including a carrier, a release layer provided on at least one surface of the carrier, and a metal layer provided on the release layer, wherein the carrier-attached metal foil includes: a wiring region throughout which the carrier, the release layer, and the metal layer are present; and at least two positioning regions provided on the at least one surface of the carrier-attached metal foil and forming alignment marks used for positioning in wiring formation involving exposure and development.

A grid clustering-based system for locating abnormal area of solder paste printing and a method thereof are disclosed. In the system, an analysis device divides circuit board size information to generate divided grids based on grid size information, when a total number of at least one bad solder joint of one of the divided grids is determined to be higher than or equal to a density threshold value, the analysis device sets the one of divided grids as a high dense grid, the analysis device then integrates the divided grids, which are high dense grids and interconnected to each other, as a high-dense bad solder joint area. Therefore, the technical effect of integrating high dense areas of bad solder joint to locate the bad solder joint can be achieved.

A method for controlling a PCBA data distributed ledger located on blockchain network and a system for implementing the method are disclosed. The method may comprise scanning, by an optical label reader, an optical label located on a PCB and decoding, by an entity device, the optical label. The method may further include receiving, by a ledger controller, a request to access a distributed ledger from the entity device; verifying, by the blockchain nodes, a public key received from the entity device; determining, by the ledger controller, whether a private key received from the entity device matches a stored login credential; and determining whether to allow the entity device to access at least a first block on the distributed ledger.

Flexible circuits are described including markings that indicate connections between their flat-wire conductors and specific circuits of a vehicle electrical system. Wire conductors within the flexible circuit share connections with different circuits of the vehicle electrical system. To indicate a connection between a wire conductor and a vehicle circuit, the flexible circuit includes one or more human or machine-readable marks specifically indicating the connection, in some cases, at a position where the connection is to be made. The marks can include etchings or printings on the wire conductors or printings on or otherwise visible from the insulating body that protects the wire conductors.

A method for ink jet printing of a substrate, as well as an ink jet printed layer. To provide a method for ink jet printing of a substrate that is particularly fast and energy-conserving and does not require any systems with high procurement and operating costs, initially a substrate is supplied, which is then coated with a layer of a print medium on at least one surface. A labeling of the substrate is carried out by applying the same print medium to result in a different color shade of the printed layer.

Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

An organic light emitting diode (OLED) display device is provided. The OLED display device includes a display panel and a camera. A first alignment mark is formed on a low pixel density area of the display panel, a second alignment mark is formed in the camera, and arrangements of the first alignment mark and the second alignment mark are consistent. Therefore, an alignment accuracy between the camera and the display panel is improved, and a purpose of adopting a blind hole in the area where the camera is mounted on the display device and displaying normally is achieved.

A display device includes: a display panel including a display area and a non-display area; a flexible printed circuit board overlapping and attached to the display panel; a pair of first alignment indicia disposed in the non-display area; a pair of second alignment indicia adjacent to the first alignment indicia; a pair of third alignment indicia disposed on the flexible printed circuit board.