The invention relates to an electronic module (40) comprising at least one printed circuit board of a first type (referred to as “printed circuit board A”), which is equipped in an overlapping manner with at least one printed circuit board of a second type (referred to as “printed circuit hoard B”), printed circuit board B being equipped with at least one electronic component with specific requirements (19), and the interconnected printed circuit boards A and B forming a stepped composite printed circuit board (100, 200, 300, 400, 500). The composite printed circuit board (100, 200, 300, 400, 500) is delimited at least in some regions by end regions (16) which are formed by sections of the at least one printed circuit board A, and the composite printed circuit board (100, 200, 300, 400, 500) is placed on a heat sink (20). A fastening side (15) of the at least one printed circuit board B rests flat on a contact face (21) of the heat sink (20), the contact face (21) of the heat sink (20) being dimensioned and positioned such that at least part of it extends laterally beyond the fastening side (15) of the at least one printed circuit board B in each case towards the end regions (16) formed. Supporting elements (23, 24, 25, 26) are formed on the contact face (21) of the heat sink for the mechanical support of the end regions (16). The invention also relates to a method for producing such an electronic module.

A display device may include a main flexible printed circuit including a first alignment mark and electrically connected to a first panel; and a touch flexible printed circuit including a second alignment mark and electrically connected to a second panel that is perpendicular to the first panel, wherein the main flexible printed circuit is electrically connected to the touch flexible printed circuit through a pad region, and the touch flexible printed circuit includes a first overcoat region disposed between the first alignment mark and the second alignment mark.

There is described an electronic device testing system for testing an electronic device having a substrate on which is printed a metamaterial structure using an ink. The electronic device testing system generally has: a terahertz radiation emitter configured to emit an incident terahertz radiation beam to be incident on the metamaterial structure of the substrate, the incident terahertz radiation beam having power at least at the terahertz resonance frequency of the metamaterial structure; a terahertz radiation receiver configured to receive an outgoing terahertz radiation beam outgoing from the metamaterial structure and to measure an amplitude of an electric field of the outgoing terahertz radiation beam at least at the terahertz resonance frequency; and a controller configured to determine a conductivity value indicative of a conductivity of the ink based on said amplitude of the electric field of the outgoing terahertz radiation beam.

The invention, which relates to the technical field of inductance embedding, specifically discloses an embedded circuit board. The embedded circuit board includes: at least layer of sub-body, where preset positions of the sub-bodies are provided with through slots; and an inductance element embedded within the slots and configured to be spaced apart from sidewalls of the slots. In the above manner, it is possible to make the embedded circuit board of the present application structurally compact, highly integrated, widely applicable, and safe and reliable.

A substrate with built-in component includes: a first wiring layer having at least one reference pattern; a first insulating layer formed on the first wiring layer; and an electronic component mounted, in a cavity formed in the first insulating layer, on the first wiring layer, wherein the at least one reference pattern includes at least one first portion crossing a side surface of the electronic component in plan view, and at least one second portion crossing a side surface of the cavity in plan view.

The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

In order to realize stable quality control, provided is a quality control device (1) having an input device which receives data such as an operation condition of each device (21) to (26) in a production system (20) for producing a product; a calculation unit which assigns a value of the operation condition to a correlation formula calculated in advance and calculates a value derived from the correlation formula; and a determination unit which performs good or bad determination on a quality of a workpiece in each process, on the basis of a result calculated by the calculation unit. Further, when “bad” is determined as a result of the good or bad determination, the quality control device (1) calculates an appropriate value of the operation condition and sets the value to each device (21) to (26).

A display device includes a display substrate including a display area and a pad area, which is disposed on the periphery of the display area; and a display panel including at least one wire pad, which is disposed in the pad area of the display substrate, where the wire pad includes a main pad portion, which extends in a first direction, a first protruding pad portion, which protrudes from a first side, in a second direction intersecting the first direction, of the main pad portion, and a second protruding pad portion, which protrudes from a second side, in the second direction, of the main pad portion, and the first protruding pad portion is disposed closer than the second protruding pad portion to the display area.

Disclosed is an apparatus for fabricating a stretchable electrical circuit, including: a stretching device configured to stretch a mounted stretchable substrate in two different directions; a marking device configured to mark a mark on the stretchable substrate; an image device configured to obtain an image of the stretchable substrate on which a plurality of alignment marks are marked by the marking device; and a control device configured to control the stretching device, the image device, and the marking device. The control device forms a first axis and a second axis using the plurality of alignment marks marked on the image obtained by the image device and marks one point of a surface of the stretchable substrate with coordinates made by the first axis and the second axis using the first axis and the second axis.

A manufacturing method of a display device includes: loading, on a stage, a panel assembly including: a display panel drivable to display an image, and first and second printed circuit boards attached to the display panel, end portions of the first and second printed circuit boards overlapping each other; providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion away from and expose the end portion of the first printed circuit board; fixing the raised end portion away from the exposed end portion of the first printed circuit board; pre-processing the exposed end portion of the first printed circuit board; and aligning a distal end of the pre-processed end portion of the first printed circuit board and a distal end of the end portion of the second printed circuit board.