A display apparatus may include a display panel and a plurality of flexible printed circuit boards connected to the display panel. The display panel may include first regions arranged in a first direction and may include a plurality of first alignment marks, which are respectively provided on the first regions and are arranged in the first direction. Each of the flexible printed circuit boards may include a plurality of second alignment marks arranged in the first direction and overlapped with the first alignment marks, an insulating layer spaced apart from the second alignment marks in a second direction crossing the first direction, and a plurality of supplementary alignment marks spaced apart from the second alignment marks by a first distance in the second direction, the supplementary alignment marks being openings defined in the insulating layer.

The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion.

A method of inspecting a printed wiring board includes preparing a printed wiring board having product and inspection regions such that the board has inner-layer lands in the regions, forming vias on the inner-layer lands in the regions, forming outer peripheral part(s) in the wiring board such that the outer peripheral part(s) expose outer peripheral portion(s) of the inner-layer land in the inspection region, determining a center coordinate of the inner-layer land in the inspection region based on a position of the outer peripheral part(s), determining a center coordinate of the via(s) in the inspection region based on a shape of the via(s) in the inspection region, determining a misalignment amount based on a distance between the center coordinate of the inner-layer land and the center coordinate of the via(s) in the inspection region, and determining alignment accuracy between the via and the inner-layer land based on the misalignment amount.

A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal supporting layer; roughening the surface of the insulating layer; forming a conductive pattern on the insulating layer; and inspecting the presence or absence of a defect of the conductive pattern by using an inspection device provided with a light emitting portion emitting incident light that enters the insulating layer and the conductive pattern and a light receiving portion receiving reflected light that is reflected from the incident light. The incident light has a wavelength in the range of 435 to 500 nm and includes inclined light that inclines so as to form an angle of more than 0° to not more than 30° with respect to the optical axis thereof.

A module includes a substrate, a component mounted on a top surface that is one principal surface of the substrate, a first shielding film provided on a top surface and a side surface of the component, a sealing resin provided on the top surface of the substrate and seals the component, and a second shielding film provided on a top surface of the sealing resin. A hole is provided on a top surface of the sealing resin, to reach at least a part of the first shielding film. The second shielding film disposed in the hole is brought into contact with the first shielding film at positions facing a top surface and a side surface of the component.

A radiation curable inkjet ink comprising a polymerizable compound, a photoinitiator characterized in that the inkjet ink further comprises a di- or multifunctional alkoxysilane and a monofunctional alkoxysilane functionalized with a group selected from the group consisting of an epoxide and an oxetane.

Disclosed herein are a method of fabricating a stretchable electrical circuit and an apparatus for fabricating a stretchable electrical circuit, wherein the method of fabricating a stretchable electrical circuit includes stretching a stretchable substrate, forming a plurality of alignment marks on a surface of the stretchable substrate, forming a first axis extending from a line connecting two alignment marks among the plurality of alignment marks, and a second axis perpendicular to the first axis, marking one point of the surface of the stretched stretchable substrate with coordinates made by the first axis and the second axis, and disposing electrical components using the coordinates.

A circuit board and a display device are provided. The circuit board has a device area and a peripheral area surrounding the device area. The circuit board includes a substrate, a metal layer, a first insulating layer, an adhesive layer, and an adhesive overflow detection line. The metal layer, the first insulating layer, and the adhesive layer are disposed at a same side of the substrate. The metal layer and the first insulating layer cover at least a part of the peripheral area. The metal layer is disposed between the first insulating layer and the substrate. The adhesive layer is disposed at a side of the first insulating layer away from the substrate and in the peripheral area. The adhesive overflow detection line is located in the metal layer and the metal layer in the peripheral area is provided with hollow parts; and/or the adhesive overflow detection line is located in the first insulating layer and a portion of the first insulating layer in the peripheral area has a color different from other portions.

Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

An electronic assembly includes a substrate having in a first zone a low contrast first conductive pattern; a high contrast fiducial mark in a second zone of the substrate different from the first zone, wherein the fiducial mark and the first conductive pattern are in registration; and a second conductive pattern aligned with the first conductive pattern.