This application relates to a method and apparatus formed using the method. The method includes using a first process to form at least one conductive trace on a flexible surface and using a second process to form at least one bead of fluid conductive material at a first location. The method also includes positioning at least one printed circuit board overlaying conductive trace such that the at least one bead of fluid conductive material is aligned with at least one hole in the printed circuit board and pushing the printed circuit board towards the flexible surface. The pushing of the printed circuit board toward the flexible surface forces the bead of fluid conductive material through the hole to form an electrical connection between the at least one conductive trace and an upper surface of the printed circuit board.

A circuit board includes a support member having a first major surface and a second major surface opposite the first major surface, and an elastic interconnect substrate having a first surface and a second surface opposite the first surface, at least part of the second surface being fixed to the first major surface and the second major surface of the support member, wherein the first surface of the interconnect substrate includes a circuit region where an electronic component is mounted and at least one electrode region where at least one external electrode is arranged, wherein the circuit region is disposed indirectly on the first major surface of the support member, and wherein the interconnect substrate is bent around the support member, and at least part of the electrode region is disposed indirectly on the second major surface of the support member.

A pointing stick assembly includes: a head having a top surface configured to interface with a finger; a shaft connected to the head, wherein the shaft configured to be moved downward based on a finger pressing down on the head and to be tilted based on a finger tilting the head; a first sensor layer comprising a receiver electrode and a transmitter electrode; a second sensor layer comprising a transmitter electrode; and a third sensor layer comprising a plurality of receiver electrodes. The first sensor layer is configured for detection of presence of a finger based on a change in capacitance between the receiver electrode and the transmitter electrode of the first sensor layer caused by the presence of the finger on the top surface of the head.

A display device is provided and includes a display panel; and a wiring board comprising a flexible base, a terminal electrically connected to the display panel, wherein the flexible base including a first surface, a second surface on an opposite side to the first surface, and a concavity in the second surface, the wiring board is mounted on the display panel and is bent so that the wiring board is opposed to a rear surface side of the display panel, and the concavity is provided in the portion of the wiring board which is bent.

A display screen and an electronic device are provided. The display screen includes an FPC, where the FPC includes a flexible substrate, a first pin, and a second pin, and the first pin and the second pin are disposed on the flexible substrate at an interval; and the flexible substrate is provided with a charge-isolating portion that is disposed between the first pin and the second pin; or the FPC further includes a packaging portion and a moisture-isolating layer, where the packaging portion covers part of the first pin and part of the second pin, and the moisture-isolating layer is disposed between the first pin and the packaging portion and between the second pin and the packaging portion.

An extensible and contractible wiring board includes first and second extensible and contractible wiring substrates formed by respective wiring at extensible and contractible substrates. Each of the first and second extensible and contractible wiring substrates has a first end having functional units and an intermediate wiring portion, with the wiring and the functional units of the first and second extensible and contractible wiring substrates not electrically connected. Moreover, the first and second extensible and contractible wiring substrates are electrically independent extensible and contractible wiring substrates, and the wirings and the functional units do not overlap at the first ends of the first and second extensible and contractible wiring substrates in top view of the extensible and contractible wiring board, and the intermediate wiring portions of the first and second extensible and contractible wiring substrates overlap in top view of the extensible and contractible wiring board.

A method for characterizing a state of an end effector of an ultrasonic device is disclosed. The ultrasonic device including an electromechanical ultrasonic system defined by a predetermined resonant frequency. The electromechanical ultrasonic system further including an ultrasonic transducer coupled to an ultrasonic blade. The method including applying, by an energy source, a power level to the ultrasonic transducer, measuring, by a control circuit coupled to a memory, an impedance value of the ultrasonic transducer, comparing, by the control circuit, the impedance value to a reference impedance value stored in the memory; classifying, by the control circuit, the impedance value based on the comparison; characterizing, by the control circuit, the state of the electromechanical ultrasonic system based on the classification of the impedance value; and adjusting, by the control circuit, the power level applied to the ultrasonic transducer based on the characterization of the state of the end effector.

A display module is provided. The display module includes: a display panel, a light control panel, at least one first circuit board for the display panel, and at least one second circuit board for the light control panel. The display panel and the light control panel are stacked, the display panel is on a light-emitting side of the light control panel, a light-emitting surface of the display panel is on a first surface, and at least part of an orthographic projection of any one of the at least one first circuit board on the first surface does not overlap with an orthographic projection of the at least one second circuit board on the first surface in a direction perpendicular to the first surface.

An electronic device may be provided with a conductive housing sidewall and a phased antenna array that conveys radio-frequency signals at frequencies greater than 10 GHz. Each antenna in the array may radiate through a respective aperture in the sidewall. The antenna module may include a folded flexible printed circuit having a first portion and a second portion that extends from an end of the first portion and that is folded with respect to the first portion. The antennas in the phased antenna array may have antenna resonating elements that are distributed between the first and second portions. Forming the antenna module from a folded flexible printed circuit in this way may serve to minimize the thickness of the antenna module, thereby allowing the antenna module to fit between a ledge of the sidewall and a rear housing wall without occupying excessive space within the device.

A structure to apply flexing to an object to test resilience to being bent has a first portion and a second portion. The structure includes a base, a rotating member, a pressing plate, and an adjusting assembly. The base defines first and second receiving grooves, and the second receiving groove receives the first portion. The rotating member on the base is partially received in the first receiving groove. An abutting surface of the rotating member is recessed to form a third receiving groove which receives the second portion. The pressing plate on the base presses against the first portion. The adjusting assembly controls the rotating member to rotate towards the base about a desired angle, thereby causing the second portion to be bent with respect to the first portion.