An aerosol generation device includes an electrical power source; a heating chamber operable to heat an aerosol substrate to generate an aerosol; first control circuitry configured to control the supply of electrical power from the electrical power source to the heating chamber; and a housing comprising a mouth end and an opposing end. The electrical power source, the heating chamber and the first control circuitry are arranged in an internal volume of the housing, the heating chamber being arranged between the first control circuitry and the mouth end, and the first control circuitry being arranged between the heating chamber and the electrical power source.

An electronic device and a method for manufacturing a flexible circuit board are provided. The electronic device includes the flexible circuit board. The flexible circuit board includes a first flexible substrate, a first seed layer, a first conductive layer, and a second seed layer. The first seed layer is disposed on the first flexible substrate. The first conductive layer is disposed on the first seed layer. The second seed layer is disposed on the first conductive layer. The first seed layer is in contact with the first conductive layer.

A light control unit includes a wiring member including a mount section and an extending section, and a light control sheet that includes a light control layer formed between first and second transparent electrodes. The first transparent electrode has a first wiring region which is exposed from the light control layer, the second transparent electrode has a second wiring region which is exposed from the light control layer, the mount section is in the first wiring region and extends in a first direction along the edge portion of the first transparent electrode, the extending section extends from the mount section toward an outside of the first transparent electrode, the mount section has a first width along a first perpendicular direction perpendicular to the first direction, and the extending section has a second width greater than the first width of the mount section.

A substrate support structure includes: a substrate support including: a support body; and a protrusion including a base portion and a leading-end portion, the protrusion protruding from the support body; and a substrate having: a substrate body; a through hole provided at the substrate body; and a protruded portion surrounding the through hole, the protruded portion protruding from a first face of the substrate body, in which the base portion of the protrusion passes through the through hole, and the leading-end portion protrudes from the first face of the substrate body inside the protruded portion and engages with the substrate body such that the through hole is covered.

A flexible display apparatus including a flexible display panel, a driving chip and a hot-melt protective layer is provided. The flexible display panel has a display area and a bonding area located outside the display area. The driving chip is disposed on the bonding area of the flexible display panel via at least one flexible circuit board. The hot-melt protective layer is disposed on the display area and a portion of the flexible circuit board. The hot-melt protective layer locates on a top surface of the flexible display panel.

A planar antenna includes: a radiating element; a flexible dielectric film portion; a power feeder line provided for the dielectric film portion, and configured to feed power to the radiating element; a first ground conductor facing against the radiating element; and an antenna base having a dielectric layer disposed between the radiating element and the first ground conductor. The dielectric film portion extends from a side surface of the antenna base. The dielectric layer is thicker than the dielectric film portion.

A display apparatus including a flexible substrate, the flexible substrate including a first area where an image is displayed, a second area separated from the first area, and a bending area between the first area and the second area; a display on the first area of the substrate; a pad on the second area of the substrate; and a plurality of wirings on the substrate, the plurality of wirings including a first wiring having a first shape; and a second wiring having a second shape that is different from the first shape, the first wiring and the second wiring passing through the bending area.

A method of fabricating an electromagnet includes obtaining a first flexible PCB that includes one or more first conductive coiled traces and obtaining a second flexible PCB that includes one or more second conductive coiled traces. The first flexible PCB is bent into a shape having at least one curve or corner. With the first flexible PCB having been bent into the shape, the second flexible PCB is then bent into the shape: the second flexible PCB is positioned adjacent to the first flexible PCB to conform with the first flexible PCB. The second flexible PCB may substantially surround the first flexible PCB. An electrostatic deflector may be disposed concentrically with the first and second flexible PCBs.

The subject matter of the present disclosure may be embodied in devices, such as flexible wiring, that include: an elongated flexible substrate; multiple electrically conductive traces arranged in an array on a first side of the elongated flexible substrate; and an electromagnetic shielding layer on a second side of the elongated flexible substrate, the second side being opposite the first side, in which the elongated flexible substrate includes a fold region between a first electronically conductive trace and a second electrically conductive trace such that the electromagnetic shielding layer provides electromagnetic shielding between the first electronically conductive trace and the second electrically conductive trace.

A transformer includes a core portion having a magnetic property and having a through hole formed therein, and a first coil portion formed with a first circuit board on which circuit patterns are printed on one surface thereof, having a shape enclosing a part of the core portion while penetrating the through hole of the core portion, and formed to be bent so that both side end portions of the first circuit board are connected to each other.