A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures. The polymeric material can be heated to conform or form-fit to planar and non-planar surfaces/geometries, and can be selectively heated at various portions to tailor or customize the interconnect density of the microstructures at selected portions. Associated electrical conducting assemblies and methods are provided.

An object is to solve problems associated with a stretchable wire member that includes, for example, a garment with stretchable wires formed thereon, that is, to solve the problems of wrinkles and undulations that often occur after the garment is stretched. A stretchable wire member includes a fabric; a base layer disposed on a surface of the fabric; a conductive layer disposed in part of the fabric, the conductive layer being on a surface of the base layer; and a protective layer covering the conductive layer. In the stretchable wire member, an elastic modulus E′3 of a multilayer body portion including the fabric, the base layer, and the protective layer ranges from 1 MPa to 6 MPa.

An elastic mounting board that includes: a first elastic substrate; an elastic wiring on a first main surface of the first elastic substrate; an electrode electrically connected to the elastic wiring; and a functional component mounted in a mounting portion of the first elastic substrate and electrically connected to the elastic wiring, in which the mounting portion having the functional component is folded back such that the functional component will face a first main surface side of the elastic mounting board and the electrode will face a second main surface side of the elastic mounting board.

An electronic component (1) is connected to a conductive track (2) on a flexible substrate (3). A connection layer (4) of a composition comprising a thermoplastic material (TPM1) is provided on the conductive track (2). The connection layer (4) has at least one cutout (5) aligned to overlap the conductive track (2). A thermosetting material (TSM1) in liquid state is used to fill the cutout (5). The electronic component (1) is provided on top of the connection layer (4). By applying heat, a temperature of the connection layer (4) is raised to above a softening temperature of the thermoplastic material (TPM1). Pressure is applied to form a mechanical connection. By the application of heat (H) a temperature of the thermosetting material (TSM1) is raised above its thermosetting temperature for olidifying the thermosetting material (TSM1) and forming an electrical connection (E).

Provided is a sheet-like device suitable for a flexible electrical product that is robust, highly flexible, and operates stably. The sheet-like device includes a first part where a first film layer, a first conversion unit, and a second film layer overlap, a second part where the first film layer is absent and the second film layer is present, and a third part where the first film layer, a second conversion unit, and the second film layer overlap. The first part the second part, and the third part are arranged side by side in this order in a first direction. A first region including the first part the second part, and the third part has an elongation per unit length greater than an elongation per unit length of the first film layer alone when a same force is applied in the first direction at 20° C.

A film for an electronic substrate according to an embodiment has a moisture-absorption rate of less than 0.3% of the initial weight when immersed in water for 24 hours, and thus is less susceptible than existing films for electronic substrates are to changes in dimension or degradation in electrical characteristics caused by containing moisture according to changes in temperature and humidity. Also, the film for an electronic substrate is equal or superior to existing films in terms of flexibility and physicochemical characteristics, and thus may be applied to the manufacture of laminates with a conductive film such as FCCL and electronic substrates such as FPCB to improve processability, durability, transmission capacity, etc.

A kirigami enabled manufacturing method and systems are provided. The method includes providing a plurality of substrate units for mounting electronic devices in an initial state; providing at least one connector connecting adjacent substrate units of the plurality of substrate units in the initial state, wherein the at least one connector includes one or more foldable areas defined by a plurality of creases and n stretchable layers stacking on one another; folding the one or more foldable areas of the connector along the plurality of creases by 180°; and flipping and expanding the n stretchable layers of the connector into one layer of a planar predetermined pattern connecting the plurality of substrate units. The enabled manufacturing method and systems expand a small area of thin film material to a large area network by the folding and expanding processes.

A printed circuit board is provided. The printed circuit board includes: an extending region extending along one direction, and a bending region configured to bend with respect to the extending region. The extending region and the bending region includes a non-conductive layer, a first conductive layer disposed on one surface of the non-conductive layer, a second conductive layer disposed on the other surface of the non-conductive layer, and at least one via hole penetrating the non-conductive layer, the first conductive layer, and the second conductive layer. In the bending region, a cross-sectional area of the via hole in contact with the first conductive layer is less than a cross-sectional area of the via hole in contact with the second conductive layer.

A conductive textile includes a base cloth and a conductive film disposed on the base cloth. The conductive film includes a polyurethane resin and a silver bearing conductor, in which a content of the silver bearing conductor is 55 parts by weight to 80 parts by weight, and a content of the polyurethane resin is 8 parts by weight to 12 parts by weight.

Disclosed is a method of manufacturing a stretchable substrate according to various embodiments of the present disclosure for realizing the above-described objectives. The method may include generating an auxetic including a plurality of unit structures and adhering one or more elastic sheets to one surface of the auxetic.