An electronic device is provided. The electronic device includes a housing including a front surface plate, a rear surface plate, and a side surface portion providing a side surface, a first support positioned between the front surface plate and the rear surface plate and connected to the side surface portion, a display, a wireless communication circuit configured to transmit or receive a signal through an antenna radiator, camera circuitry positioned between the first support and the rear surface plate, and a conductive pattern positioned between the first support and the rear surface plate and at least partially overlapping with the camera circuitry when viewed from a top of the rear surface plate, and electrically connected to a ground of the electronic device, some electromagnetic waves, which travel toward the camera circuitry, among electromagnetic waves radiating from the antenna radiator, flow to the ground through the conductive pattern.

The description relates to electronic prototyping platforms. One example can include an electrically insulative substrate having generally opposing first and second major surfaces and that includes an orientation feature that is visible on both of the first and second major surfaces. The example can include a first mounting hole through the substrate that is bordered by a first electrical conductor associated with data transmission. The example can also include a second mounting hole through the substrate that is bordered by a second electrical conductor associated with electrical ground, and a third mounting hole through the substrate that is bordered by a third electrical conductor associated with electrical power. The example can also include an edge connector tab defined by the substrate and having three exposed electrically conductive contacts that are coupled to the data electrical conductor, the ground electrical conductor, and the power electrical conductor and insulated from one another.

A board terminal electrode component includes a board, and a pair of land pads spaced apart from each other on a surface of the substrate. The pair of land pads respectively include inner ends which are proximal to each other in an arrangement direction, and outer ends farther from each other in the arrangement direction than the inner ends. The pair of land pads respectively include expanding width portions expanding in a width direction from the inner end toward the outer end. The pair of land pads respectively include insulators on a surface of an end portion of the outer end of the land pads.

An electronic device includes a circuit board, a driving member, and a working member. The circuit board has a board body, conductive lines, and conductive pads. The board body has a working surface. The driving member includes a substrate, a thin film circuit, a thin film element, and connection pads. The thin film circuit corresponds to thin film element and is electrically connected to the connection pads, and the connection pads are connected to partial conductive pads. The substrate has a first top surface. The working member has at least one electrode electrically connected to one of the conductive pads. The working member has a second top surface. A first height is defined between the first top surface and the working surface, and a second height is defined between the second top surface and the working surface. The second height is greater than or equal to the first height.

A multilayer ceramic capacitor includes a multilayer body including dielectric layers, first inner electrodes, and second inner electrodes stacked on one another, a first outer electrode electrically connected to the first inner electrodes, and a second outer electrode electrically connected to the second inner electrodes. The multilayer body includes first and second side surfaces respectively including first and second recesses where a midsection of each of the first and second side surfaces in a length direction is recessed inward in a width direction. When the multilayer ceramic capacitor is viewed in a stacking direction, a dimension of each of the first and second recesses in the length direction is smaller on an inner side than on an outer side in the width direction.

A method is provided for forming a printed circuit board (PCB) assembly. The method may include drilling a first plurality of vias having a first diameter in a PCB and filling the first plurality of vias to form a first plurality of plated or filled vias. The method may also include drilling a second plurality of vias having a second diameter in the PCB, and filling the second plurality of vias to form a second plurality of plated or filled vias. The first plurality of plated or filled vias is mixed with the second plurality of plated or filled vias such that the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter and the second diameter.

A precursor body, of a flexible printed circuit, which is developed and provided on a bottom surface of a housing of a concentrator photovoltaic module for concentrating sunlight and generating power, includes: a plurality of strip-shaped flexible substrates extending in an X direction when one direction is defined as the X direction; a printed circuit unit including a plurality of cells mounted on the flexible substrates at equal intervals in the X direction and an electric circuit related to the cells; and a plurality of connection bands connecting the plurality of flexible substrates to each other in a state where the plurality of flexible substrates are aligned so as to be close to each other in a Y direction orthogonal to the X direction, the plurality of connection bands extending in the Y direction.

In accordance with various embodiments, lighting systems features multiple inter-connectable light panels each having multiple light-emitting elements thereon. One or more of the light panels features one or more connectors, and associated conductors, for the transmission of power, communication signals, and/or control signals.

A sensor unit includes a light-emitting unit including a light-emitting element configured to emit light, a light-receiving unit including a light-receiving element configured to receive the light emitted from the light-emitting element, a flag configured to pass through a space between the light-emitting unit and the light-receiving unit, and a board, wherein a cutout or a hole is formed in the board, wherein the light-emitting unit and the light-receiving unit are mounted on the mounting surface of the board so that the light-emitting element and the light-receiving element face each other, and the light emitted from the light-emitting element travels straight along the mounting surface of the board over the cutout or the hole, and wherein the flag moves in a direction intersecting the mounting surface of the board and enters the cutout or the hole, thereby blocking the light traveling from the light-emitting element to the light-receiving element.

There is provided a semiconductor apparatus including a memory controller; a CPU; a high-speed communication controller; a memory operation terminal group that includes a plurality of memory operation terminals for inputting a first signal propagating between an external memory group and the memory controller; a high-speed communication terminal group that includes a plurality of high-speed communication terminals for inputting a second signal to the high-speed communication controller; an inspection terminal group that includes a plurality of inspection terminals for acquiring information from the CPU and performing debugging; and a terminal mounting surface at which the memory operation terminal group, the high-speed communication terminal group, and the inspection terminal group are provided, in which at the terminal mounting surface, a first inspection terminal among the plurality of inspection terminals is located between the memory operation terminal group and the high-speed communication terminal group.