In accordance with various embodiments, lighting systems features multiple inter-connectable light panels each having multiple light-emitting elements thereon. One or more of the light panels features one or more connectors, and associated conductors, for the transmission of power, communication signals, and/or control signals.

A transparent light emitting device display comprising a transparent substrate; at least one light emitting device provided on the transparent substrate; and a first common electrode wiring unit, a second common electrode wiring unit, and a signal electrode wiring unit provided on the transparent substrate, in which the first common electrode wiring unit, the second common electrode wiring unit, and the signal electrode wiring unit comprise a metal mesh pattern.

A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

Flexible lighting apparatus and method of manufacturing the same disclosed. The flexible light apparatus includes a net-structured flexible printed circuit board (FPCB), being manufactured in shape of net structure in which a plurality of through-holes are formed separately from each other in a body of the net-structured FPCB, and having predetermined circuit patterns formed thereon, a plurality of light sources, being mounted on at least one of predetermined mounting location among intersection and branch of the net-structured FPCB, and a supporting layer, having apertures formed thereon and being fixed to support the net-structured FPCB at bottom surface.

A method is provided for forming a printed circuit board (PCB) assembly. The method may include drilling a first plurality of vias having a first diameter in a PCB and filling the first plurality of vias to form a first plurality of plated or filled vias. The method may also include drilling a second plurality of vias having a second diameter in the PCB, and filling the second plurality of vias to form a second plurality of plated or filled vias. The first plurality of plated or filled vias is mixed with the second plurality of plated or filled vias such that the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter and the second diameter.

In accordance with various embodiments, lighting systems features multiple inter-connectable light panels each having multiple light-emitting elements thereon. One or more of the light panels features one or more connectors, and associated conductors, for the transmission of power, communication signals, and/or control signals.

An apparatus comprising a printed circuit board (PCB) that includes: a multilayer lamination of layers; vias on a surface of the PCB; and bonding pads that couple a ball grid array of an integrated circuit (IC) package to layers through the vias, wherein the bonding pads includes: first bonding pads in a first area of the PCB, each first bonding pad being coupled to a via of the vias in the first area, second bonding pads arranged in a second area of the PCB, each second bonding pad being coupled to a via of the vias in the second area, and third bonding pads arranged in a third area of the PCB, each third bonding pad being coupled to two or more vias of the vias in the third area, wherein the third area is located between the first area and the second area is disclosed.

A microcapsule includes a shell including a conducting component, and a thermally expandable component contained in the shell and having a property of expanding by heating. The shell is deformable in accordance with expansion of the thermally expandable component when the thermally expandable component is heated.

An example printed circuit board includes a ground plane having a fusible region and a power plane. The power plane is isolated from the ground plane by an insulating layer. At least one circuit component is mounted to the ground plane and is positioned within the fusible region of the printed circuit board.

Methods, apparatus and systems are described. An apparatus includes a module body made of a polymer material. The module body includes a mounting surface adjacent a potting area. At least two lead frame elements are embedded in the polymer material of the module body. Each of the at least two lead frame elements has a first terminal side and a second terminal side in the component potting area. An LED element is on the mounting surface of the module body and electrically coupled to the first terminal side of the at least two lead frame elements.