An object of the present invention is to provide a method for easily producing an electroconductive laminate having a three-dimensional shape and having a metal layer disposed thereon (for example, an electroconductive laminate having a three-dimensional shape including a curved surface and a metal layer disposed on the curved surface). Another object of the present invention is to provide a three-dimensional structure with a plated-layer precursor layer, a three-dimensional structure with a patterned plated layer, an electroconductive laminate, a touch sensor, a heat generating member, and a three-dimensional structure.

The method for producing an electroconductive laminate of the present invention has a step of obtaining a three-dimensional structure with a plated-layer precursor layer including a three-dimensional structure and a plated-layer precursor layer disposed on the three-dimensional structure and having a functional group capable of interacting with a plating catalyst or a precursor thereof and a polymerizable group; a step of applying energy to the plated-layer precursor layer to form a patterned plated layer; and a step of subjecting the patterned plated layer to a plating treatment to form a patterned metal layer on the plated layer.

An apparatus comprising a printed circuit board (PCB) that includes: a multilayer lamination of layers; vias on a surface of the PCB; and bonding pads that couple a ball grid array of an integrated circuit (IC) package to layers through the vias, wherein the bonding pads includes: first bonding pads in a first area of the PCB, each first bonding pad being coupled to a via of the vias in the first area, second bonding pads arranged in a second area of the PCB, each second bonding pad being coupled to a via of the vias in the second area, and third bonding pads arranged in a third area of the PCB, each third bonding pad being coupled to two or more vias of the vias in the third area, wherein the third area is located between the first area and the second area is disclosed.

A board terminal electrode component includes a board, and a pair of land pads spaced apart from each other on a surface of the substrate. The pair of land pads respectively include inner ends which are proximal to each other in an arrangement direction, and outer ends farther from each other in the arrangement direction than the inner ends. The pair of land pads respectively include expanding width portions expanding in a width direction from the inner end toward the outer end. The pair of land pads respectively include insulators on a surface of an end portion of the outer end of the land pads.

A universal circuit board compatible for a mechanical keyswitch and an optical keyswitch includes a main body, a plurality of conductive terminals and an opening structure. The main body has a first surface and a second surface opposite to each other. The plurality of conductive terminals is disposed on the first surface of the main body. The opening structure is formed on the main body and pierces through the first surface and the second surface. The opening structure can be inserted by an axle body of the mechanical keyswitch or be an optical transmission channel of the optical keyswitch.

Techniques are disclosed for making a flexible laminated circuit board using a metal conductor onto which a SMD may be attached. Conductive metal strips may be laminated to form a flexible substrate and the metal strips may then be perforated for the placement of LED package leads. The LED packages may be attached to the conductive strips using solder or a conductive epoxy and the upper laminate layer may include perforations exposing portions of the metal strips for the attachment of the LED packages. Alternatively, strings of LED packages may be fabricated by attaching LED packages to conductive strips and these strings may be laminated between flexible sheets to form a laminated LED circuit. Plastic housings may aid in attaching the LED packages to the conductive strips. The plastic housings and/or the laminate sheets may be made of a reflective material.

An apparatus comprising a printed circuit board (PCB) that includes: a multilayer lamination of layers; vias on a surface of the PCB; and bonding pads that couple a ball grid array of an integrated circuit (IC) package to layers through the vias, wherein the bonding pads includes: first bonding pads in a first area of the PCB, each first bonding pad being coupled to a via of the vias in the first area, second bonding pads arranged in a second area of the PCB, each second bonding pad being coupled to a via of the vias in the second area, and third bonding pads arranged in a third area of the PCB, each third bonding pad being coupled to two or more vias of the vias in the third area, wherein the third area is located between the first area and the second area is disclosed.

Embodiments of the invention provide a solderless breadboard for prototyping electrical circuits. The breadboard includes a plurality of electrically conductive lines arranged parallel to each other on an electrically non-conductive breadboard structure. An electrically conductive line includes a plurality of electrical insertion positions and at an electrical insertion position a moveable electrically conductive line section which is operable for breaking the electrically conductive line in moving from a closed to an open position. A plurality of pegs are inserted into the breadboard structure at electrical insertion positions to contact the moveable sections. A peg is rotatable after insertion and includes a head portion and a cylindrical shaft extending from the head portion to a terminating foot. The shaft includes a centrally arranged channel extending from an opening in the head portion towards the terminating foot.

Embodiments of the invention provide a solderless breadboard for prototyping electrical circuits. The breadboard includes a plurality of electrically conductive lines arranged parallel to each other on an electrically non-conductive breadboard structure. An electrically conductive line includes a plurality of electrical insertion positions and at an electrical insertion position a moveable electrically conductive line section which is operable for breaking the electrically conductive line in moving from a closed to an open position. A plurality of pegs are inserted into the breadboard structure at electrical insertion positions to contact the moveable sections. A peg is rotatable after insertion and includes a head portion and a cylindrical shaft extending from the head portion to a terminating foot. The shaft includes a centrally arranged channel extending from an opening in the head portion towards the terminating foot.

A universal circuit board compatible for a mechanical keyswitch and an optical keyswitch includes a main body, a plurality of conductive terminals and an opening structure. The main body has a first surface and a second surface opposite to each other. The plurality of conductive terminals is disposed on the first surface of the main body. The opening structure is formed on the main body and pierces through the first surface and the second surface. The opening structure can be inserted by an axle body of the mechanical keyswitch or be an optical transmission channel of the optical keyswitch.

A wiring body assembly includes a first wiring body that includes a first resin layer serving as a support layer and a first conductor layer provided on the first resin layer that includes a first terminal, a second wiring body that includes a third terminal, and a connection body that includes a resin material and conductive particle dispersed in the resin material. The connection body is interposed between the first and third terminals such that the first wiring body and the second wiring body are electrically connected. The first terminal includes terminal conductor wires arranged in the shape of a mesh and the connection body is in a gap between the terminal conductor wires.