A system, method and computer program product for automated circuit trace generation and reconfiguration on a breadboard, includes a breadboard having a plurality of contact points; a switching matrix coupled to the contact points of the breadboard, and connected to a computer. The switching matrix is programmed by the computer to generate one or more circuit traces onto the contact points of the breadboard.

A flexible intelligent electrical switching device with multi-function capability, and methods of use are presented herein which provide an autonomous, reconfigurable switching device. The present disclosure is specifically designed to reduce space, cost of manufacture, efficiency, installation reduction time and ease of implementation.

Disclosed is a novel timer module. The novel timer module includes a replaceable movement, a master control circuit board, an upper housing, and a lower housing. A circuit board is disposed inside the replaceable movement. Five first inserting pins are welded on the circuit board. The first inserting pins are exposed from the outside of a housing of the replaceable movement. The master control circuit board is located in the upper housing and the lower housing, and is fixed on an upper surface of the lower housing. A relay is disposed inside the master control circuit board. Contacts of the relay respectively extend and are fixed on a surface of the master control circuit board by using leads. Therefore, a problem that a conventional timer movement is fixedly welded on a circuit of a timer module can be resolved.

The present invention provides for an electronic isolator device for application in intrinsically safe environments having isolation and safety functionality and comprising: an isolator module (101), a safety module (100), and wherein the isolator module is arranged for removable physical/electrical connection to the safety module in at least two orientations/configurations (DO, Dl, Al, AO) relative to the safety module, wherein the electrical connection to the safety module in each of the at least two orientations/configurations serves to configure the electrical functionality of the safety module (100).

A system for controlled motion of circuit components to create reconfigurable circuits comprising: a support; a substrate operatively associated with the support; actuators operatively associated with the support configured to physically move circuit components and to move the circuit components into physical and electrical contact with the substrate; the substrate comprising at least one conductive segment arranged to electrically connect circuit components when electrical contacts of circuit components are placed in contact with at least one conductive segment; and control circuitry configured to control the first and second actuators to thereby position the circuit components relative to the substrate; whereby circuit function is determined by the selection of circuit components and the location and orientation of circuit components relative to the substrate and conductive segments to create a reconfigurable circuit.

A driver IC (100) includes a pair of output terminals in each of a plurality of channels and in each of the channels, power is supplied from the pair of output terminals (OUT1 and OUT2, OUT3 and OUT4, OUT5 and OUT6 or OUT7 and OUT8) to a load (M1, M2, M3 or M4). In each of the channels, the pair of output terminals are adjacent to each other.

A redundant circuit device including a first system circuit and a second system circuit having identical function, the redundant circuit device comprises: a substrate that is partitioned into a first region in which a part of the first system circuit is provided and a second region in which a part of the second system circuit is provided, each of the first region and the second region having a printed wiring; a first mount component that is included in the first system circuit, has three or more pins, and is surface-mounted on one surface of the substrate; and a second mount component that is included in the second system circuit, has an identical number of pins as that of the first mount component and having an identical function as that of the first mount component, and is surface-mounted on the one surface.

Surface mount device (SMD) placement to control a signal path in a printed circuit board (PCB), including: adding, to a PCB, a plurality of signal path segments, each signal path segment of the plurality of signal path segments ending at corresponding pad of a plurality of pads, wherein a first pad of the plurality of pads is couplable to a second pad of the plurality of pads to create a first signal path and is couplable to a third pad of the plurality of pads to create a second signal path; and coupling, via a discrete SMD, the first pad and the second pad to create the first signal path comprising a first signal path segment of the plurality of signal path segments and a second signal path segment of the plurality of signal path segments.

Embodiments herein describe a capillary containing a eutectic conductive liquid (e.g., EGaIn) and an electrolyte (e.g., NaOH) that is integrated into a printed circuit board (PCB). In one embodiment, the PCB includes a capillary, a negative electrode, a positive electrode, a plurality of insulation layers, and a conductive layer. The capillary extends through the PCB. The capillary includes a side surface forming an annular cylinder. A eutectic conductive liquid and an electrolyte are disposed within an aperture formed by the side surface. An electrode extends through the side surface and contacts at least the eutectic conductive liquid or the electrolyte. The negative electrode is disposed at a first end of the capillary. The positive electrode is disposed at a second end of the capillary. The conductive layer is disposed between two of the plurality of insulation layers. The electrode forms an electrical connection with the conductive layer.

An integrated circuit may include a printed circuit board and multiple processor sockets on the printed circuit board. Each of the multiple processor sockets is operable to receive a microprocessor and a programmable device. When a microprocessor is placed in a processor socket, that microprocessor may communicate with memory dual in-line memory modules (DIMMs). When a programmable device is placed in a processor socket, that programmable device may first be configured using a configuration DIMM and may then communicate with memory DIMMs during normal operation. The configuration DIMM may include multiple options for configuring the programmable device and may also provide additional management functions specifically tailored to the programmable device.