A printed wiring board includes a primary circuit that receives power supply of a high voltage from a high power source; a pattern for a low voltage circuit that is used when a low voltage component used for a low voltage lower than the high voltage and a power supply terminal block that receives power supply of the low voltage from a low power source are provided; a pattern for a common circuit that is used when a high voltage component used for the high voltage and the low voltage that insulates the pattern for the primary circuit from the pattern for the common circuit; a first insulator which insulates the pattern of the primary circuit from the pattern of the common circuit; and a second insulator that insulates the pattern for the common circuit from the pattern for the low voltage circuit.

A system for controlled motion of circuit components to create reconfigurable circuits comprising: a support; a substrate operatively associated with the support; actuators operatively associated with the support configured to physically move circuit components and to move the circuit components into physical and electrical contact with the substrate; the substrate comprising at least one conductive segment arranged to electrically connect circuit components when electrical contacts of circuit components are placed in contact with at least one conductive segment; and control circuitry configured to control the first and second actuators to thereby position the circuit components relative to the substrate; whereby circuit function is determined by the selection of circuit components and the location and orientation of circuit components relative to the substrate and conductive segments to create a reconfigurable circuit.

Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers, a cavity formed in at least one organic dielectric layer of the plurality of organic dielectric layers and a modular structure having first and second ports and a conductive member that is formed within the cavity. The conductive member provides modularity by being capable of connecting the first and second ports and also disconnecting the first and second ports.

Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include a substrate. The electronic device package can also include an electronic component disposed on the substrate and electrically coupled to the substrate. The electronic device package can further include a connector disposed on the substrate and electrically coupled to the substrate for communication with the electronic component. The connector can have a contact to interface with a mating connector and configured to provide a signal and/or power to the electronic component to facilitate testing the electronic component. Additionally, the electronic component can include an encapsulant material disposed on the substrate and at least partially encapsulating the electronic component and/or the connector. The contact can be accessible on a top side of the electronic device package to facilitate coupling the connector to a testing device. Associated systems and methods are also disclosed.

A memory device is provided. The memory device includes a substrate, a first interface connector, a second interface connector and a plurality of memory chips. The substrate includes a first edge, a second edge, a third edge and a fourth edge. The first interface connector is disposed on the first edge, wherein the first interface connector includes a plurality of first edge-board contacts, and the first edge-board contacts extend toward a first direction. The second interface connector is disposed on the second edge, the second interface connector includes a plurality of second edge-board contacts, and the second edge-board contacts extend toward a second direction. The memory chips are disposed on the substrate, wherein the second interface connector is located between the memory chips and the first interface connector in the first direction.

A memory device is provided. The memory device includes a substrate, a first interface connector, a second interface connector and a plurality of memory chips. The substrate includes a first edge, a second edge, a third edge and a fourth edge. The first interface connector is disposed on the first edge, wherein the first interface connector includes a plurality of first edge-board contacts, and the first edge-board contacts extend toward a first direction. The second interface connector is disposed on the second edge, the second interface connector includes a plurality of second edge-board contacts, and the second edge-board contacts extend toward a second direction. The memory chips are disposed on the substrate, wherein the second interface connector is located between the memory chips and the first interface connector in the first direction.

A module component includes a substrate; first, second, third and fourth main electrodes on or in a principal surface of the substrate; a sub-electrode located between two of the four main electrodes and connected to one of the four main electrodes by a solder; a first mount component mounted to the first and second main electrodes; and a second mount component mounted to the third and fourth main electrodes; wherein an area of the sub-electrode is smaller than an area of each of the first, second, third and fourth main electrodes.

The present invention provides for an electronic isolator device for application in intrinsically safe environments having isolation and safety functionality and comprising: an isolator module (101), a safety module (100), and wherein the isolator module is arranged for removable physical/electrical connection to the safety module in at least two orientations/configurations (DO, Dl, Al, AO) relative to the safety module, wherein the electrical connection to the safety module in each of the at least two orientations/configurations serves to configure the electrical functionality of the safety module (100).

One embodiment of the present disclosure set forth a system for hot swapping an expansion card. The system includes a fastener mechanism for coupling an expansion card to a motherboard. The system further includes a switch for controlling voltage supply to the expansion card. When the fastener mechanism is in an activated state, the fastener mechanism secures the expansion card to the motherboard and the switch causes voltage to be supplied to the expansion card. When the fastener mechanism is in a partially activated state, the fastener mechanism secures the expansion card to the motherboard and the switch prevents voltage from being supplied to the expansion card.

An integrated circuit may include a printed circuit board and multiple processor sockets on the printed circuit board. Each of the multiple processor sockets is operable to receive a microprocessor and a programmable device. When a microprocessor is placed in a processor socket, that microprocessor may communicate with memory dual in-line memory modules (DIMMs). When a programmable device is placed in a processor socket, that programmable device may first be configured using a configuration DIMM and may then communicate with memory DIMMs during normal operation. The configuration DIMM may include multiple options for configuring the programmable device and may also provide additional management functions specifically tailored to the programmable device.