A circuit board includes a board base element, a communication circuit connection terminal, an antenna connection terminal, and a circuit pattern including wires and lands to which predetermined circuit elements are mountable. The predetermined circuit elements include optional elements including a first coil and a second capacitor. The optional elements are electronic components to be mounted or not in the circuit pattern depending on whether a second antenna is connected to a second antenna connection terminal. The predetermined circuit elements further include basic elements including a first capacitor and first and second filters. The basic elements are electronic components to be mounted in the circuit pattern regardless of whether the optional elements are mounted. The circuit pattern is formed such that the single circuit board can optionally support plural types of antenna configurations by changing a manner of mounting the optional elements and changing the circuit configuration.

An example method includes linking a transmit line and receive line to a respective via, and printing two paths to each via, wherein each path is interrupted by two pairs of contacts. When a first resistor is in a first pair of contacts at a receive via, first signal is formed between a receive point of a first connector and the receive line. When a first capacitor is in first pair of contacts at a transmit via, second signal is formed between transmit point of first connector and the transmit line. When a second resistor is in second pair of contacts at receive via, third signal is formed between receive point of a second connector and the receive line. When a second capacitor is in second pair of contacts at transmit via, fourth signal is formed between a transmit point of second connector and the transmit line.

Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers, a cavity formed in at least one organic dielectric layer of the plurality of organic dielectric layers and a modular structure having first and second ports and a conductive member that is formed within the cavity. The conductive member provides modularity by being capable of connecting the first and second ports and also disconnecting the first and second ports.

A transmission cable includes a transmission cable, a first circuit board having a first power layout area, a first ground layout area, and a first circuit trace, and a second circuit board having a second power layout area, a second ground layout area, and a second circuit trace. The transmission cable includes a power wire, a pair of signal wires, and a drain wire. When the first power layout area, the first circuit trace, the second power layout area, and the second circuit trace are connected via a resistor, respectively, the drain wire connected between the first circuit trace and the second circuit trace will act as another power wire. Thus, a voltage drop at both ends of the transmission cable can be reduced by increasing the power wires to improve signal transmission quality.

A printed circuit board assembly includes a printed circuit board having a plurality of signal lanes. The PCBA also includes at least one application-specific integrated circuit operatively mounted to the printed circuit board and connected with the plurality of signal lanes. The PCBA includes a first configuration element operatively mounted to the printed circuit board in a first orientation and at a first location and having a first bridging element for providing an electrical connection between at least a first pair of signal lanes selected from the plurality of signal lanes. The first configuration element also includes a second bridging element so that if the first configuration element were operatively mounted to the printed circuit board in a different, second orientation relative to the printed circuit board, the second bridging element would provide an electrical connection between at least a second pair of signal lanes.

An LED light tube includes a glass tube, end caps, an LED light strip, LED light sources, and a power supply module. The end caps are respectively attached at two ends of the glass tube. The LED light strip is attached to an inner circumferential surface of the glass tube. The LED light sources are mounted on the LED light strip. The power supply module is electrically connected to the LED light strip. Each of the end caps includes a lateral wall and an end wall. The lateral wall is substantially coaxial with the glass tube and connected to the glass tube. The end wall is substantially perpendicular to an axial direction of the lateral wall and connected to an end of the lateral wall away from the glass tube. The power supply module includes a rectifying circuit and a filtering circuit electrically connected to the rectifying circuit.

One embodiment of the present disclosure set forth a system for hot swapping an expansion card. The system includes a fastener mechanism for coupling an expansion card to a motherboard. The system further includes a switch for controlling voltage supply to the expansion card. When the fastener mechanism is in an activated state, the fastener mechanism secures the expansion card to the motherboard and the switch causes voltage to be supplied to the expansion card. When the fastener mechanism is in a partially activated state, the fastener mechanism secures the expansion card to the motherboard and the switch prevents voltage from being supplied to the expansion card.

A Lighting module for an automotive vehicle, comprising: a light source; a binning electrical network comprising a configurable resistance; and an electrical driver module configured to supply an electrical current to the light source through the binning electrical network. And a method for configuring a lighting module for an automotive vehicle to electrically drive a light source thereof according to predetermined characteristics of the light source, the method comprising: providing the lighting module for an automotive vehicle, the lighting module comprising: the light source with the brightness class; and an electrical driver module configured to supply an electrical current to the light source through a binning electrical network; providing the binning electrical network, the binning electrical network comprising a configurable resistance.

The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form. Customized smart devices, smart phones and touchscreen devices may be fabricated in examples of a cleanspace fabricator. In some examples, the smart devices, smart phones and touchscreen devices may have two touchscreens on opposite sides of the device along with hardware based encryption.

A printed circuit board assembly includes a printed circuit board having a plurality of signal lanes. The PCBA also includes at least one application-specific integrated circuit operatively mounted to the printed circuit board and connected with the plurality of signal lanes. The PCBA includes a first configuration element operatively mounted to the printed circuit board in a first orientation and at a first location and having a first bridging element for providing an electrical connection between at least a first pair of signal lanes selected from the plurality of signal lanes. The first configuration element also includes a second bridging element so that if the first configuration element were operatively mounted to the printed circuit board in a different, second orientation relative to the printed circuit board, the second bridging element would provide an electrical connection between at least a second pair of signal lanes.