A diplex filter having tunable inductors. Preferably the tunable inductors include pads that may each selectively receive one end of a jumper.

A curved display device and method for manufacturing the same is provided. The method for manufacturing a curved display device may include providing a display panel, a plurality of signal transfer elements, and a plurality of printed circuit boards, connecting one end of each of the signal transfer elements to the display panel and connecting the other end of each of the signal transfer elements to one of the printed circuit boards, on which one or more division guide portions are formed, dividing each of the printed circuit board into a plurality of sub printed circuit boards through cutting of the division guide portions; and bending the display panel connected to the sub printed circuit boards so that the display panel has a curvature.

Some embodiments provide a novel surface-mount technology (SMT) printed circuit board (PCB) assembly. The SMT PCB assembly includes at least a pair of adjacent conductive pads with a small gap between them. During the development phase of the SMT PCB assembly, the small gap between the adjacent conductive pads, as well as some of the adjacent portions of the conductive pads, are covered with solder mask. An SMT component (e.g., a zero-ohm resistor) may then be mounted to the SMT PCB assembly through the exposed portions of the conductive pads. During the production phase, however, the solder mask is revised to cover the far sides of the conductive pads, which results in the adjacent portions of the conductive pads being exposed. As such, a solder jumper can easily be created during the production phase by connecting the two conductive pads using solder paste.

A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.

The present disclosure provides a battery module comprising a circuit board, the circuit board comprises a conductive layer, a first pad and a second pad. The conductive layer is formed with a sampling circuit, the sampling circuit comprises: a sampling end portion; an outputting end portion; a first branch path formed with a first fusing zone; and a second branch path formed with a second fusing zone. The first pad is provided on the sampling end portion, the second pad is provided on the second branch path. When the first fusing zone is fused, the circuit board can be quickly repaired by means of the second branch path and the second pad to electrically connect the sampling end portion and the outputting end portion, thereby achieving the purpose of reusing the circuit board, therefore the entire battery module is not scrapped and the utilization of the battery module is improved.

An energy conversion system may comprise a substrate including a first conductive trace and a second conductive trace electrically isolated from the first conductive trace. A housing may be coupled to the substrate. An ignition compound may be located in the housing. A solder may be thermally coupled to the ignition compound such that ignition of the ignition compound melts the solder. The housing may be configured to output the solder onto the first conductive trace and the second conductive trace.

A method of running a printed circuit board (PCB) trace on a PCB. The PCB comprising a plurality of PCB layers. The method comprising forming a conductive trace on at least one of the plurality of PCB layers; coupling a first portion of the conductive trace to a capacitor formed on at least one of the plurality of PCB layers; coupling a second portion, different from the first portion, of the conductive trace to a conductive material formed within a first via extending through two or more of the plurality of PCB layers; and configurably setting a length of a conductive path of the conductive trace according to a predetermined impedance. The capacitor is separated laterally in a plan view at a first distance from the first via. The length of the conductive trace in the plan view is greater than the first distance. The conductive path of the conductive trace of the length has the predetermined impedance.

The present invention discloses a driving circuit for a display panel and a display device. The driving circuit includes a driving circuit board configured to carry a driving circuit, and first pads located on the driving circuit. The first pads are connected through a detachable connector.

Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.