A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.

A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.

An electronic assembly contains a circuit board having a current-conducting current path with two mutually spaced-apart current path ends that form an interruption point and a contact clip bridging the interruption point. The contact clip is manufactured without a preload, as a thermal fuse. The contact clip has a multiple bent, open clip loop and a contact limb making contact with both mutually spaced-apart current path ends using solder. The contact clip further has a fixing limb with a limb end seated in a circuit board opening. The limb end of the fixing limb is oversized relative to a circuit board opening, and a deformation being imparted to the contact clip, with an internal preload being generated.

The present invention discloses a driving circuit for a display panel and a display device. The driving circuit includes a driving circuit board configured to carry a driving circuit, and first pads located on the driving circuit. The first pads are connected through a detachable connector.

Disclosed is an interface circuit, a chip containing an interface circuit and a manufacturing method thereof. The interface circuit includes an I/O processing sub-circuit, a path selection sub-circuit, and at least two I/O ports. The I/O processing sub-circuit, the path selection sub-circuit, and the at least two I/O ports are electrically connected in sequence. The path selected by the path selection sub-circuit can enable a first and a second electrical signal to be transmitted through the I/O ports that are configured to correspond to the ports of the external device through which the first and second electrical signals are transmitted. That is, the path selection sub-circuit can customize the layout of the signal-input/output I/O ports of the interface circuit according to the layout of the ports of the external device.

A multi-layer circuit board includes a first layer including a first trace, a second layer connected to the first layer and including a second trace, and a stubless interconnect positioned through the first layer and the second layer. The stubless interconnect includes a body that is electrically insulative, and a bridge trace that is electrically conductive and connected to the body, the bridge trace extending from the first trace to the second trace to electrically connect the first trace and the second trace.

An energy conversion system may comprise a substrate including a first conductive trace and a second conductive trace electrically isolated from the first conductive trace. A housing may be coupled to the substrate. An ignition compound may be located in the housing. A solder may be thermally coupled to the ignition compound such that ignition of the ignition compound melts the solder. The housing may be configured to output the solder onto the first conductive trace and the second conductive trace.

A method of running a printed circuit board (PCB) trace on a PCB. The PCB comprising a plurality of PCB layers. The method comprising forming a conductive trace on at least one of the plurality of PCB layers; coupling a first portion of the conductive trace to a capacitor formed on at least one of the plurality of PCB layers; coupling a second portion, different from the first portion, of the conductive trace to a conductive material formed within a first via extending through two or more of the plurality of PCB layers; and configurably setting a length of a conductive path of the conductive trace according to a predetermined impedance. The capacitor is separated laterally in a plan view at a first distance from the first via. The length of the conductive trace in the plan view is greater than the first distance. The conductive path of the conductive trace of the length has the predetermined impedance.

A multi-layer circuit board includes a first layer including a first trace, a second layer connected to the first layer and including a second trace, and a stubless interconnect positioned through the first layer and the second layer. The stubless interconnect includes a body that is electrically insulative, and a bridge trace that is electrically conductive and connected to the body, the bridge trace extending from the first trace to the second trace to electrically connect the first trace and the second trace.

A resistor assembly is disclosed and comprises a first conductive trace, a second conductive trace, and a plurality of trimming bridges that electrically couple the first conductive trace to the second conductive trace. The resistor assembly also comprises a thin film resistor electrically coupled to the first conductive trace. The first conductive trace, the second conductive trace, the plurality of trimming bridges, and the thin film resistor are all part of a surface mounted layer of the resistor assembly. The plurality of trimming bridges are each removable to increase a resistance of the thin film resistor.