Embodiments describing an approach to detecting negative paths for a circuit design based on a circuit timing test of the circuit design. Assigning each negative path to a logic bucket, an integration bucket, or a macro bucket, wherein the logic bucket corresponds to logic design flaws, the integration bucket corresponds to integration design flaws, and the macro bucket corresponds to macro design flaws or design flaws residing within a macro of the circuit design. Detecting a modification to the circuit design based on the logic design flaws, the integration design flaws, and the macro design flaws, and applying the modification to the circuit design to enable manufacturing an integrated circuit, wherein an overall delay between two latches of the integrated circuit is below a predetermined threshold.

Embodiments describing an approach to detecting negative paths for a circuit design based on a circuit timing test of the circuit design. Assigning each negative path to a logic bucket, an integration bucket, or a macro bucket, wherein the logic bucket corresponds to logic design flaws, the integration bucket corresponds to integration design flaws, and the macro bucket corresponds to macro design flaws or design flaws residing within a macro of the circuit design. Detecting a modification to the circuit design based on the logic design flaws, the integration design flaws, and the macro design flaws, and applying the modification to the circuit design to enable manufacturing an integrated circuit, wherein an overall delay between two latches of the integrated circuit is below a predetermined threshold.

A mass produced identifier providing device with sufficiently high yield, even when forming a conductive layer pattern having an extremely small thickness/minimum area using a minimum amount of silver paste. The identifier-providing device has a conductive layer pattern formed on a rear surface of a base material as an insulator. The silver paste forming the conductive layer pattern contains only silver flakes, as silver particles, that have a particle size in a range of 3.0 to 5.0 m and that has a thickness of 100 nm at a largest thickness portion, while having a thickness of 50 nm at a smallest thickness portion. The conductive layer pattern is formed to have a film thickness of 10 m or less by laminating the silver flakes in the thickness direction. The silver flakes forming the conductive layer are in a fused state or an aggregating/cohering state at the smallest thickness portion.

A Lighting module for an automotive vehicle, comprising: a light source; a binning electrical network comprising a configurable resistance; and an electrical driver module configured to supply an electrical current to the light source through the binning electrical network. And a method for configuring a lighting module for an automotive vehicle to electrically drive a light source thereof according to predetermined characteristics of the light source, the method comprising: providing the lighting module for an automotive vehicle, the lighting module comprising: the light source with the brightness class; and an electrical driver module configured to supply an electrical current to the light source through a binning electrical network; providing the binning electrical network, the binning electrical network comprising a configurable resistance.

A layout without bridge taps includes: a routing from a CPU to a first module through a first set of pads; a routing from a first set of bridge pads to a second module through a second set of pads and a second set of bridge pads; a routing from a third set of pads to a third module; and connectors. The connectors connect pads of the first set of pads to couple the CPU with the first module, or connect the first set of pads with the first set of bridge pads and connect the second set of pads with the second set of bridge pads to couple the CPU with the second module, or connect the first set of pads with the first set of bridge pads and connect the second set of pads with the third set of pads to couple the CPU with the third module.

An electronic circuit board has at least one copper trace, at least one array of contact pads connected to the copper trace, a heater connected to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads will reflow. An electronic circuit board system has an electronic circuit board. The electronic circuit board includes at least one copper trace, at least one array of contact pads connected to the copper trace, a heater connection to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads with reflow, and a heater to connect to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads will reflow.

To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads.

A method of making a printed circuit board and a printed circuit board including a plurality of plastic substrate parts having one or more first substrate parts each having at least one coupling means, and one or more second substrate parts each having at least one receiving means to receive the coupling mean. At least one of the plurality of plastic substrate parts is formed with a further structural element, and at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means. The connected substrate parts include a circuit.

Passive electrical devices are described with a polymer carrier. In one example, a conductive layer is formed over a polymer substrate in a pattern to form a passive electrical device and at least two terminals of the device. A plurality of external connection pads are connected to the terminals of the device.

A lighting strip has a printed circuit board with one or more perforated lines at which the printed circuit board length may be adjusted by breaking off an end portion of the printed circuit board. A first layer has a first set of conductive tracks and a second layer has a second set of conductive tracks corresponding to the first set of conductive tracks. Each conductive track of the second set is vertically aligned and positioned over the corresponding conductive track of the first set. An array of contact terminals is provided on a third layer. A plurality of lighting elements is disposed along the lighting strip, each electrically connected to a respective pair of the contact terminals. The lighting strip further comprises a set of vias connecting each conductive track of the first set to the corresponding conductive track of the second set.