A delay circuitry is configured to hold up power to a mass storage device after a power fault disables communication of the mass storage device with the host computer. The time delay is sufficient to allow saving of in-flight data from the storage device's volatile cache to the non-volatile media (of the storage device) and to update a metadata table in the non-volatile media.

The description relates to prototyping systems, including hubs for electrically connecting devices. One example can include an electrically insulative substrate and at least two connector tabs defined by the substrate, each connector tab including a data contact, a power contact, and a ground contact positioned over the substrate. A data bus can be positioned relative to the substrate and electrically connect all of the data contacts, a power bus can be positioned relative to the substrate and electrically connect all of the power contacts, and a ground bus can be positioned relative to the substrate and electrically connect all of the ground contacts.

A voltage determination device includes: a printed wiring board on which first to third substrate terminals are arranged in substantially one line; first and second voltage determination circuits mounted on the printed wiring board and disposed on a first side of the printed wiring board divided by a line passing through the first to third substrate terminals; a first printed wiring connecting the first substrate terminal and the first voltage determination circuit; a second printed wiring connecting the second substrate terminal and the first voltage determination circuit; a third printed wiring connecting the third substrate terminal and the second voltage determination circuit; and a fourth printed wiring connecting the second substrate terminal and the second voltage determination circuit, in which the first to fourth printed wirings are provided without intersecting each other and without bypassing a second side of the printed wiring board divided by the first arrangement line.

In-mold electronic (IME) devices and their methods of manufacture comprise providing a substrate, a conductive track disposed on or proximate to a first surface of the substrate, a light-emitting diode (LED) disposed on the first surface of the substrate, electrically connected to the conductive track, and configured to emit light, a light channel layer applied to the substrate, the light channel layer comprising a transparent or translucent portion covering or surrounding the LED, and a decorative layer applied to the light channel layer or an opposing second surface of the substrate, the decorative layer defining an opaque portion and a transparent or translucent portion through which light emitted by the LED flows.

A circuit board and a battery connection module are provided. The circuit board has an insulating substrate and a plurality of circuit traces provided thereto. At least one of the traces is provided with a fuse unit. The fuse unit has a main fuse and at least one spare fuse. The main fuse has two main trace connection end portions respectively positioned at two ends of the main fuse and connected to the trace and a main fuse section connected between the two main trace connection end portions. The spare fuse has two trace connection end portions respectively positioned at two ends of the spare fuse and a fuse section connected between the two trace connection end portions, the fuse section and the main fuse section are spaced apart from each other and arranged side by side, and at least one of the two trace connection end portions is not connected with the trace so as to form an electrical disconnection with the trace, and after the main fuse section forms an electrical disconnection, the two trace connection end portions are connected to the trace so that a current conductive path is formed by the spare fuse and the trace.

A fusible via is disclosed. The fusible via includes an upper contact. The fusible via further includes a handle portion having a first end and a second end. The upper contact is disposed on the first end of the handle portion. The handle portion comprises an alloy and a blowing agent. The alloy melts above a predefined solder reflow temperature but below a thermal degradation temperature of the blowing agent. The fusible via further includes a lower contact disposed on the second end of the handle portion.

An integrated circuit chip includes a core circuit, a first bond pad, a first switch circuit, a second configuration resistor, a control circuit, and a storage unit. The first bonding pad is coupled to a first external reference voltage through a first node, and the first node is coupled to the first external reference voltage through a bonding wire or a first configuration resistor. The first switch circuit is coupled between a first internal reference voltage and the first node. The second configuration resistor is coupled between the first internal reference voltage and the first switch circuit or between the first switch circuit and the first node. In a first mode, the control circuit turns on the first switch circuit, and writes a configuration state of the first bonding pad to the storage unit. In a second mode, the control circuit turns off the first switch circuit.

Method for providing an electrical connection, comprising connecting a first cable to a first conducting structure on a printed circuit board, connecting a second cable to a second conducting structure on the printed circuit board, comparing a propagation delay of a first signal path comprising the first cable and the first conducting structure on the printed circuit board, and a propagation delay of a second signal path comprising the second cable and the second conducting structure on the printed circuit board; and removing conductive material of the first conducting structure and/or of the second conducting structure, in order to modify an electrical length of the first conducting structure and/or of the second conducting structure, to obtain a first conducting path and a second conducting path, in dependence on a result of the comparison, in order to reduce a difference of the propagation delays between the first signal path and the second signal path.

A fuse element, in particular suited for use in electric and/or electronic circuits constructed by multilayer technology, including a printed circuit board substrate material, which is usable particularly in the multilayer technology and is coated with a metal or metal alloy from which the fuse is generated by means of photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, is proposed. The fuse is distinguished in that the printed circuit board substrate material, on which the fuse can be provided, includes at least a high-temperature-stable, electrically insulating material, with a coefficient of thermal expansion that varies essentially analogously to the coefficient of thermal expansion of the metal or metal alloy from which the fuse is made.

In an example, monitoring circuitry includes a first and second coupling, at least one of which is to capacitively couple the monitoring circuitry to a monitored circuit on a product packaging. The monitored circuit has a resistance which is indicative of a status of a product stored in the product packaging, and the monitored circuit is to be connected in series between the first coupling and the second coupling. The monitoring apparatus may determine the resistance of the monitored circuit via the first and second couplings.