The invention relates to a method for producing a lighting unit of a vehicle headlight, comprising the following steps: provision of a printed circuit board (1) comprising a plurality of groups (A, B, C) of contact pads (2) for contacting LEDs (3), population of contact pads (2) in the groups (A, B, C) with LEDs (3), wherein the contact pads (2) to be populated are selected according to a desired light function of the respective group (A, B, C), and provision of securing means (A, B, C) for reflectors (A, B, C) on the printed circuit board (1), wherein each securing means (A, B, C) is specifically designed for a reflector (A, B, C) that is adapted to the light function of the respective group (A, B, C).

According to an embodiment, an electronic device includes a substrate, first conductors, second conductors, a connector, third conductors, an electronic component, and a first wiring. The first conductor is complied with a first USB standard. The second conductor is complied with a second USB standard. The connector is mounted on the first conductors or the second conductors. The first wiring connects one of the first conductors, one of the second conductors, and one of the third conductors.

An electronic breadboard system may include a computing device including a display screen. The display screen has a first portion to display an electronic circuit model and a second portion directly adjacent to the first portion. The electronic breadboard system also includes a translucent breadboard on the second portion of the display screen. The translucent breadboard includes a translucent face plate having a rectangular grid of openings exposing a plurality of contacts. The plurality of contacts are arranged lengthwise along each row of the rectangular grid of openings and orthogonal to a transparent back plate coupling the plurality of contacts to the translucent face plate. The electronic breadboard system includes a graphics controller. The graphics controller may illuminate a row opening and/or a column opening of the translucent breadboard to direct placement of electrical components of a computer model in response to user interaction with the electronic circuit model.

A PCB with two rows of solder pads including both SMT-based and DIP-based structures is configured to be mounted with a USB Type-C connector by soldering, has two rows of solder pads on its top side, and is characterized in that at least one solder pad in one of the rows is a DIP-based structure while the remaining solder pads in the same row are SMT-based structures, and that all the solder pads in each row that are used to transmit high-frequency signals are SMT-based structures. Once the connector is mounted to the PCB, an inspector can directly examine the soldering quality of the DIP-based-structure solder pad and of the corresponding connection terminal simply by inspecting the bottom side of the PCB. Moreover, since all the solder pads configured for transmitting high-frequency signals are SMT-based structures, better transmission will be provided to the connector, accordingly.

A mounting substrate on which at least any one of three kinds of electronic components including a first electronic component, a second electronic component, and a third electronic component are able to be mounted includes a pair of first edge portions and a pair of second edge portions. When a dimension of the first electronic component in its length direction is designated as L1, a dimension of the first electronic component in its width direction is designated as W1, a dimension of the second electronic component in its length direction is designated as L2, and a dimension of the second electronic component in its width direction is designated as W2, a dimension of the third electronic component in its width direction is any one of W1 and W2, and a dimension of the third electronic component in its length direction is L2 when the dimension of the third electronic component in its width direction is W1, and is L1 when the dimension of the third electronic component in its width direction is W2. At least one or more of the third electronic components are mounted on the mounting substrate.

An electronic component is able to be mounted on a mounting substrate on which a first electronic component and a second electronic component are able to be mounted. When dimensions of the first electronic component and the second electronic component in a width direction is designated as W1 and W2, respectively, and dimensions of the first electronic component and the second electronic component in a length direction are designated as L1 and L2, respectively, dimensions of the electronic component in the width direction and the length direction are any one of combinations of W1 and L2, and of W2 and L1. The electronic component includes a third laminate including a pair of third principal surfaces, a pair of third side surfaces, and a pair of third end surfaces, and a pair of third external electrodes. Each of the pair of third external electrodes includes a fired layer, and a resin layer provided on an external surface of the fired layer. On each of the pair of third principal surfaces and on each of the pair of third side surfaces, a length of the resin layer along the length direction from a corresponding one of the third end surfaces to a leading end of the resin layer is less than a length of the fired layer along the length direction from a corresponding one of the third end surfaces to a leading end of the fired layer.

An electronic device may include surface mount technology components mounted to a printed circuit board. The surface mount technology components may include electrical components such as resistors, inductors, and capacitors. In order to reduce the size of the electronic device, surface mount technology components may be stacked. A surface mount technology component may be mounted to metal members that electrically connect the surface mount technology component to contact pads on a printed circuit board. A surface mount technology component may be provided with integral standoff portions, and a second surface mount technology component may be mounted to the integral standoff portions. A single surface mount technology component may be used to implement different circuits depending on which face of the surface mount technology component is mounted to the printed circuit board.

A battery charger may include a printed circuit board (PCB) having a first portion supporting alternating current (AC) electrical components and a second portion supporting direct current (DC) electrical components; an indicator including a light-emitting diode (LED) supported on the first portion of the PCB and operable to emit light; and an isolating member positioned on the first portion between the AC electrical components and the LED. A trace on the PCB may be electrically connected to the second portion of the PCB, the trace extending from the second portion and along the first portion, and the LED may be electrically connected to and receiving DC power through the trace, the LED being selectively positioned along a length of the trace. The LED may be positioned more than about 8 mm from the AC electrical components.

Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.

Disclosed are a compatible circuit and a terminal. The compatible circuit includes a printed circuit board (PCB) of which the existing structure is not changed, and a group of compatible devices which are in a pin-to-pin form and have different internal structures, wherein the compatible devices and the PCB are assembled together; the internal structures of the compatible devices are matched with a link compatibility selection requirement; and the compatible devices are configured to conduct link selection output on at least two links which are input and need compatibility, in accordance with the link compatibility selection requirement.