A method and apparatus for inputting a plurality of different circuit schematics designed with printed circuit board (PCB) mountable components; extracting circuit topologies for said plurality of different circuit schematics; transforming said extracted circuit topologies to a fixed number of connection points; and generating a configurable circuit PCB physical layout pattern having said fixed number of connection points such that said PCB mountable components when positioned on one or more of said fixed number of connection points can implement any circuit represented by said plurality of different circuit schematics.

The invention provides a PCB for gallium nitride device, on which has been formed: a gallium nitride welding position to which first and second gallium nitride elements having different packages are interchangeably welded; a first/second driving circuit welding position to which a first/second driving circuit of the first/second gallium nitride element is welded; wherein the gallium nitride welding position includes: a first and second gate pad respectively welded to gate electrode of the first and second gallium nitride element and respectively connected to gate signal terminal of the first and second driving circuit; a first and a second ground pad; a first contact contactless connected to the first ground pad and directly connected to ground terminal of the first driving circuit; and a second contact contactless connected to the second ground pad and directly connected to ground terminal of the second driving circuit.

A wireless communication board comprises: a communication board; a wireless communication part disposed on the communication board; a power supply provided on the communication board and configured to supply a power source to the wireless communication part; a surface mounting pad that is connected to the wireless communication part and power supply and disposed on a main board by means of the surface mounting technology; and a wire connection connected to the wireless communication part and power supply and connected to the main board by means of a wire, wherein the main board comprises a main processor for controlling the operation of an electronic device.

There is provided a method for implementing an electronic card. The method can include providing the electronic card with a printed circuit board. The method further includes selecting one of a first side and a second side as a specified side on which only connection hardware is to be mounted. The first side is located at a first x-y plane and the second side is located at a second x-y plane, the first and second x-y planes being separated by a length equal to a thickness of the PCB. The first and second x-y planes are parallel.

A shielded board connector (20) includes a terminal holding member for shielding (21) and left and right terminal fittings (31). An unshielded board connector (35) includes a terminal holding member for unshielding (36) and left and right terminal fittings (31). In the pair of terminal fittings (31) in the shielded board connector (20), an interval (Pw) of tab-like connecting portions (32) is wider than an interval (Po) of board connecting portions (34). In the pair of terminal fittings (31) of the unshielded board connector (35), an interval (Pn) of tab-like connecting portions (32) is narrower than an interval (Po) of board connecting portions (34). The interval (Po) of the board connecting portions for shielding (34) and the interval (Po) of the board connecting portions for unshielding (34) are substantially equal.

A device for replacing at least one chip or electronic element of an electronic component, in particular an LED package or an LED display, includes at least two standard electrical contacts to which a chip comprising at least two electrical contacts is electrically connectable. The device also includes an electronic switch electrically connecting the first standard electrical contact to an electrical power supply source, and least three electrical repair contacts to which a repair chip identical in construction to the chip is electrically connectable. The first electrical repair contact is electrically connected to the electrical power supply source. The second electrical repair contact is electrically connected to the electronic switch. The third electrical repair contact is electrically connected to the second electrical standard contact.

A dual-path signal interconnect is provided. The interconnect can include a first signal trace, first and second solder pads positioned above and connected to the first signal trace, and a third solder pad. The second solder pad separates from the first solder pad. The third solder pad separates from the second solder pad and is connected to a second signal trace. The first and second solder pads are to allow a pin of a connector to be soldered to the first and second solder pads, such that, when the pin of the external connector is soldered, high-speed electrical signals from the first signal trace are routed to the connector. The second and third solder pads are to allow a conductor to be soldered to the second and third solder pads, such that, when the conductor is soldered, the high-speed electrical signals are routed to the second signal trace.

According to one embodiment, a printed circuit board includes a substrate and a shared pad group provided on the substrate and including a plurality of shared pads. The shared pads include a first area, a second area smaller in size than the first area, a port of which is overlap the first area and an other port of which is located to protrude from the first area to a side of another one of the shared pads, and a second side edge located on a side of another shared pad. The second pad side edge includes a first side edge defining the first area, a second side edge defining the second area and displaced on a side of another shared pad with respect to the first side edge, and a sloping side edge connecting the first side edge and the second side edge to each other.

A shielded board connector (20) includes a terminal holding member for shielding (21) and left and right terminal fittings (31). An unshielded board connector (35) includes a terminal holding member for unshielding (36) and left and right terminal fittings (31). In the pair of terminal fittings (31) in the shielded board connector (20), an interval (Pw) of tab-like connecting portions (32) is wider than an interval (Po) of board connecting portions (34). In the pair of terminal fittings (31) of the unshielded board connector (35), an interval (Pn) of tab-like connecting portions (32) is narrower than an interval (Po) of board connecting portions (34). The interval (Po) of the board connecting portions for shielding (34) and the interval (Po) of the board connecting portions for unshielding (34) are substantially equal.

According to one embodiment, a printed circuit board includes a base substrate, a first pad located on the base substrate, a second pad located on the base substrate alongside the first pad with respect to a first direction X with a gap therebetween and a solder resist covering the base substrate and including a cavity portion in a position overlapping the first pad and the second pad, the solder resist including a first protruding portion projecting in a second direction crossing the first direction and a second protruding portion projecting in the second direction on an opposite side to the first protruding portion, and the first protruding portion and the second protruding portion each overlap the gap, an end of the first pad on a gap side, and an end of the second pad on a gap side.