The present invention provides for an electronic isolator device such as a universal isolator and having isolation and possible safety functionality and comprising an isolator module (550), and a base module (500), and wherein the isolator module is arranged for removable physical/electrical connection to the base module and in at least two orientations/positions relative to the base module, wherein electrical connection to the base module in each of the at least two orientations/positions serves to configure the type/functionality of the isolator device.

An example method includes linking a transmit line and receive line to a respective via, and printing two paths to each via, wherein each path is interrupted by two pairs of contacts. When a first resistor is in a first pair of contacts at a receive via, first signal is formed between a receive point of a first connector and the receive line. When a first capacitor is in first pair of contacts at a transmit via, second signal is formed between transmit point of first connector and the transmit line. When a second resistor is in second pair of contacts at receive via, third signal is formed between receive point of a second connector and the receive line. When a second capacitor is in second pair of contacts at transmit via, fourth signal is formed between a transmit point of second connector and the transmit line.

A chip package circuit board module including a circuit board and at least one original chip is provided. The circuit board includes at least one first pad, at least one second pad and at least one substitute pad. The at least one second pad is located besides the at least one first pad and separated from the at least one first pad. The at least one substitute pad is adjacent to the at least one second pad and separated from the at least one first pad and the at least one second pad. The at least one original chip is connected to the at least one first pad and at least one the second pad, respectively. A total width of a portion corresponding to each of the at least one second pad and a portion corresponding to the substitute pad adjacent to the second pad of the first pad is greater than or equal to twice a width of the original chip.

A dual-path signal interconnect is provided. The interconnect can include a first signal trace, first and second solder pads positioned above and connected to the first signal trace, and a third solder pad. The second solder pad separates from the first solder pad. The third solder pad separates from the second solder pad and is connected to a second signal trace. The first and second solder pads are to allow a pin of a connector to be soldered to the first and second solder pads, such that, when the pin of the external connector is soldered, high-speed electrical signals from the first signal trace are routed to the connector. The second and third solder pads are to allow a conductor to be soldered to the second and third solder pads, such that, when the conductor is soldered, the high-speed electrical signals are routed to the second signal trace.

A chip package circuit board module including a circuit board and at least one original chip is provided. The circuit board includes at least one first pad, at least one second pad and at least one substitute pad. The at least one second pad is located besides the at least one first pad and separated from the at least one first pad. The at least one substitute pad is adjacent to the at least one second pad and separated from the at least one first pad and the at least one second pad. The at least one original chip is connected to the at least one first pad and at least one the second pad, respectively. A total width of a portion corresponding to each of the at least one second pad and a portion corresponding to the substitute pad adjacent to the second pad of the first pad is greater than or equal to twice a width of the original chip.

A dual printed circuit board assembly for vehicle lights, the dual printed circuit board including a dual printed circuit board and a dual connector. The dual printed circuit board having a first substrate with a first layout, a second substrate opposite to the first substrate with a second layout, and a common panel that supports the first substrate on a first side and the second substrate on a second side, wherein the first layout is populable by a first plurality of light sources to be used in a first light of the vehicle lights and the second layout is populable by a second plurality of light sources to be used in a second light of the vehicle lights. The dual connector having a first jumper connector electrically connected to the first layout, and a second jumper connector opposite to the first jumper connector and electrically connected to the second layout.

A printed circuit board (PCB) is disclosed on which various kinds of electronic components having diverse specifications may be mounted. The PCB includes a substrate base and a pad group formed on a surface of the substrate base. The pad group includes at least two pads. Each of the at least two pads includes a first sub-pad portion and a second sub-pad portion. The first sub-pad portion partially surrounds the second sub-pad portion. The second sub-pad portion of one of the at least two pads protrudes from an end portion of the first sub-pad portion toward another pad of the at least two pads.

An electrical circuit board on which an electronic component forming an electronic control unit disposed between an upstream power supply and a downstream power supply trunk line is mounted. The electrical circuit board includes a first circuit pattern that forms an electrical circuit corresponding to a single power supply voltage of the upstream power supply, a second circuit pattern that forms an electrical circuit corresponding to a plurality of power supply voltages of the upstream power supply, a single power supply connection portion corresponding to connection with an external circuit that supplies the upstream power supply, and an inter-board connection portion corresponding to inter-board connection with another circuit board that supplies the upstream power supply.

A circuit board includes a first non-conductive layer and a second non-conductive layer. Additionally, the circuit board includes a first electronic component. The circuit board is configurable to operate in a first configuration with a second electronic component, and the circuit board is configurable to operate in a second configuration with a third electronic component instead of the second electronic component. Furthermore, the circuit board includes a first trace layer disposed on the first non-conductive layer. The first trace layer is configured to electrically couple the first electronic component to the second electronic component in a first configuration of the circuit board. Additionally, the circuit board includes a second trace layer disposed between the first non-conductive layer and the second non-conductive layer. The second trace layer is configured to electrically couple the first electronic component to the third electronic component in a second configuration of the circuit board.

One example of a system includes a printed circuit board. The printed circuit board includes a switch chip footprint to receive a higher lane count switch chip or a lower lane count switch chip. The printed circuit board includes a plurality of transceiver module footprints. Each transceiver module footprint is electrically coupled to the switch chip footprint. Each transceiver module footprint may receive a higher lane count transceiver module or a lower lane count transceiver module.