A universal coupling is disclosed for electrically and mechanically connecting flexible printed circuit (FPC) components within asymmetric FPC modules. The universal coupling allows a first FPC component to be connected to a second FPC component in two or more different orientations. This allows identical FPC components to be used in two or more asymmetric FPC modules. This in turn allows a reduction in the number of parts and tooling required to fabricate the two or more asymmetric FPC modules, and a simplification of the fabrication process.

An SMD LED module based light is provided with a plurality of circuit boards; and a plurality of SMDs mounted on the circuit boards and electrically connected thereto. Each SMD includes a seat having a plurality of pins, an LED mounted one the seat, and two metal fastening members, each having two ends electrically connected to the circuit board and at least one of the pins respectively. The seat is spaced apart from the circuit board. The fastening members and the pins can be joined in one of many different configurations.

A mounting substrate on which at least any one of three kinds of electronic components including a first electronic component, a second electronic component, and a third electronic component are able to be mounted includes a pair of first edge portions and a pair of second edge portions. When a dimension of the first electronic component in its length direction is designated as L1, a dimension of the first electronic component in its width direction is designated as W1, a dimension of the second electronic component in its length direction is designated as L2, and a dimension of the second electronic component in its width direction is designated as W2, a dimension of the third electronic component in its width direction is any one of W1 and W2, and a dimension of the third electronic component in its length direction is L2 when the dimension of the third electronic component in its width direction is W1, and is L1 when the dimension of the third electronic component in its width direction is W2. At least one or more of the third electronic components are mounted on the mounting substrate.

Provided is an LED lamp using a nano-scale LED electrode assembly. The LED lamp using the nano-scale LED electrode assembly may solve limitations in which, when a nano-scale LED device according to the related art stands up and is three-dimensionally coupled to an electrode, it is difficult to allow the nano-scale LED device to stand up, and when the nano-scale LED devices are coupled to one-to-one correspond to electrodes different from each other, product quality is deteriorated. Thus, the nano-scale LED device having a nano unit may be connected to the two electrodes different from each other without causing defects, and light extraction efficiency may be improved due to the directivity of the nano-scale LED devices connected to the electrodes. Furthermore, deterioration in function of the LED lamp due to the defects of a portion of the nano-scale LEDs provided in the LED lamp may be minimized, and the LED lamp may have a flexible structure and shape by using the nano-scale LED electrode assembly of which a portion is deformable according to the used purpose or position of the LED lamp.

A universal coupling is disclosed for electrically and mechanically connecting flexible printed circuit (FPC) components within asymmetric FPC modules. The universal coupling allows a first FPC component to be connected to a second FPC component in two or more different orientations. This allows identical FPC components to be used in two or more asymmetric FPC modules. This in turn allows a reduction in the number of parts and tooling required to fabricate the two or more asymmetric FPC modules, and a simplification of the fabrication process.

A flexible printed circuit board and optical network allocation device comprising same. The flexible printed circuit board comprises a circuit board body (1), a plurality of protruding interfaces (101) on the circuit board body, an adhesive layer (2) covering the upper surface of the circuit board body (1), components (102), and an uplink interface (103) used for information interaction with the components (102) on the circuit board body (1). Each protruding interface (101) is provided with an electronic label read/write interface (1011) used for reading electronic label information on an optical fiber head and an indicator (1012). The adhesive layer (2) is provided with an open window region (201) in the middle. The components (102) are immobilized on the upper surface of the circuit board body (1) and located in the open window region (201) of the adhesive layer, and are connected to the electronic label read/write interface (1011), the indicator (1012), and the uplink interface (103) respectively, used for controlling and monitoring the read/write information of the electronic label read/write interface (1011) and controlling on/off of the indicator (1012).

Electronic devices and methods including a printed circuit board configured to accept CPUs and memory modules are described. One apparatus includes a printed circuit board that includes a first row of elements including a first CPU positioned between first and second groups of dual in-line memory modules (DIMMs). The printed circuit board also includes a second row of elements including a second CPU positioned between third and fourth groups of DIMMs. The apparatus also includes a third row of elements including a fifth group of DIMMs, wherein the second row of elements is positioned between the first row of elements and the third row of elements. Other embodiments are described and claimed.

Solder pads, systems, and related methods are provided. A first or second pad include at least one shape for increasing a number of edges available to align at least one part to be soldered thereto. Each solder pad can occupy a same surface area of the substrate. A plurality of circuit elements can be provided over the plurality of solder pads, where some of the circuit elements occupy different surface areas of the substrate and/or the solder pad. A method of providing a solder pad includes providing a substrate, providing a solder pad over the substrate, and providing at least one shape in the solder pad for increasing a number of edges available to align at least one part to be soldered thereto. The pads can attach for example to a surface-mount ceramic component, a submount-free component, a leadframe component and/or a chip on board component.

Systems and methods for educational electronics devices such as may be assembled by non-manufacturer builders, including by personal or hobbyist individuals and by groups such as clubs or classes. Methods and systems relate to Surface Mount Device (SMD) use, measurement systems, communications skill acquisition, physical construction of educational electronics, builder construction/configuration and maintenance of devices, subsystem componentry designed for effective use in educational electronics, circuit designs that permit individual builders to construct professional quality devices, and cognitively adapted methods and systems to optimize learning and performance during and after builder assembly.

Disclosed are a compatible circuit and a terminal. The compatible circuit includes a printed circuit board (PCB) of which the existing structure is not changed, and a group of compatible devices which are in a pin-to-pin form and have different internal structures, wherein the compatible devices and the PCB are assembled together; the internal structures of the compatible devices are matched with a link compatibility selection requirement; and the compatible devices are configured to conduct link selection output on at least two links which are input and need compatibility, in accordance with the link compatibility selection requirement.