The present disclosure provides a flexible display module and a method for manufacturing the flexible display module. The flexible display module includes a flexible display panel, a driving chip and a circuit board. The flexible display panel includes a display region and a bonding region, and the driving chip and the circuit board are arranged at the bonding region. The circuit board includes a first flexible printed circuit and a first printed circuit board provided with an electronic element, the first printed circuit board is coupled to one end of the first flexible printed circuit, and the first flexible printed circuit includes a bonded portion coupled to the bonding region of the flexible display panel. The first flexible printed circuit is bent so that a first space is defined by the first flexible printed circuit, the first printed circuit board and the flexible display panel.

Devices, systems, and methods for serial communication over a galvanically isolated channel are disclosed. A device includes a first IC device interface, first IO components connected to the first IC device interface, a second IC device interface, second IO components connected to the second IC device interface, an insulator layer having a first major surface and a second major surface, at least one pair of capacitor plates and corresponding interconnection paths on the first major surface, and at least one pair of capacitor plates and corresponding interconnection paths on the second major surface, wherein the at least one pair of capacitor plates on the first major surface of the insulator layer are aligned with the at least one pair of capacitor plates on the second major surface of the insulator layer to form at least one pair of capacitors.

An electric motor, at least having a stator and an annular rotor which are arranged next to one another along an axial direction; wherein the stator has a plurality of stator teeth which are arranged next to one another along a circumferential direction and which each extend along the axial direction. At least one coil has at least one turn is arranged on each stator tooth, wherein the at least one turn is electrically conductively connected to a printed circuit board. The printed circuit board is arranged on an end side of the stator and next to the stator along the axial direction. The printed circuit board comprises a plurality of electrical connecting lines via which the at least one turn of each coil is connected at least to other turns or to an electrical connection of the motor.

A circuit board according to an embodiment includes: an insulating part; and a pattern part disposed on the insulating part, wherein the insulating part includes first and second insulating regions spaced apart from each other with an open region interposed therebetween, the pattern part includes: a first terminal portion disposed in a plurality of first side regions of the first insulating region adjacent to the open region; a second terminal portion disposed on a plurality of second side regions of the second insulating region facing the plurality of first side regions with the open region interposed therebetween; and a connecting portion disposed in the open region and connecting between the first and second terminal portions, wherein the connecting portion includes a plurality of bent portions connecting between the first terminal portion and the second terminal portion disposed in the first side region and the second side region which do not face each other and formed at a plurality of corners of the open region, the plurality of bent portions are bent to rotate in the same direction as each other, each of the first terminal portion, the second terminal portion, and the connecting portion includes a metal layer and a surface treatment layer disposed on the metal layer, and the metal layer includes a first metal layer and a second metal layer that is disposed on the first metal layer and has an electrical conductivity different from that of the first metal layer.

A printed circuit board, in which two or more copper clad laminates (CCLs) are laminated vertically from an uppermost circuit layer to a lowermost circuit layer, includes a non-destructive testing area, mislamination identifying portions in the non-destructive testing area, the mislamination identifying portions being in the CCLs, respectively, through-via holes vertically exposing the mislamination identifying portions, respectively, in the non-destructive testing area, the through-via holes being spaced apart from each other by a first interval, and a probe via extending vertically and being in contact with an end portion of each of the mislamination identifying portions on a same side. A length of the mislamination identifying portion in an N-th (N is an integer of 1 to K) layer CCL in a horizontal direction is longer than a length of the mislamination identifying positioned in an (N-1)-th layer CCL in the horizontal direction.

A capacitor device to store electrical charge is disclosed that includes a first unit of a first conductor layer fabricated from a first material. The first conductor layer is sandwiched between two dielectric layers. This assembly is layered on a second unit of a second conductor layer fabricated from a second material and sandwiched between two additional dielectric layers. The first conductor layers are all electrically connected to one another, and the second conductor layers being electrically connected to one another but are not electrically connected to the first conductor. Any multiple of first and second units may be utilized.

A printed circuit board system includes a plurality of printed circuit board (PCB) assemblies that includes at least three PCB assemblies and a connecting module. The connecting module is coupled to each of the PCB assemblies. The connecting module is adapted to provide electrical and signal communications between each of the PCB assemblies. The connecting module is on different planes with respect to at least one of the PCB assemblies.

An electronic power device including transistors formed on a circuit assembly formed of a plurality of layers. The layers include gate drive layers, gate return layers, and power layers. A gate drive circuit is formed on the circuit assembly, and is connected to the gate and source of each of the transistors through the gate drive layers and the gate return layers. A voltage supply connection is provided to each of the plurality of transistors interleaved through the power layers. The circuit assembly includes a multilayer circuit board and/or a multilayer ceramic substrate. The ceramic substrate includes the power layers and transistors. The gate drive and return layers and gate drive circuit may be formed within the ceramic substrate or the circuit board. The ceramic substrate may be located in a modular housing. The circuit board may be outside the modular housing or inside the modular housing.

In one embodiment of the present disclosure, a phased array antenna system includes a first portion carrying an antenna lattice including a plurality of antenna elements, wherein the plurality of antenna elements are arranged in a first configuration, and a second portion carrying a beamformer lattice including a plurality of beamformer elements, wherein the plurality of beamformer elements are arranged in a second configuration different from the first configuration, wherein each of the plurality of antenna elements are electrically coupled to one of the plurality of beamformer elements.

A method for manufacturing a wiring circuit board that is a double-sided wiring circuit board includes a first step of preparing a laminate and a second step. The laminate includes a metal core layer, insulating layer, and conductor layers. The insulating layer has a region and an opening that are adjacent to each other. The insulating layer has a region including a part facing the region in a thickness direction, and an opening adjacent to the region. The conductor layer includes a wiring portion and a conductive portion. The conductor layer includes a wiring portion and a conductive portion. In the second step, the first and second etching treatments for etching the metal core layer through the openings are carried out to form a via portion having a periphery surrounded by a space, extending between the regions, and connected to the conductive portions.