Provided is a power conversion device converting power and supplying the converted power to a load, the power conversion device including: a power conversion circuit connected to the load and configured to supply/receive the power; a coil configured to detect a current passing through the power conversion circuit and to output a voltage corresponding to the detected current; an integration circuit configured to integrate the voltage output from the coil to generate a voltage signal corresponding to a variation of the current; and a control device configured to generate a control signal to the power conversion circuit based on the voltage signal output from the integration circuit.

A resin multilayer substrate includes a multilayer body including resin base-material layers laminated in a thickness direction and a circuit conductor therein, an end-surface ground conductor provided directly on each end surface of the multilayer body in the thickness direction, an adhesion layer on a side surface of the multilayer body, and a side-surface ground conductor on the adhesion layer. The end-surface and side-surface ground conductors are made of a ground conductor material with a coefficient of thermal expansion whose difference from a coefficient of thermal expansion of the resin base-material layers in a plane direction is smaller than a difference from a coefficient of thermal expansion of the resin base-material layers in the thickness direction. The adhesion layer is made of a material with higher adhesiveness to the side surface of the multilayer body than adhesiveness of the ground conductor material.

A multilayer substrate includes a multilayer body in which insulating layers are laminated in a laminating direction, a front electrode that is provided on a front surface side of a first insulating layer which is positioned on a front surface side of the multilayer body among the insulating layers, a first internal electrode that is provided on an opposite side to the front electrode with the first insulating layer interposed therebetween, and a first interlayer connection conductor that electrically connects the front electrode and the first internal electrode with each other. The first interlayer connection conductor includes a front side connection surface that is electrically connected with the front electrode and a back side connection surface that is electrically connected with the first internal electrode.

A multi-layer circuit board with embedded components (100) in multiple layers and miniaturized form, with embedded electronic elements in a higher element density and shorter voltage paths includes a circuit board (10) provided with a mounting groove (101), and a plurality of elements (20). The elements (20) are arranged in the mounting groove (101), and the circuit board (10) includes several vertically-stacked circuit substrates (11, 12, 13, 14) arranged around the mounting groove (101), The multi-layer circuit board with embedded components circuit board (100) includes a conductive member (30) arranged in the mounting groove (101) and electrically connecting the elements (20) and the layers of conductive circuits.

A flexible printed circuit (FPC) for a hard disk drive includes a plurality of electrical traces, whereby aggressor traces are isolated from victim traces to avoid crosstalk that could degrade signals. Aggressor traces may be positioned together at one of the edges of each of the top wiring layer and the bottom wiring layer, physically isolated from victim traces. Aggressor traces may be grouped together at either the top wiring layer or the bottom wiring layer, with the victim traces positioned on the layer opposing the aggressor traces. With aggressor and victim traces routed on the same wiring layer, aggressor traces may be routed away from the victim traces with multi-layer routing, by way of vias.

A display device is provided and includes first substrate comprising first base member, first terminal and pixel electrodes; second substrate comprising second base member comprising first surface opposing and spaced apart from first terminal and second surface on an opposite side to first surface, second terminal located on side of second surface, and first hole which penetrates from first surface to second surface and second terminal; organic insulating layer provided between first terminal and second base member and adjacent to display area, organic insulating layer having second hole beneath first hole; and connecting material provided on first and second hole to electrically connect first terminal and second terminal, wherein organic insulating layer includes sealant attaches first substrate and second substrate, diameter of second hole is greater than diameter of first hole, and at least one of first terminal and second terminal including oxide electrode in contact with connecting material.

A method includes providing a first laminate and a second laminate. The first laminate includes a first conductor layer, a first insulating layer containing polyimide, and a second conductor layer. The second laminate includes a second insulating layer containing polyimide and a third conductor layer. The method further includes: heating each of the first laminate and the second laminate under a condition including a heating temperature equal to or higher than 100° C. and a heating duration equal to or longer than half an hour; and stacking, after heating, the first laminate and the second laminate one on top of the other with a third insulating layer interposed between the second conductor layer and the second insulating layer.

A wiring circuit board includes an insulating layer, a pair of wiring layers, an insulating layer, and a wiring layer. The pair of wiring layers are disposed on the insulating layer and extend side by side apart from each other. The insulating layer is disposed on the insulating layer so as to cover the pair of wiring layers. The wiring layer is disposed on the insulating layer and extends along the pair of wiring layers, while facing to the pair of wiring layers in a thickness direction of the wiring layer. The wiring layer has a ridge portion. The ridge portion protrudes into the insulating layer toward a region between the wiring layers and extends along the region.

A printed board includes a first and second insulator extending in a first direction; a third insulator extending in a second direction and including a first and second portion located above and below the first insulator respectively in a third direction; a fourth insulator extending in the second direction, and including a third and fourth portion located below and above the first insulator respectively in the third direction; and a first and second conductor extending in the first direction, and arranged along the second direction with a first pitch therebetween. The first pitch is an n multiple of a first distance that is based on an interval between the first and second portion or the third and fourth portion. The n is an integer equal to or greater than 1.

A PCB includes a plurality of layers spaced apart in a vertical direction, a first detection pattern and a second detection pattern and pads connected to the first detection pattern and the second detection pattern. The first detection pattern and the second detection pattern are provided in a respective one of a first layer and a second layer adjacent to each other such that the first detection pattern and the second detection pattern are opposed to each other. The pads are provided in an outmost layer. Each of the first detection pattern and the second detection includes at least one main segment extending in at least one of first and second horizontal directions and a diagonal direction. A time domain reflectometry connected to a pair of pads detects a misalignment of the PCB by measuring differential characteristic impedance of the first detection pattern and the second detection pattern.