A component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure; a barrier structure; and a component. The component has at least one pad embedded in the stack and/or in the barrier structure. At least a portion of one of the electrically conductive layer structure and the at least one pad includes copper in contact with the barrier structure.

The invention discloses a glass carrier having a protection structure, comprising a glass body and a protection layer. The glass body has a top surface, a bottom surface, and a lateral surface. The protection layer covers the lateral surface of the glass body. The protection layer is a hard material with a stiffness coefficient higher than a stiffness coefficient of the glass body. The invention further discloses a manufacturing method of a glass carrier having a protection structure, comprising the following steps: covering the protection layer around the lateral surface of the glass body, wherein the protection layer is the hard material with the stiffness coefficient higher than the stiffness coefficient of the glass body.

A testing substrate includes a first build-up structure and a ceramic substrate. The ceramic substrate is arranged on the first build-up structure. The first bonding interface between the first build-up structure and the ceramic substrate includes a dielectric-to-dielectric bonding interface and a metal-to-metal bonding interface. A manufacturing method of a testing substrate and a probe card are also provided.

An electronic device may include electrical components and other components mounted within an interior of a housing. The device may have a display on a front face of the device and may have a glass layer that forms a housing wall on a rear face of the device. The glass housing wall may be provided with regions having different appearances. The regions may be textured, may have coatings such as thin-film interference filter coatings formed from stacks of dielectric material having alternating indices of refraction, may have metal coating layers, and/or may have ink coating layers. Textured surfaces, cavities, coatings, and other decoration may be embedded in glass structures that are joined with chemical bonds at diffusion-bonding interfaces.

A circuit board for a non-combustion flavor inhaler includes a substrate and an electrically conductive ink pattern printed on the substrate. The substrate includes paper. A percentage weight loss of the paper from room temperature to 290° C. is less than 20% of a percentage weight loss of the paper from room temperature to 900° C. under a condition that allows air to flow at a flow rate of 100 mL/min while elevating a temperature of the air at a speed of 10° C./min.

Proposed are an anodic aluminum oxide structure made of anodic aluminum oxide, a probe head having the same, and a probe card having the same. More particularly, proposed are an anodic aluminum oxide structure that has a fine size and pitch guide hole and facilitates insertion of a probe, a probe head having the same, and a probe card having the same.

An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a pressure differential force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.

A method for producing a prepreg, includes the steps of (1) an opening step of opening glass fiber bundles to form plural glass fiber filaments, and (2) a step of aligning the plural glass fiber filaments formed in the previous opening step, on a thermosetting resin composition-coated surface of a carrier material so as to make the filaments run nearly parallel to each other in one direction thereon to form a prepreg. A method for producing a laminate, includes a step of preparing two or more prepregs formed in the previous step (2), laminating them in such a manner that, in at least one pair of prepregs, the running direction of the plural glass fiber filaments in one prepreg differs from the running direction of the plural glass fiber filaments in the other prepreg, and heating and pressing them.

One aspect is a resistor component for surface mounting on a printed circuit board, including a ceramic substrate with a first side and an opposite second side. A sinterable metallization is at least in some regions arranged on the second side. A resistance element comprising a metal layer is arranged at least in some regions on the first side of the ceramic substrate with a first connection and a second connection. An insulation layer is arranged at least in some regions on the resistance element and the ceramic substrate. A first region on the first connection and a second region on the second connection remain uncovered by the insulation layer. A first contact pad electrically contacts the first connection via the first region, and a second contact pad electrically contacts the second connection via the second region. The first contact pad at least in some regions covers a first surface region of the insulation layer and the second contact pad at least in some regions covers a second surface region of the insulation layer, and the first and the second contact pads are arranged spatially separated from one another on the insulation layer.

A method for obtaining a glazing includes a glass sheet covered, on one of its faces with electroconductive patterns having in at least one area, a so-called extra thickness area, a greater thickness than in the other areas, the method including depositing by screenprinting a first electroconductive layer forming patterns on one side of the glass sheet, then depositing by a digital printing technique, in the or each extra thickness area, a second electroconductive layer on the first layer while the latter is still wet, then a heat treatment step to cure the first and the second layer.