Patent classifications
H05K1/038
Wearable electronics formed on intermediate layer on textiles
One manner of producing more desirable clothing with electronic capabilities is to manufacture electronics, such as the charging wires or devices themselves, directly onto the textile materials. Textile materials generally do not support the manufacturing of electronic devices, in part because the surface of the textile is too rough for electronic devices or the processes used to manufacture electronic devices. An intermediate layer may be placed on the textile material to reduce the roughness of the surface of the textile material and provide other beneficial characteristics for the placement of electronic devices directly on the textile material.
Flexible and Durable Printed Circuits On Stretchable And Non-Stretchable Substrates
The present invention is directed to flexible conductive articles (600) that include a printed circuit (650) and a stretchable or non-stretchable substrate (610). In some embodiments, the substrate has a printed circuit on both sides. The printed circuit contains N therein a porous synthetic polymer membrane (660) and an electrically conductive trace (670) as well as a non-conducive region (640). The electrically conductive trace is imbibed or otherwise incorporated into the porous synthetic polymer membrane. In some embodiments, the synthetic polymer membrane is microporous. The printed circuit may be discontinuously bonded to the stretchable or non-stretchable substrate by adhesive dots (620). The printed circuits may be integrated into garments, such as smart apparel or other wearable technology.
Embossed smart functional premium natural leather
A smart functional leather assembly includes a leather substrate, an electronic circuit layer including one or more conductive traces and optional electronic elements arranged on the leather substrate, optionally a pigmented coating arranged on the circuit layer, and an optional anti-soiling layer arranged on the pigmented layer. The entire smart functional leather assembly, including the circuit, are embossed to provide an embossed smart functional leather assembly with an embossed pattern.
ELECTRICAL CIRCUIT BOARD WITH LOW THERMAL CONDUCTIVITY AND METHOD OF CONSTRUCTING THEREOF
An electrical circuit board includes a first conductive layer and a second conductive layer. And an interlayer forming a thermal barrier is placed between the first conductive layer and the second conductive layer, wherein the thermal barrier reduces heat transfer between the first conductive layer and the second conductive layer.
METAL-CONTAINING FABRICS AND MEMBRANES, AND METHOD OF MANUFACTURING THEREOF
A method of manufacturing a metal fabric or membrane, the method comprises providing an ink comprising a plurality of semiconductor particles disposed in a first solvent. The method comprises applying the ink to a fabric or membrane to obtain a fabric or membrane comprising a plurality of semiconductor particles. Finally, the method comprises contacting the fabric or membrane comprising the plurality of semiconductor particles with a deposition solution comprising a second solvent, an autocatalytic agent, and metal cations to thereby cause a reaction to occur such that the metal cations are reduced and at least partially displace the semiconductor particles, to thereby provide a metal fabric or membrane.
Textile material comprising conductive elements
Textile material having conductive elements for an interior of a vehicle includes a flat textile substrate having a first surface and an opposite second surface. At least one conductor track formed of a conductive paint is printed onto the first surface. At least one sensitive element, which is electrically conductively connected to the conductor track on the first surface, is arranged on the second surface.
DRAPABLE, FLEXIBLE CIRCUITRY LAYERS AND METHODS THEREFOR
A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.
ELECTRONIC-GRADE GLASS FIBER COMPOSITION, AND GLASS FIBER AND ELECTRONIC FABRIC THEREOF
An electronic-grade glass fiber composition includes the following components with corresponding amounts by weight percentages: 54.2-60% SiO.sub.2, 11-17.5% Al.sub.2O.sub.3, 0.7-4.5% B.sub.2O.sub.3, 18-23.8% CaO, 1-5.5% MgO, less than or equal to 24.8% CaO+MgO, less than 1% Na.sub.2O+K.sub.2O+Li.sub.2O, 0.05-0.8% TiO.sub.2, 0.05-0.7% Fe.sub.2O.sub.3, and 0.01-1.2% F.sub.2. The weight percentage ratio C1=SiO.sub.2/(RO+R.sub.2O) is greater than or equal to 2.20, and the total weight percentage of the above components is greater than or equal to 98.5%.
ELASTIC PRINTED CONDUCTORS
The development of stretchable, mechanically and electrically robust interconnects by printing an elastic, silver-based composite ink onto stretchable fabric. Such interconnects can have conductivity of 3000-4000 S/cm and are durable under cyclic stretching. In serpentine shape, the fabric-based conductor is enhanced in electrical durability. Resistance increases only ˜5 times when cyclically stretched over a thousand times from zero to 30% strain at a rate of 4% strain per second due to the ink permeating the textile structure. The textile fibers are wetted with composite ink to form a conductive, stretchable cladding of the silver particles. The e-textile can realize a fully printed, double-sided electronic system of sensor-textile-interconnect integration. The double-sided e-textile can be used for a surface electromyography (sEMG) system to monitor muscles activities, an electroencephalography (EEG) system to record brain waves, and the like.
Elastic printed conductors
The development of stretchable, mechanically and electrically robust interconnects by printing an elastic, silver-based composite ink onto stretchable fabric. Such interconnects can have conductivity of 3000-4000 S/cm and are durable under cyclic stretching. In serpentine shape, the fabric-based conductor is enhanced in electrical durability. Resistance increases only ˜5 times when cyclically stretched over a thousand times from zero to 30% strain at a rate of 4% strain per second due to the ink permeating the textile structure. The textile fibers are ‘wetted’ with composite ink to form a conductive, stretchable cladding of the silver particles. The e-textile can realize a fully printed, double-sided electronic system of sensor-textile-interconnect integration. The double-sided e-textile can be used for a surface electromyography (sEMG) system to monitor muscles activities, an electroencephalography (EEG) system to record brain waves, and the like.