A laminate having an integrated electrical component disposed within the laminate is disclosed. The laminate includes a first paper layer having at least first and second vias through the first paper layer; a first electrically-conductive layer, comprising an electrically-conductive material, disposed over a portion of the first paper layer; a second electrically-conductive layer, comprising the electrically-conductive material, disposed over another portion of the first paper layer; an electrical component disposed over the first and second electrically-conductive layers; and an insulating layer disposed over the electrical component. The first paper layer and the insulating layer encapsulate the first electrically-conductive layer, the second electrically-conductive layer, and the electrical component. The first and second vias are in electrical contact with the first electrically-conductive layer and a first terminal of the electrical component, and with the second electrically-conductive layer and a second terminal of the electrical component, respectively.

A mass produced electrically conductive device with sufficiently high yield, even when forming a conductive layer pattern having an extremely small thickness/minimum area using a minimum amount of silver paste. The identifier-providing device has a conductive layer pattern formed on a rear surface of a base material as an insulator. The silver paste forming the conductive layer pattern contains only silver flakes, as silver particles, that have a particle size in a range of 3.0 to 5.0 m and that has a thickness of 100 nm at a largest thickness portion, while having a thickness of 50 nm at a smallest thickness portion. The conductive layer pattern is formed to have a film thickness of 10 m or less by laminating the silver flakes in the thickness direction. The silver flakes forming the conductive layer are in a fused state or an aggregating/cohering state at the smallest thickness portion.

In a method for making a flexible material, a sheet of graphene oxide-composite paper is subjected to an environment having a relative humidity above a predetermined threshold for a predetermined amount of time. At least one expansion cut is cut in the sheet of graphene oxide-composite paper. A flexible conductive material includes a sheet of graphene oxide-composite paper defining at least one cut passing therethrough and formed it a kirigami structure. A region of the sheet of graphene oxide-composite paper includes reduced graphene oxide.

A method for producing an electrically conductive thin film on a substrate is disclosed. Initially, a reducible metal compound and a reducing agent are dispersed in a liquid. The dispersion is then deposited on a substrate as a thin film. The thin film along with the substrate is subsequently exposed to a pulsed electromagnetic emission to chemically react with the reducible metal compound and the reducing agent such that the thin film becomes electrically conductive.

A biodegradable system includes a biodegradable substrate which can be a biodegradable paper or polymer. A biodegradable power source is printed or deposited above the substrate, and biodegradable processor and communication circuits are in turn formed on the substrate. The processor and wireless communication system can communicate with a remote computer to provide information about the source of the items (optionally tracked using the blockchain supply chain tracking), the relevant dates (production and expiration dates), any attempt to tamper with the packaging, and suitable warnings or usage instructions, for example. Optionally, a biodegradable display can render information to a customer, for example.

A disclosed circuit arrangement includes adhesive transfer tape, and an electronic device attached to adhesive of the adhesive transfer tape. First and second cross wires are attached to the adhesive and are disposed proximate the electronic device. One or more wire segments are attached to the adhesive and have first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire, respectively. The first and second cross wires and the one or more wire segments have round cross sections, the first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. First and second bond wires are connected to the electronic device and to the first and second portions of the one or more wire segments, respectively.

A hand-made circuit board includes a substrate and a medium layer disposed on a surface of the substrate to form a pattern. The medium layer has a non-conductive zone configured with a plurality of electrical blocks. The electrical blocks are discontinuously distributed in the non-conductive zone, so that the electrical blocks on at least one cross-section of the non-conductive zone are not electrically connected. In addition, the medium layer has a conductive zone configured with a plurality of electrical blocks. The electrical blocks are continuously distributed in the conductive zone, so that the electrical blocks on at least one cross-section of the conductive zone are electrically connected.

A circuit board nonwoven fabric comprising a paper-formed structure which comprises a plurality of thick fibers in which the portion of greatest fiber diameter is 5 ?m or greater, and a plurality of fine fibers in which the portion of greatest fiber diameter is less than 5 ?m, wherein an average fiber length of the thick fibers is greater than an average fiber length of the fine fibers, the number of fine fibers is greater than the number of thick fibers, and the thick fibers have a flat shape with a major axis and a minor axis, the minor axis being oriented in a thickness direction of the paper-formed structure.

A laminate having an integrated electrical component disposed within the laminate is disclosed. The laminate includes a first paper layer having at least first and second vias through the first paper layer; a first electrically-conductive layer, comprising an electrically-conductive material, disposed over a portion of the first paper layer; a second electrically-conductive layer, comprising the electrically-conductive material, disposed over another portion of the first paper layer; an electrical component disposed over the first and second electrically-conductive layers; and an insulating layer disposed over the electrical component. The first paper layer and the insulating layer encapsulate the first electrically-conductive layer, the second electrically-conductive layer, and the electrical component. The first and second vias are in electrical contact with the first electrically-conductive layer and a first terminal of the electrical component, and with the second electrically-conductive layer and a second terminal of the electrical component, respectively.

A system for assembling electronic circuits on an electrically non-conductive surface or substrate. The system incorporates electronic components integrated into electronic component modules. The electronic component modules include identification markings on the top surfaces and electronic contact pads on the bottom surfaces. Electrical interconnects between discrete electronic component modules is achieved through the use of electrically conductive traces placed on the substrate surface. The bottom surfaces of the electronic component modules are coated with an adhesive so the electronic component modules can be mounted onto the substrate. The electronic component modules are affixed to the substrate such that the electronic component modules contact pads make electrical contact with the appropriate electrically conductive traces.