A circuit board includes a base material portion having a sheet-like shape, an electric circuit pattern portion being formed on at least one of surfaces of the base material portion and being conductive, a folding portion where a linear fold is to be formed to divide, when the circuit board is bent, each of the base material portion and the electric circuit pattern portion into a first area and a second area, and a disconnection preventing portion that prevents disconnection between the first area and the second area in the electric circuit pattern portion in a state where the circuit board is bent at the folding portion.

A rip stop material is attached at a stress area of a flexible circuit board in order to strengthen the flexible circuit board and minimize ripping and cracking in the polyimide and/or the copper conductors of the circuit. A rip stop transition layer is formed and deposited at a location on the flexible circuit in order to minimize, reduce, if not preventing cracking and ripping of the circuit as it is bent and flexed. The rip stop transition layer can be placed at different locations on and within the flexible circuit in order to minimize cracking and ripping as the flexible circuit is bent, flexed and twisted.

A method of forming a conductive/nonconductive pattern on a conductive particle-coated fabric uses chemical etching techniques to remove specific areas of conductive material from the fabric, producing non-conductive areas where the fabric was exposed to an etching agent, and leaving conductive areas where the conductive coating was protected by an etch-resistant coating.

The invention relates to a layered structure (10) comprising the following layers: a) a first substrate layer (2), wherein the first substrate layer (2) has a first surface (4) and a second surface (6) and is configured as a dielectric; b) a first electrically conductive layer (8) which overlaps at least in part the first substrate layer (2) at least on the first surface (4) of the first substrate layer (2), wherein the first electrically conductive layer (8) comprises an electrically conductive polymer, wherein the first electrically conductive layer (8) has at least one first part region (18) and at least one further part region (20), wherein the at least one first part region (18) has a higher bonding strength to the substrate layer (2) than to the at least one further part region (20).

A cellulosic substrate-based device is described, including a cellulosic substrate comprising a functionalized surface covalently functionalized by a chemical moiety in an amount sufficient to provide an omniphobic or hydrophobic surface; and a material printed on the functionalized surface, wherein the printed material has a line edge roughness of less than about 15 m and/or a line lateral resolution of less than about 50 m.

A method for producing an electrically conductive thin film on a substrate is disclosed. Initially, a reducible metal compound and a reducing agent are dispersed in a liquid. The dispersion is then deposited on a substrate as a thin film. The thin film along with the substrate is subsequently exposed to a pulsed electromagnetic emission to chemically react with the reducible metal compound and the reducing agent such that the thin film becomes electrically conductive.

To provide a copper electroconductive film formed on a paper substrate, the copper electroconductive film being considerably improved in weather resistance and electroconductivity. The problem can be achieved by an electroconductive film formed by pressing a sintered electroconductive film formed by sintering copper particles in a coating film containing copper powder on a paper substrate along with the substrate, the electroconductive film having an area ratio of copper occupying on a cross section of the electroconductive film in parallel to a thickness direction thereof of 82.0% or more. The electroconductive film can be produced by pressing, for example, by roll press to from 90 to 190 C., after light sintering.

Wood derived multilayer glued or laminated product having an integrated electric circuit, comprising a paper layer and conducting elements of conductive ink deposited on said paper layer, said elements being suitable for forming an electric circuit and said paper layer has a rugosity inferior to 60 m. The paper layer may be of kraft paper. The product may comprise one or more additional kraft paper layers, in particular having a hole for receiving electric components such that the top surface of product remains flat. The product may include a fibreboard substrate of MDF. The paper layer may be a decorative paper layer glued with the circuit facing the substrate. The manufacture process comprises depositing conductive ink elements on a paper layer having rugosity inferior to 60 m for forming an electric circuit; and incorporating, by gluing or laminating, said paper layer into the multilayer product.

A printed graphene-based laminate for wireless wearable communications can be processed at low temperature so that it is compatible with heat-sensitive flexible materials like papers and textiles. The printed graphene-based laminate is of high conductivity, high flexibility, light weight and low cost, making it perfect candidate for wireless wearable devices. As a proof of concept, printed graphene-based laminate enabled transmission lines (TLs) and antennas were designed, fabricated and characterized. To explore its potentials in wearable communications applications, mechanically flexible transmission lines and antennas under various bended cases were experimentally studied. The measurement results demonstrate that the printed graphene laminate can be used for RF signal transmitting, radiating and receiving, which represents some of the essential functionalities of RF signal processing in wireless wearable communications systems. This work brings a step closer the prospect to implement all graphene enabled wireless wearable communications systems in the near future.

A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.