A method for preparing a liquid crystal polymer film, comprising: (1) spinning a liquid crystal polymer into fibers, and maintaining the fibers for 0.1 hour to 36 hours at a temperature of 200° C. to 400° C. under a vacuum degree less than 500 Pa for later use; (2) weaving the fibers prepared in step (1) into cloth for later use; and (3) pressing the cloth prepared in step (2) into a film at a temperature of 200° C. to 400° C., and then stretching the film to obtain the liquid crystal polymer film. The liquid crystal polymer film prepared by the preparation method is good in mechanical property, and has a tensile strength that can exceed 170 MPa. The prepared liquid crystal polymer film is applied to a FPC, which makes the FPC have a dielectric constant less than 3, and a small dielectric loss tangent angle.

A cutting method for a display panel, wherein the cutting method includes: cutting a display motherboard to be cut into a plurality of separate display panels by using a first laser beam, wherein the display panels each include a plurality of leads disposed between conductive connectors and a cutting edge of the display panel formed after cutting by the first laser beam; and severing at least some leads of the display panel by using a second laser beam at a position on the display panel between the conductive connectors and the cutting edge of the display panel, the at least some leads being short-circuited leads.

An electronic device is provided. The electronic device includes a hinge structure, a first housing structure, a second housing structure that is foldable with the first housing structure, a foldable housing, a flexible display, a first mid-plate disposed on one side of the first housing structure, a second mid-plate disposed on one side of the second housing structure, a flexible printed circuit board (FPCB) extending between the first mid-plate and the second mid-plate, a first sealing member that seals a first opening formed in the first mid-plate, and a second sealing member that seals a second opening formed in the second mid-plate.

A wiring board, comprising: wiring patterns that are buried with the wiring board, in which at least one of thickness regions to a thickness position of 7 μm toward a direction away from the wiring patterns with each of one surface and the other surface of the wiring pattern in a thickness direction as a reference has an elastic modulus at 240° C. equal to or greater than 300 MPa, and a dielectric loss tangent is equal to or less than 0.006.

A polymer film is provided, the polymer film comprises a liquid crystal polymer, comprising a soluble liquid crystal polymer and an insoluble liquid crystal polymer; and a polyimide polymer, accounting for 5 wt % or more of the polymer film. A method for manufacturing the polymer film is also provided, the method for manufacturing the polymer film comprises steps: providing a liquid crystal polymer powder, a particle size of the liquid crystal polymer powder is 0.1 um to 20 um; providing a liquid crystal polymer glue, a solid content of which is greater than 3 wt %; providing a polyamic acid glue; mixing the liquid crystal polymer powder, the liquid crystal polymer glue and the polyamic acid glue into a mixed solution, the mixed solution is made into a gel film, and the gel film is baked at a temperature of 300° C. to form a polymer film.

According to an aspect of the present disclosures, a method of making a flexible printed circuit board, which includes a base film having an insulating property, a conductive pattern disposed on either one or both surfaces of the base film, and a cover layer covering a conductive-pattern side of a laminated structure inclusive of the base film and the conductive pattern, includes a superimposing step of superimposing a cover film on the conductive-pattern side of the laminated structure, the cover film having a first resin layer and a second resin layer that is laminated to an inner side of the first resin layer and that softens at a lower temperature than does the first resin layer, and a pressure bonding step of vacuum bagging the laminated structure and the cover film at a temperature higher than a softening temperature of the second resin layer.

A display device includes a display panel, a data driver which transmits a data voltage to the display panel, a first flexible printed circuit board attached to the display panel and including an input side wiring electrically connected to the data driver, a first printed circuit board (PCB) electrically connected to the input side wiring to transmit a high-speed driving signal to the data driver, and a metal tape overlapping the input side wiring in a plan view and attached on the first flexible printed circuit board, where a part of the metal tape overlapping the input side wiring in the plan view defines an opening.

A flexible wiring board includes a layer including an impedance control line capable of transmitting a high frequency signal and a conductive layer including a conductor positioned along the impedance control line. The flexible wiring board is capable of transmitting high frequency signals well.

Disclosed is a printed circuit board (PCB) module including a first PCB comprising a base PCB, a sidewall disposed on a periphery of the base PCB, and conductive vias penetrating the sidewall, a second PCB disposed on the sidewall to cover a cavity formed by the sidewall of the first PCB, and at least one electronic component disposed inside the cavity and located on the first PCB and/or the second PCB, wherein the sidewall comprises a first layer disposed on an upper face of the base PCB and constructed of an insulating member, a second layer disposed on the first layer and comprising a polyimide, a third layer disposed on the second layer and constructed of an insulating member, and a fourth layer disposed on the third layer and comprising a conductive member conductive with respect to the conductive vias.

A laminated film in which a heat-resistant base film and a metal foil are bonded using an adhesive is provided with a barrier layer that prevents chemicals from entering the adhesive layer, between the metal foil and the adhesive layer. The barrier layer is made of a heat-resistant resin similar to that of the base film and has a water absorption rate of 1% or less. The adhesive layer is a silicone-based resin and has a thickness of 40 μm or more after drying.