A power module is provided. The power module includes a substrate, a power conversion chip that is disposed on the substrate and an insulating film that is formed on a structure in which the power conversion chip is disposed on the substrate. Additionally, the power module includes a metal mold that encases the structure that is coated with the insulating film. Additionally, the power module provides a simplified structure and improved heat dissipation performance compared to conventional power modules.

A power module is provided. The power module includes a substrate, a power conversion chip that is disposed on the substrate and an insulating film that is formed on a structure in which the power conversion chip is disposed on the substrate. Additionally, the power module includes a metal mold that encases the structure that is coated with the insulating film. Additionally, the power module provides a simplified structure and improved heat dissipation performance compared to conventional power modules.

A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.

A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

The present disclosure relates to an electronic device (10) comprising at least one electrically conductive structure (11) with a tubular shape having outer and inner surfaces (11c, 11d) covered by an insulating layer (12), and one or more integrated circuits (13) positioned within the electrically conductive structure (11).

The present disclosure relates to an electronic device (10) comprising at least one electrically conductive structure (11) with a tubular shape having outer and inner surfaces (11c, 11d) covered by an insulating layer (12), and one or more integrated circuits (13) positioned within the electrically conductive structure (11).

A lighting device (1) is provided comprising a support structure (13, 13′), the support structure (13, 13′) comprising a first layer (13a, 13a′) comprising metal and a second layer (13b, 13b′) comprising metal; a central mounting face (18c) formed by a portion of the first layer (13a, 13a′) and by a portion of the second layer (13b, 13b′); and at least one lateral mounting face (18a, 18b) formed by a portion of one of the first layer (13a, 13a′) and the second layer (13b, 13b′); the lighting device (1) further comprising: at least one first light emitting element (11.1, 11.2, 11.3, 11.4, 11.5) arranged on the central mounting face (18c) in contact with the first layer (13a, 13a′) and in contact with the second layer (13b, 13b′); at least one second light emitting element (12a.1, 12a.2, 12a.3, 12a.4, 12a.5, 12b.1) arranged on the lateral mounting face (18a, 18b) in contact with the one of the first layer (13a, 13a′) and the second layer (13b, 13b′) forming the lateral mounting face (18a, 18b), and separated from the other one of the first layer (13a, 13a′) and the second layer (13b, 13b′).

Furthermore, a method for manufacturing such lighting device (1) and an automotive headlight comprising such lighting device (1) are provided.

A resin coated copper according to an embodiment includes: an insulating layer including a resin and a filler dispersed in the resin; and a copper foil layer disposed on the insulating layer, wherein the insulating layer has a plurality of pores formed on a surface in contact with the copper foil layer, and the plurality of pores have a width of 200 nm to 350 nm.

A wiring circuit board includes a metal support substrate, an insulating layer, and a conductive layer in this order in a thickness direction, and has an edge portion extending in a first direction. The edge portion includes a main structure portion and partially includes a partial structure portion. In the main structure portion, the metal support substrate has a substrate extension portion extending outwardly with respect to the insulating layer in a second direction perpendicular to the first direction and the thickness direction. In the partial structure portion, the insulating layer has an insulating layer extension portion extending outwardly with respect to the metal support substrate in the second direction.