Disclosed herein is a microcontroller board for the learning and practice of coding. In the microcontroller board, a platform area (S1) including a platform circuit board (10) in which a microcontroller is provided and module areas (S2) each having a cut line and including a module circuit board (20) are divided and formed on a single board array (S), corresponding header socket holes H are formed in the platform area (S1) including the platform circuit board (10) and the module areas (S2) on both sides of each of the cut lines, a plurality of machine holes (30) is provided along each of the cut lines between the header socket holes (H), via holes (40) are formed by plating the inner circumferential surfaces of the machine holes (30) with metal layers (35) in order to conduct electricity, and V-cut grooves (50) are formed along each of the cut lines.

The present application discloses a differential signal routing line of a circuit board and a circuit board, which comprises a circuit board, and the circuit board is provided with differential signal routing lines including a first differential signal routing line and a second differential signal routing line that are disposed at different layers of the circuit board.

A printed circuit board is housed in a connector. A temperature sensor is mounted on the printed circuit board between two connection pads located on one of the faces of the printed circuit board. A contact housed in the connector is placed in thermal continuity with two thermal conduction lands, one of which is arranged on the same face of the printed circuit board as the connection pads and the other of which is arranged beneath the temperature sensor. Each of the connection pads is connected to a temperature measurement circuit.

Embodiments include a reflowable grid array (RGA) interposer, a semiconductor packaged system, and a method of forming the semiconductor packaged system. The RGA interposer includes a substrate having vias and zones, where the zones have embedded heaters. The heaters may include first traces, second traces, and via filament interconnects. The vias may have a z-height greater than a z-height of the heaters, and each of the zones may have a grid pattern. The RGA interposer may include first and second layers in the substrate, where the first layer includes the first traces, the second layer includes the second traces, and the second layer is over the first layer. The grid pattern may have parallel first traces orthogonal to parallel second traces to form a pattern of squares, where the pattern of squares has the first traces intersect the second traces substantially at right angles.

A component carrier with an electrically insulating layer structure has opposed main surfaces, a through-hole, and an electrically conductive bridge structure connecting opposing sidewalls delimiting the through-hole. The sidewalls have a first tapering portion extending from a first main surface and a second tapering portion extending from a second main surface. A first demarcation surface faces the first main surface and a second demarcation surface faces the second main surface. A central bridge plane extends parallel to the first main surface and the second main surface and is at a vertical center between a lowermost point of the first demarcation surface and an uppermost point of the second demarcation surface. A first intersection point is between the central bridge plane and one of the sidewalls delimiting the through hole. A length of a shortest distance from the first intersection point to the first demarcation surface is at least 8 μm.

Embodiments of the disclosure relate to apparatuses for enhanced thermal management of an inductor assembly using functionally-graded thermal vias for heat flow control in the windings of the inductor. In one embodiment, a PCB for an inductor assembly includes a top surface and a bottom surface. Two or more electrically-conductive layers are embedded within the PCB and stacked vertically between the top surface and the bottom surface. The two or more electrically-conductive layers are electrically connected to form an inductor winding. A plurality of thermal vias thermally connects each of the two or more electrically-conductive layers to a cold plate thermally connected to the bottom surface. A number of thermal vias thermally connecting each electrically-conductive layer to the cold plate is directly proportional to a predetermined rate of heat dissipation from the electrically-conductive layer.

Various embodiments of the present disclosure relate to an electronic device which may include: a circuit board; at least one electronic component mounted on the upper surface of the circuit board; at least one connector mounted on the upper surface of the circuit board and electrically connected to the circuit board or the at least one electronic component; and a conductive frame which includes a side wall surrounding a space, in which the at least one electronic component and the at least one connector are disposed, and an extension part extending from one end of the side wall into the space.

Technologies directed to coupling structures for antenna feeds of phased array antennas are described. One circuit board includes a first layer with a first portion of a RF coupling structure, a second layer with a second portion of the RF coupling structure, and a first insulation layer located between the first layer and the second layer. The RF coupling structure is configured to electromagnetically couple a first conductive trace on the first layer and a second conductive trace on the second layer at RF frequencies. The circuit board also includes an RF shielding structure coupled to a ground connection on the second layer and located in the first insulation layer. The RF shielding structure is configured to operate as a RF short circuit between the ground connection and a third conductive trace on the first layer at RF frequencies.

A wiring substrate according to the present disclosure includes: an insulation layer disposed at an outermost layer; an electrode conductor disposed at a surface of the insulation layer with a seed layer being interposed therebetween; a nickel layer configured to cover at least one of the electrode conductors and include a contact portion that comes into contact with a surface of the seed layer; and a gold layer configured to cover the nickel layer. The nickel layer includes a plurality of gaps at the contact portion, at least a portion of the gaps includes an opening toward the contact portion, and a portion of the gold layer is disposed in at least a portion of the gaps.

A wiring board includes: first and second insulating layers; a first wiring conductor layer located between the first and second insulating layers and including a first via land; a second wiring conductor layer located on the second insulating layer and including a second via land; a via hole penetrating from the upper to lower surfaces of the second insulating layer; and a via conductor located in the via hole and electrically connecting the first second via lands. The via conductor is located on the inner surface of the via hole and on the first via land via a first base layer containing nichrome and a second base layer located on the upper surface of the first base layer and containing the same metal as the via conductor. An alloy layer containing tin and nichrome is located between the first via land and the first base layer.