A power adapter for powering portable electronic devices is disclosed. The modifications and enhancements to the power adapter can reduce or eliminate the need for adhesives, flexible circuitry, and/or wiring. The power adapter includes multiple guide rails used to guide a circuit board (carrying components) to electrical springs. The electrical springs provide not only an electrical coupling, but also a mechanical coupling. As a result, wiring and/or adhesives is not required. Additionally, a cap is secured to the enclosure through melting part of the cap by, for example, ultrasonic welding without causing damage to the circuit board, as welding location(s) is/are in locations away from the electrical springs and other sensitive components. The power adapter further includes a connector connected to the circuit board. During assembly, the circuit board can pivot in three dimensions during assembly to align the connector with the cap.

Systems, apparatuses and methods may provide for a memory module that includes a dynamic random access memory (DRAM), a first plurality of contact pads positioned along a first side of the DRAM, a first plurality of L-shaped contacts, wherein each of the first plurality of L-shaped contacts is soldered to one of the first plurality of contact pads, a second plurality of contact pads positioned along a second side of the DRAM, and a second plurality of L-shaped contacts, wherein each of the second plurality of L-shaped contacts is soldered to one of the second plurality of contact pads.

An adaptor assembly for an OCP 2.0 form factor card for installation in a server having a side slot to accommodate OCP 3.0 form factor cards is disclosed. The adaptor assembly has an adaptor board allowing the attachment of the OCP 2.0 form factor. The adaptor board includes a socket mateable with a connector on the OCP 2.0 form factor and an edge connector mateable with a socket on the server. The assembly includes an adaptor bracket attachable to the adaptor board. The adaptor bracket has a wall that covers the side slot of the server when the adaptor assembly is inserted through the side slot.

An LED flexible strip lamp has a strip lamp holder, a conductive flexible strip, an LED flexible strip and a lamp cap, the LED flexible strip includes a first bonding pad disposed at its end, the conductive flexible strip includes a flexible insulating sheet, a conductive metal foil, a second bonding pad; the lamp cap includes an internal connector, and the internal connector includes an elastic conductive member abutting against the conductive metal foil. a conductive member with the bonding pad is arranged to be welded to the LED flexible strip so as to be matched with the lamp holder in an inserted mode, automation can be achieved conveniently, and the problem that an original LED flexible strip lamp is low in production efficiency due to the fact that the lamp holder needs to be installed manually is solved.

A process of fabricating a circuit includes providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace, depositing a first solder bump on the at least one first conductive trace, applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between, bonding the first and second sheets of dielectric material to one another, and providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace.

A memory card includes a memory card body dimensioned to house at least one integrated circuit die package. The memory card body, in certain embodiments, includes a first surface spaced apart from a second surface and a plurality of side surfaces connecting the first surface to the second surface. The memory card also includes a contact pad disposed on at least one side surface of the plurality of side surfaces. The contact pad includes a first conductive layer, a second conductive layer, and an insulating layer disposed between the first conductive layer and the second conductive layer.

A communication system includes a circuit board assembly including a mating circuit board having a mating edge and a plurality of mating pads at the mating edge, the circuit board assembly having an electrical component electrically coupled to the mating circuit board. The communication system includes a cable receptacle connector removably coupled to the mating edge of the mating circuit board. The cable receptacle connector includes a connector housing having a connector cavity and a card slot. A cable extends from the connector housing. The cable receptacle connector includes signal contacts each having a mating end mated with the corresponding mating pads and a terminating end electrically connected to a cable conductor of the cable.

An electronic device which connects a circuit film to a display panel by applying a conductive material to the insides of holes formed in the circuit film, so as to improve reliability of bonding, and a display device using the same, are discussed.

A grid array connector system is provided that includes cables that are mounted on a board which has a chip packaged mounted thereon. The cables include conductors that are connected to support vias positioned in openings in the board and the conductors are connected to the support vias. The board can be connected to a second board which provides a stiffening ring. The board can be connected to the second board by deflectable terminals which are press-fit into the second board.

The present disclosure relates to optical systems and methods of their manufacture. An example system includes a printed circuit board assembly (PCBA) and an image sensor package coupled to the PCBA by way of a plurality of bond members. The system additionally includes a sensor holder coupled to the PCBA. The image sensor package and the sensor holder are coupled to the PCBA so as to minimize thermally-induced stresses in at least one of: the plurality of bond members, the PCBA, the sensor holder, or the image sensor package.