According to one embodiment, a flexible substrate includes a first protective member including a first surface, a line portion including a flexible insulating base located on the first surface and a wiring layer disposed on the insulating base and a second protective member covering the line portion, and the first protective member includes a valley portion and a peak portion in the first surface, and the line portion is formed in a wavy shape and located on the valley portion and the peak portion.

Methods and systems for fabricating 3D electronic devices, such as multielectrode arrays, including metalized, 3D printed structures using integrated 3D printing and photolithography techniques are disclosed. As one embodiment, a multielectrode array comprises a flexible substrate, a plurality of photopatterned electrical traces spaced apart and insulated from one another on the substrate, and a plurality of 3D printed electrodes. Each 3D printed electrode comprises a photopolymer coated in metal and has a 3D structure that extends outward from the substrate, and each 3D printed electrode is electrically connected to a corresponding electrical trace of the plurality of photopatterned electrical traces.

A metal circuit structure based on a flexible printed circuit (FPC) contains: a substrate, a first metal layer attached on the substrate, a second metal layer formed on the first metal layer, and an intermediate layer defined between the first metal layer and the second metal layer. A first surface of the intermediate layer is connected with the first metal layer, and a second surface of the intermediate layer is connected with the second metal layer. The intermediate layer is made of a first material, the second metal layer is made of a second material, and the first material of the intermediate layer does not act with the second material of the second metal layer.

A bus bar module includes a circuit body, a bus bar, a holder, and a cover configured to be assembled to the holder to protect the circuit body and the holder. The circuit body includes a belt-like main line that extends in a first direction, a belt-like branch line that extends from the main line so as to branch from the main line, and a connection portion provided in a position closer to a distal end of the branch line than a folded portion the branch line. The cover is structured so as to be stretchable and shrinkable in the first direction in accordance with a stretching and a shrinking of the holder in the first direction.

A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first buildup unit or at least one second buildup unit. The first buildup unit includes at least one first buildup body, the second buildup unit includes at least one second buildup body. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first and/or second buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.

Provided are a flexible flat cable and a method of producing the same. The flexible flat cable includes a plate-shaped first insulation portion comprising an insulating material; a first ground, a second ground, and a third ground disposed at predetermined intervals on the first insulation portion; at least one first signal transmission line positioned between the first ground and the second ground and disposed on the first insulation portion; at least one second signal transmission line positioned between the second ground and the third ground and disposed on the first insulation portion; a first second insulation portion disposed on at least a portion of the first ground and at least a portion of the at least one first signal transmission line and the second ground; a second second insulation portion disposed on at least a portion of the second ground and at least a portion of the at least one second signal transmission line, and the third ground; a conductive adhesive layer configured to enclose the first insulation portion, the first second insulation portion, and the second second insulation portion; and a shielding portion comprising a shielding material adhered to an outside of the conductive adhesive layer. Therefore, by improving shielding efficiency of a plurality of signal transmission lines, while having good electromagnetic interference and crosstalk characteristics, a plurality of signals can be simultaneously transmitted.

A flexible circuit structure includes: a flexible substrate having a surface; a plurality of first pads disposed on the surface; and an insulating layer disposed on the surface and between two adjacent first pads of the plurality of first pads, wherein the insulating layer has a first maximum height in a normal direction of the surface, one of the plurality of first pads has a second maximum height in the normal direction of the surface, and the first maximum height is less than or equal to the second maximum height.

A spectroscopic module includes a support body having a bottom wall portion and a side wall portion surrounding a space on one side of the bottom wall portion, a spectroscopic portion provided on the one side of the bottom wall portion and having a plurality of grating grooves, a photodetector attached to the side wall portion so as to face the spectroscopic portion via the space and having a plurality of photodetection channels, a plurality of first terminals provided on a surface of the support body on a side opposite to the space so as to be disposed along the surface of the support body and electrically connected to the photodetector, and a wiring unit having a plurality of second terminals respectively facing the plurality of first terminals and respectively joined to the plurality of first terminals and a plurality of third terminals respectively and electrically connected to the plurality of second terminals.

The present application discloses a display panel and a display device. The display panel includes a display substrate and a flexible circuit board, and further including: a chip disposed on the display substrate on a side of a display area; bonding pads disposed on the display substrate and located on at least one of left and right sides of the chip; and virtual bonding pads disposed on the display substrate on a side of the bonding pads.

An electronic apparatus includes: a hard substrate having a first surface with a first wiring layer terminal, a second surface positioned on a back side of the first surface, and an end surface having a second wiring layer terminal and being continuous with the first surface and the second surface; and a flexible substrate having a third surface with a third wiring layer terminal and opposing the first surface of the hard substrate, and a fourth surface having a fourth wiring layer terminal and positioned on a back side of the third surface. The first wiring layer terminal and the fourth wiring layer terminal are electrically connected by solder. The second wiring layer terminal and the third wiring layer terminal are electrically connected by solder.